The Global Silicon Photonics Market 2027-2037

The Global Silicon Photonics Market 2027–2037 is an in-depth analysis of the technology that has become the default optical platform of the AI data centre. It replaces the 2026–2036 edition with a new, internally consistent forecast that values silicon photonics at the first sale of the product: pluggable transceivers, co-packaged and near-packaged optical engines, optical I/O chiplets, optical circuit switches, sensors and photonic processors. The embedded PIC die and SOI wafer markets are reported separately, and all forecast data are supplied in a companion Excel workbook with unit, ASP and revenue detail. Forecasts are segmented by product type, application, interconnect architecture, data rate (400G to 12.8T), modulator platform and region. They are supported by unit shipments, ASPs and cost-per-bit trajectories, and by bear, base and bull scenarios.

Beyond the numbers, the report explains the forces reshaping the industry. These include the migration of optics from the front panel into the package through LPO/LRO, NPO, CPO and optical I/O; the race to 400G-per-lane modulation using silicon, thin-film lithium niobate, barium titanate, polymer and plasmonic materials; and the laser, packaging, test and foundry bottlenecks that now limit output. It assesses TSMC COUPE, GlobalFoundries SCALE, STMicroelectronics PIC100, Tower Semiconductor’s capacity build and Samsung’s entry, alongside the production CPO platforms from NVIDIA and Broadcom.

The report also documents the capital wave of 2024–2026. This covers 37 start-up funding rounds totalling about US$3.5 billion, NVIDIA’s strategic investments, government programmes, and acquisitions culminating in Marvell’s agreed US$115 billion merger with Lumentum. Dedicated chapters cover China’s parallel supply chain, including Hua Hong’s 2027 silicon photonics expansion and the rise of Innolight, Eoptolink and Huawei, and regional dynamics in North America, Taiwan, Japan, Korea and Europe.

The report concludes with 229 detailed company profiles spanning substrates, EDA, foundries, lasers, packaging and test, module makers, CPO and optical I/O start-ups, systems vendors, hyperscalers, and companies in LiDAR, biosensing, quantum and photonic computing. Each profile includes a fact panel, company description, technology and product analysis, 2025–2026 developments, funding history and a table of product families and target applications. With more than 300 tables, 23 figures and 521 pages, the report is an essential reference for semiconductor and optical component suppliers, foundries, hyperscalers, investors and strategists navigating the decade in which light replaces copper inside the AI data centre.

Report contents

• Ten-year market forecasts (2027–2037), with 2025–2026 baselines, by:
  • product type: pluggables, CPO/NPO engines, optical I/O, AOC/OCS and non-communications
  • application: AI and data-centre interconnect, telecom and DCI, LiDAR, biosensing, quantum and photonic computing
• region: North America, China, Asia-Pacific, Europe and Rest of World
• Unit shipments, ASPs and cost per Gb/s for 400G, 800G, 1.6T, 3.2T, 6.4T and 12.8T silicon photonics pluggables.
• CPO/NPO optical engine and optical I/O chiplet volumes, prices and revenues.
• Embedded markets: silicon PIC die value, photonics wafer starts, photonics-grade SOI substrate revenue and silicon photonics foundry revenue.
• Modulator platform analysis: silicon MZM/MRM, TFLN on silicon, BTO, EO polymers, plasmonics and III-V on silicon, with revenue share forecasts.
• Interconnect architecture analysis: copper, DSP pluggables, LPO/LRO, NPO, CPO and optical I/O, with bandwidth share forecasts.
• Technology fundamentals: waveguides, modulators, germanium photodetectors, couplers, lasers (CW, ELSFP, comb and multi-wavelength), and electronic-photonic integration.
• Packaging, integration and test: TSMC COUPE, GlobalFoundries SCALE, hybrid bonding, fiber attach, thermal management, serviceability and CPO cost structures.
• Production CPO platforms: NVIDIA Quantum-X and Spectrum-X Photonics, Broadcom Bailly and Davisson, and open-rack CPO.
• Standards and ecosystems: the OCP Open Silicon Photonics for AI Systems workstream, OIF CPO and ELSFP, UALink, NVLink Fusion and UCIe.
• Supply chain and capacity: foundry capacity expansions at TSMC, Tower, ST, GlobalFoundries, Samsung and Hua Hong; laser bottlenecks; module manufacturing; and a supply-chain risk matrix.
• Investment and M&A, Q3 2024 to Q3 2026: start-up funding rounds, valuations, NVIDIA strategic investments, Marvell–Lumentum, Marvell–Celestial AI, Credo–DustPhotonics, Molex–Teramount and government support.
• Regional analysis, including China’s domestic silicon photonics ecosystem.
• Bear, base and bull scenarios, a technology roadmap to 2037, key challenges, leading indicators and strategic recommendations.
• 229 company profiles including Accelink Technologies, Acon Optics Communications, Adeia, Advanced Fiber Resources (AFR), Advanced Micro Foundry (AMF), Advantest, AEPONYX, Aeva Technologies, AIM Photonics, AIO Core, Aixtron, Akhetonics, Alibaba Cloud, Amazon Web Services (AWS), AMD (Advanced Micro Devices), Amkor Technology, AMO GmbH, Analog Photonics, Anello Photonics, Ansys (Synopsys), Applied Materials, Applied Optoelectronics (AOI), Artilux, Aryballe, ASE Technology Holding, A*STAR (Institute of Microelectronics), Aurora Innovation, Avicena, Axalume, AXT Inc., Ayar Labs, Baidu, Bay Photonics, BE Epitaxy Semiconductor, Black Semiconductor, Brillink, Broadcom, Broadex Technologies, ByteDance, Cadence Design Systems, Cambridge Industries Group (CIG), CamGraPhIC, CanSemi Technology, CEA-Leti, Celestial AI (Marvell), Centera Photonics, Ciena, Cisco Systems, CNIT, Coherent Corp., CompoundTek, CORNERSTONE (University of Southampton), Corning, Crealights Technology, Credo Technology Group, CyberRidge, DenseLight Semiconductors, DustPhotonics (Credo), EFFECT Photonics, Eoptolink Technology, Ephos, Epiphany, EV Group (EVG), Fabrinet, Fast Photonics, FiberHome Telecommunication Technologies, Fibertop Technology, ficonTEC, FOCI Fiber Optic Communications, FormFactor, Foxconn (Hon Hai Precision Industry), Fujitsu, Genalyte, Gigalight, GlobalFoundries, Google (Alphabet), HGGenuine (Huagong Tech), Himax Technologies, Hisense Broadband, Hua Hong Semiconductor (Hua Hong Grace), Huawei Technologies, HyperLight, Hyperlume (Credo), HyperPhotonix, ICON Photonics, imec, InfiniLink, Infleqtion, Innolight (Zhongji Innolight), Innosemi, Inphotec, Intel, iPronics, IQE, Jabil, JCET Group, JFS Laboratory (Wuhan Optics Valley), JSR Corporation, Juniper Networks (HPE), Ki3 Photonics, LandMark Optoelectronics, LIGENTEC, Light Trace Photonics, Lightelligence, Lightium, Lightmatter, Lightspring, Lightsynq Technologies, Lightwave Logic, Liobate Technologies, LioniX International, LPKF Laser & Electronics, Luceda Photonics, Lumentum, Lumilens, Luminous Computing, LuminWave Technology, Lumiphase, Lumotive, Luxshare Precision, Luxtelligence, MACOM Technology Solutions, Marvell Technology, MediaTek, Mesh Optical Technologies, Meta Platforms and more.....