Fan-Out Wafer Level Packaging Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2031 - By Product, Technology, Grade, Application, End-user, Region:

Description

Cutting-edge Packaging Technology Drives Growth in Semiconductor Industry

The fan-out wafer level packaging (FOWLP) market is set to witness robust growth in the coming decade, according to a comprehensive report by Fairfield Market Research. The report indicates that the global FOWLP market, which reached US$ 2.7 billion in 20224, is estimated to be valued at US$ 9.0 billion by 2031. This represents a remarkable Compound Annual Growth Rate (CAGR) of 19.0% from 2024 to 2031.

Core Fan-Out Package Leads Revenue Generation

The core fan-out package emerges as the top revenue-generating category, with a projected CAGR of 17.8% through 2031. High-density fan-out packages are also anticipated to contribute significantly to market revenues during this period.

Driving Forces Behind Market Expansion

The surge in demand for FOWLP is attributed to its widespread applications across various sectors including CMOS image sensors, analog & hybrid integrated circuits, MEMS systems, and logic & memory integrated circuits. The trend towards miniaturization and increased efficiency in electronic devices, such as smartphones, smartwatches, and laptops, further propels market growth.

Advantages of FOWLP

FOWLP offers several advantages, including compact package formation, enhanced thermal and electrical performance, and the ability to integrate multiple components in a small package footprint. These benefits make it an attractive solution for meeting the demands of modern electronic devices.

Regional Outlook

Asia Pacific is poised to maintain its dominance in the FOWLP industry, with a projected valuation of US$ 4.20 billion by 2031. The region's growth is fueled by factors such as the popularity of miniaturization and the presence of leading semiconductor manufacturers in countries like China, South Korea, and Taiwan.

North America is also expected to witness substantial growth, driven by the increasing adoption of FOWLP in compact devices like smartphones.

Country-specific Insights

United States:

The United States fan-out wafer level packaging market is expected to see significant growth, with a notable CAGR between 2024 and 2031. This growth is attributed to increased utilization of fan-out wafer level packaging in various applications such as CMOS image sensors, MEMS, and hybrid integrated circuits. The market is further propelled by the trend of digitalization and miniaturization. Leading companies in the U.S., like SkyWater Technology, are leveraging strategic partnerships to enhance their offerings in this market segment.

United Kingdom:

In the United Kingdom, the fan-out wafer level packaging market is poised for substantial expansion, with a significant forecasted market size by 2031. The growth is driven by industries' preference for compact and efficient technologies and components. Additionally, the presence of prominent electronic packaging manufacturers, such as SPTS Technology Limited, contributes to market growth. With advancements in packaging schemes and increasing applications in sectors like AI and automotive, the UK market is anticipated to witness significant growth in the coming years.

China:

China continues to maintain its dominant position in the global fan-out wafer level packaging industry, with substantial growth projected between 2024 and 2031. The expansion is fueled by the rapid growth of industries such as semiconductor, automotive, and consumer electronics. FOWLP finds extensive use in semiconductor IC packaging for automotive applications like infotainment systems and advanced driver assistance systems. Moreover, China's strong presence of leading fan-out wafer level packaging companies and its focus on innovation contribute to the market's growth trajectory.

Most Lucrative Application

Among various applications, fan-out wafer level packaging in analog and hybrid integrated circuits is anticipated to witness the highest growth rate, driven by its application versatility and efficiency.

Competitive Analysis

Key players in the FOWLP industry include TSMC, ASE Technology Holding Co., JCET Group, Amkor Technology, and Infineon Technologies. These companies are actively involved in product innovation and strategic partnerships to enhance their market presence and revenue share.

The future of the semiconductor industry is shaped by advancements in packaging technology, and FOWLP stands at the forefront of innovation, catering to the demands of modern electronic devices.

