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PUBLISHER: Global Industry Analysts, Inc. | PRODUCT CODE: 1747741

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PUBLISHER: Global Industry Analysts, Inc. | PRODUCT CODE: 1747741

Semiconductor Polishing Pads

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Global Semiconductor Polishing Pads Market to Reach US$1.2 Billion by 2030

The global market for Semiconductor Polishing Pads estimated at US$851.6 Million in the year 2024, is expected to reach US$1.2 Billion by 2030, growing at a CAGR of 5.8% over the analysis period 2024-2030. Hard CMP Pads, one of the segments analyzed in the report, is expected to record a 6.7% CAGR and reach US$797.1 Million by the end of the analysis period. Growth in the Soft CMP Pads segment is estimated at 4.3% CAGR over the analysis period.

The U.S. Market is Estimated at US$223.9 Million While China is Forecast to Grow at 5.6% CAGR

The Semiconductor Polishing Pads market in the U.S. is estimated at US$223.9 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$191.0 Million by the year 2030 trailing a CAGR of 5.6% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 5.3% and 4.9% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 4.6% CAGR.

Global "Semiconductor Polishing Pads" Market - Key Trends & Drivers Summarized

Why Are Polishing Pads at the Heart of Advanced Chip Surface Finishing?

Semiconductor polishing pads are crucial consumables used in Chemical Mechanical Planarization (CMP), a process that ensures ultra-flat wafer surfaces before lithography and metal layer deposition. With rising demand for smaller, faster, and more powerful chips, the need for flawless wafer topography has never been greater. Polishing pads-typically made from polyurethane or composite materials-must balance surface uniformity, durability, and chemical compatibility across dozens of CMP steps per wafer. In logic, memory, and power semiconductors alike, even a few nanometers of surface deviation can degrade device performance. Pads must work in tandem with slurries and conditioners to remove excess material without scratching or contaminating the wafer. Their performance directly impacts die yield, line-width control, and planarization accuracy, making them indispensable across both FEOL and BEOL processes.

Are Multi-Zone and Specialty Pads Redefining Precision and Lifespan?

Polishing pads are evolving rapidly to meet the nuanced requirements of newer device architectures. Advanced CMP processes now use multi-zone or grooved pads that provide better slurry distribution, consistent removal rates, and superior endpoint detection. Micro-porous and nanostructured pad surfaces are being introduced to improve surface contact without generating defects. In 3D NAND and advanced interconnects, pads must handle deeper layers and varied materials like tungsten, copper, or dielectric composites. These applications require longer pad life and stable performance over high wafer counts. Additionally, pad design is being customized to suit single-wafer CMP tools and batch tools with different downforce profiles. As polishing becomes more selective and application-specific, the pad market is witnessing a shift toward high-performance, low-contamination, and process-optimized products.

Can Sustainability and Process Efficiency Drive the Next Wave of Pad Innovation?

Environmental considerations and total cost of ownership (TCO) pressures are pushing fabs to seek more sustainable and longer-lasting polishing pads. Vendors are developing pads that require less slurry and offer longer dressing intervals, reducing overall process costs. Recyclable pad materials and waste-reduction systems are also in development. Conditioning disks that prolong pad surface consistency without aggressive abrasion are becoming standard in fabs focused on cost savings and yield enhancement. Integrated pad monitoring systems-using RFID or optical scanning-allow fabs to track pad wear in real time and optimize usage cycles. These innovations not only reduce environmental impact but also lower operational interruptions caused by premature pad replacement. As fabs push for green manufacturing alongside better margins, polishing pad design is becoming a key lever in sustainable semiconductor fabrication.

What’s Driving Growth in the Global Semiconductor Polishing Pad Market?

The growth in the global semiconductor polishing pads market is driven by several factors including node shrinkage, 3D architectures, and higher wafer throughput. As chipmakers move to 3nm and beyond, planarization becomes more critical across logic, memory, and mixed-signal devices. The explosive growth of 3D NAND and advanced packaging technologies is increasing the number of CMP steps per wafer, amplifying demand for high-performance pads. Rapid fab expansions across China, South Korea, the U.S., and Taiwan are scaling up pad consumption volumes significantly. At the same time, increasing adoption of CMP in compound semiconductor and power IC production is expanding the market into new verticals. The growing emphasis on cost per wafer, process yield, and environmental compliance is driving fabs to favor pads that offer durability, compatibility with eco-slurries, and precise process control. Vendors with proven pad-slurry synergy and long-standing OEM relationships are particularly well-positioned for market leadership.