Global Fan-Out Wafer Level Packaging Market Segmentation:

By Type:

High Density Fan-Out Package
Core Fan-Out Package

By Application:

CMOS Image Sensor
Wireless Connection
Logic and Memory Integrated Circuits
Mems and Sensors
Analog and Hybrid Integrated Circuits
Others

By Region:

North America
Europe
Asia Pacific
Latin America
Middle East & Africa

1. Executive Summary

1.1. Global Fan-Out Wafer Level Packaging Market Snapshot
1.2. Future Projections
1.3. Key Market Trends
1.4. Regional Snapshot, by Value, 2023
1.5. Analyst Recommendations

2. Market Overview

2.1. Market Definitions and Segmentations
2.2. Market Dynamics
- 2.2.1. Drivers
- 2.2.2. Restraints
- 2.2.3. Market Opportunities
2.3. Value Chain Analysis
2.4. Porter's Five Forces Analysis
2.5. COVID-19 Impact Analysis
- 2.5.1. Supply
- 2.5.2. Demand
2.6. Impact of Ukraine-Russia Conflict
2.7. Economic Overview
- 2.7.1. World Economic Projections
2.8. PESTLE Analysis

3. Global Fan-Out Wafer Level Packaging Market Outlook, 2018 - 2031

3.1. Global Fan-Out Wafer Level Packaging Market Outlook, by Type, Value (US$ Bn), 2018 - 2031
- 3.1.1. Key Highlights
  - 3.1.1.1. High Density Fan-Out Package
  - 3.1.1.2. Core Fan-Out Package
3.2. Global Fan-Out Wafer Level Packaging Market Outlook, by Application, Value (US$ Bn), 2018 - 2031
- 3.2.1. Key Highlights
  - 3.2.1.1. CMOS Image Sensor
  - 3.2.1.2. Wireless Connection
  - 3.2.1.3. Logic and Memory Integrated Circuits
  - 3.2.1.4. Mems and Sensors
  - 3.2.1.5. Analog and Hybrid Integrated Circuits
  - 3.2.1.6. Others
3.3. Global Fan-Out Wafer Level Packaging Market Outlook, by Region, Value (US$ Bn), 2018 - 2031
- 3.3.1. Key Highlights
  - 3.3.1.1. North America
  - 3.3.1.2. Europe
  - 3.3.1.3. Asia Pacific
  - 3.3.1.4. Latin America
  - 3.3.1.5. Middle East & Africa

4. North America Fan-Out Wafer Level Packaging Market Outlook, 2018 - 2031

4.1. North America Fan-Out Wafer Level Packaging Market Outlook, by Type, Value (US$ Bn), 2018 - 2031
- 4.1.1. Key Highlights
  - 4.1.1.1. High Density Fan-Out Package
  - 4.1.1.2. Core Fan-Out Package
4.2. North America Fan-Out Wafer Level Packaging Market Outlook, by Application, Value (US$ Bn), 2018 - 2031
- 4.2.1. Key Highlights
  - 4.2.1.1. CMOS Image Sensor
  - 4.2.1.2. Wireless Connection
  - 4.2.1.3. Logic and Memory Integrated Circuits
  - 4.2.1.4. Mems and Sensors
  - 4.2.1.5. Analog and Hybrid Integrated Circuits
  - 4.2.1.6. Others
4.3. North America Fan-Out Wafer Level Packaging Market Outlook, by Country, Value (US$ Bn), 2018 - 2031
- 4.3.1. Key Highlights
  - 4.3.1.1. U.S. Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 4.3.1.2. U.S. Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 4.3.1.3. Canada Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 4.3.1.4. Canada Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
- 4.3.2. BPS Analysis/Market Attractiveness Analysis

5. Europe Fan-Out Wafer Level Packaging Market Outlook, 2018 - 2031

5.1. Europe Fan-Out Wafer Level Packaging Market Outlook, by Type, Value (US$ Bn), 2018 - 2031
- 5.1.1. Key Highlights
  - 5.1.1.1. High Density Fan-Out Package
  - 5.1.1.2. Core Fan-Out Package
5.2. Europe Fan-Out Wafer Level Packaging Market Outlook, by Application, Value (US$ Bn), 2018 - 2031
- 5.2.1. Key Highlights
  - 5.2.1.1. CMOS Image Sensor
  - 5.2.1.2. Wireless Connection
  - 5.2.1.3. Logic and Memory Integrated Circuits
  - 5.2.1.4. Mems and Sensors
  - 5.2.1.5. Analog and Hybrid Integrated Circuits
  - 5.2.1.6. Others
- 5.2.2. BPS Analysis/Market Attractiveness Analysis
5.3. Europe Fan-Out Wafer Level Packaging Market Outlook, by Country, Value (US$ Bn), 2018 - 2031
- 5.3.1. Key Highlights
  - 5.3.1.1. Germany Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 5.3.1.2. Germany Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 5.3.1.3. U.K. Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 5.3.1.4. U.K. Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 5.3.1.5. France Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 5.3.1.6. France Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 5.3.1.7. Italy Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 5.3.1.8. Italy Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 5.3.1.9. Turkey Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 5.3.1.10. Turkey Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 5.3.1.11. Russia Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 5.3.1.12. Russia Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 5.3.1.13. Rest of Europe Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 5.3.1.14. Rest of Europe Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
- 5.3.2. BPS Analysis/Market Attractiveness Analysis