SCOPE OF STUDY:

The report analyzes the Semiconductor Polishing Pads market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Hard CMP Pads, Soft CMP Pads); Application (300M Wafer, 200Mm Wafer, Other Applications)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 32 Featured) -

  • 3M
  • AGC Inc.
  • Atotech
  • Cabot Microelectronics
  • DuPont
  • Entegris
  • Ferro Corporation
  • FNS TECH Co., Ltd.
  • Fujibo Holdings, Inc.
  • Fujimi Incorporated
  • Hubei Dinglong Co., Ltd.
  • Kuraray Co., Ltd.
  • Mipox Corporation
  • Nitta Haas Incorporated
  • Pureon
  • Rodel (a DuPont company)
  • Saniwave Technology Co., Ltd.
  • SK enpulse
  • Spartan Felt Company
  • Topco Scientific Co., Ltd.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

COMPLIMENTARY PREVIEW

Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.

Product Code: MCP35727

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • Semiconductor Polishing Pads - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Increased CMP Complexity in Advanced Nodes Drives Innovation in Pad Material Design
    • Growth in 3D NAND and FinFET Architectures Spurs Demand for High-Performance Polishing Pads
    • Rising Focus on Surface Defect Reduction Strengthens Business Case for Next-Gen Pads
    • Integration with Low-k and Ultra Low-k Materials Requires Customized Pad Properties
    • Advanced Packaging Trends Propel Demand for Planarization Pads in Wafer-Level Processing
    • Push for Cost-Effective Consumables Expands Market for Long-Life, Reconditionable Pads
    • Eco-Friendly and Low Particle Generation Pads Gain Traction Amid Regulatory Pressure
    • CMP Process Optimization in Smart Fabs Throws Spotlight on Pad-Wafer Interaction Models
    • Increase in CMP Tool Installations Worldwide Drives Volume Growth in Pad Consumption
    • Collaborative Development Between Pad and Slurry Vendors Enhances Process Synergies
    • Growing Use in MEMS and Sensor Wafer Fabrication Opens New Market Frontiers
    • R&D in Nanocomposite Pads Expands Performance Capabilities in Ultrafine Planarization
    • Global Supply Chain Diversification Creates New Opportunities for Regional Pad Manufacturers
    • AI and Machine Learning Integration in CMP Tools Spurs Demand for Predictable Pad Behavior
    • Emergence of Advanced Interconnect Materials Propels Innovation in Application-Specific Pads
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Semiconductor Polishing Pads Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Semiconductor Polishing Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for Semiconductor Polishing Pads by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Hard CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Hard CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for Hard CMP Pads by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Soft CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Soft CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for Soft CMP Pads by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for 300M Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for 300M Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for 300M Wafer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for 200Mm Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for 200Mm Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for 200Mm Wafer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 20: USA Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 21: USA Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 22: USA 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 23: USA Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 24: USA Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 25: USA 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 26: Canada Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 27: Canada Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 28: Canada 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 29: Canada Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 30: Canada Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 31: Canada 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • JAPAN
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 32: Japan Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Japan Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 34: Japan 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 35: Japan Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 36: Japan Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 37: Japan 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • CHINA
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 38: China Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 39: China Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 40: China 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 41: China Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 42: China Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 43: China 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • EUROPE
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 44: Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 45: Europe Historic Review for Semiconductor Polishing Pads by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 46: Europe 15-Year Perspective for Semiconductor Polishing Pads by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 47: Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 48: Europe Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 49: Europe 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 50: Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Europe Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 52: Europe 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • FRANCE
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 53: France Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 54: France Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 55: France 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 56: France Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: France Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 58: France 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • GERMANY
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 59: Germany Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Germany Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 61: Germany 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 62: Germany Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Germany Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 64: Germany 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 65: Italy Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Italy Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 67: Italy 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 68: Italy Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Italy Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 70: Italy 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 71: UK Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 72: UK Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 73: UK 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 74: UK Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: UK Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 76: UK 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 77: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 78: Rest of Europe Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 79: Rest of Europe 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 80: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Rest of Europe Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 82: Rest of Europe 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 83: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Asia-Pacific Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 85: Asia-Pacific 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 86: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Asia-Pacific Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 88: Asia-Pacific 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • REST OF WORLD
    • TABLE 89: Rest of World Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 90: Rest of World Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 91: Rest of World 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 92: Rest of World Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Rest of World Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 94: Rest of World 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030

IV. COMPETITION

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Jeroen Van Heghe

Manager - EMEA

+32-2-535-7543

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Christine Sirois

Manager - Americas

+1-860-674-8796

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