6. Asia Pacific Fan-Out Wafer Level Packaging Market Outlook, 2018 - 2031

6.1. Asia Pacific Fan-Out Wafer Level Packaging Market Outlook, by Type, Value (US$ Bn), 2018 - 2031
- 6.1.1. Key Highlights
  - 6.1.1.1. High Density Fan-Out Package
  - 6.1.1.2. Core Fan-Out Package
6.2. Asia Pacific Fan-Out Wafer Level Packaging Market Outlook, by Application, Value (US$ Bn), 2018 - 2031
- 6.2.1. Key Highlights
  - 6.2.1.1. CMOS Image Sensor
  - 6.2.1.2. Wireless Connection
  - 6.2.1.3. Logic and Memory Integrated Circuits
  - 6.2.1.4. Mems and Sensors
  - 6.2.1.5. Analog and Hybrid Integrated Circuits
  - 6.2.1.6. Others
- 6.2.2. BPS Analysis/Market Attractiveness Analysis
6.3. Asia Pacific Fan-Out Wafer Level Packaging Market Outlook, by Country, Value (US$ Bn), 2018 - 2031
- 6.3.1. Key Highlights
  - 6.3.1.1. China Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 6.3.1.2. China Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 6.3.1.3. Japan Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 6.3.1.4. Japan Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 6.3.1.5. South Korea Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 6.3.1.6. South Korea Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 6.3.1.7. India Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 6.3.1.8. India Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 6.3.1.9. Southeast Asia Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 6.3.1.10. Southeast Asia Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 6.3.1.11. Rest of Asia Pacific Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 6.3.1.12. Rest of Asia Pacific Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
- 6.3.2. BPS Analysis/Market Attractiveness Analysis

7. Latin America Fan-Out Wafer Level Packaging Market Outlook, 2018 - 2031

7.1. Latin America Fan-Out Wafer Level Packaging Market Outlook, by Type, Value (US$ Bn), 2018 - 2031
- 7.1.1. Key Highlights
  - 7.1.1.1. High Density Fan-Out Package
  - 7.1.1.2. Core Fan-Out Package
7.2. Latin America Fan-Out Wafer Level Packaging Market Outlook, by Application, Value (US$ Bn), 2018 - 2031
- 7.2.2. BPS Analysis/Market Attractiveness Analysis
7.3. Latin America Fan-Out Wafer Level Packaging Market Outlook, by Country, Value (US$ Bn), 2018 - 2031
- 7.3.1. Key Highlights
  - 7.3.1.1. Brazil Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 7.3.1.2. Brazil Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 7.3.1.3. Mexico Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 7.3.1.4. Mexico Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 7.3.1.5. Argentina Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 7.3.1.6. Argentina Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 7.3.1.7. Rest of Latin America Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 7.3.1.8. Rest of Latin America Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
- 7.3.2. BPS Analysis/Market Attractiveness Analysis

8. Middle East & Africa Fan-Out Wafer Level Packaging Market Outlook, 2018 - 2031

8.1. Middle East & Africa Fan-Out Wafer Level Packaging Market Outlook, by Type, Value (US$ Bn), 2018 - 2031
- 8.1.1. Key Highlights
  - 8.1.1.1. High Density Fan-Out Package
  - 8.1.1.2. Core Fan-Out Package
8.2. Middle East & Africa Fan-Out Wafer Level Packaging Market Outlook, by Application, Value (US$ Bn), 2018 - 2031
- 8.2.1. Key Highlights
  - 8.2.1.1. CMOS Image Sensor
  - 8.2.1.2. Wireless Connection
  - 8.2.1.3. Logic and Memory Integrated Circuits
  - 8.2.1.4. Mems and Sensors
  - 8.2.1.5. Analog and Hybrid Integrated Circuits
  - 8.2.1.6. Others
- 8.2.2. BPS Analysis/Market Attractiveness Analysis
8.3. Middle East & Africa Fan-Out Wafer Level Packaging Market Outlook, by Country, Value (US$ Bn), 2018 - 2031
- 8.3.1. Key Highlights
  - 8.3.1.1. GCC Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 8.3.1.2. GCC Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 8.3.1.3. South Africa Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 8.3.1.4. South Africa Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 8.3.1.5. Egypt Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 8.3.1.6. Egypt Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 8.3.1.7. Nigeria Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 8.3.1.8. Nigeria Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
  - 8.3.1.9. Rest of Middle East & Africa Fan-Out Wafer Level Packaging Market by Type, Value (US$ Bn), 2018 - 2031
  - 8.3.1.10. Rest of Middle East & Africa Fan-Out Wafer Level Packaging Market by Application, Value (US$ Bn), 2018 - 2031
- 8.3.2. BPS Analysis/Market Attractiveness Analysis

9. Competitive Landscape

9.1. Manufacturer vs by Application Heatmap
9.2. Company Market Share Analysis, 2023
9.3. Competitive Dashboard
9.4. Company Profiles
- 9.4.1. TSMC
  - 9.4.1.1. Company Overview
  - 9.4.1.2. Type Portfolio
  - 9.4.1.3. Financial Overview
  - 9.4.1.4. Business Strategies and Development
- 9.4.2. ASE Technology Holding Co.
  - 9.4.2.1. Company Overview
  - 9.4.2.2. Type Portfolio
  - 9.4.2.3. Financial Overview
  - 9.4.2.4. Business Strategies and Development
- 9.4.3. JCET Group
  - 9.4.3.1. Company Overview
  - 9.4.3.2. Type Portfolio
  - 9.4.3.3. Financial Overview
  - 9.4.3.4. Business Strategies and Development
- 9.4.4. Amkor Technology
  - 9.4.4.1. Company Overview
  - 9.4.4.2. Type Portfolio
  - 9.4.4.3. Financial Overview
  - 9.4.4.4. Business Strategies and Development
- 9.4.5. Nepes
  - 9.4.5.1. Company Overview
  - 9.4.5.2. Type Portfolio
  - 9.4.5.3. Financial Overview
  - 9.4.5.4. Business Strategies and Development
- 9.4.6. Infineon Technologies
  - 9.4.6.1. Company Overview
  - 9.4.6.2. Type Portfolio
  - 9.4.6.3. Financial Overview
  - 9.4.6.4. Business Strategies and Development
- 9.4.7. NXP Semiconductors NV
  - 9.4.7.1. Company Overview
  - 9.4.7.2. Type Portfolio
  - 9.4.7.3. Financial Overview
  - 9.4.7.4. Business Strategies and Development
- 9.4.8. Samsung Electro-Mechanics
  - 9.4.8.1. Company Overview
  - 9.4.8.2. Type Portfolio
  - 9.4.8.3. Financial Overview
  - 9.4.8.4. Business Strategies and Development
- 9.4.9. Powertech Technology Inc
  - 9.4.9.1. Company Overview
  - 9.4.9.2. Type Portfolio
  - 9.4.9.3. Financial Overview
  - 9.4.9.4. Business Strategies and Development
- 9.4.10. Taiwan Semiconductor Manufacturing Company
  - 9.4.10.1. Company Overview
  - 9.4.10.2. Type Portfolio
  - 9.4.10.3. Financial Overview
  - 9.4.10.4. Business Strategies and Development
- 9.4.11. Renesas Electronics Corporation
  - 9.4.11.1. Company Overview
  - 9.4.11.2. Type Portfolio
  - 9.4.11.3. Financial Overview
  - 9.4.11.4. Business Strategies and Development

10. Appendix

10.1. Research Methodology
10.2. Report Assumptions
10.3. Acronyms and Abbreviations