Picture
SEARCH
What are you looking for?
Need help finding what you are looking for? Contact Us
Compare
Free Samples
Semiconductor Manufacturing & EquipmentSemicon Fab

PUBLISHER: Global Industry Analysts, Inc. | PRODUCT CODE: 1794729

Cover Image

PUBLISHER: Global Industry Analysts, Inc. | PRODUCT CODE: 1794729

Semiconductor Manufacturing Back-End Equipment

PUBLISHED:
PAGES: 237 Pages
DELIVERY TIME: 1-2 business days
REQUEST FREE SAMPLE
REQUEST CUSTOMIZATION
SELECT AN OPTION
PDF (Single User License)
USD 5850
PDF (Global License to Company and its Fully-owned Subsidiaries)
USD 17550

Add to Cart

Description

Table of Contents

Global Semiconductor Manufacturing Back-End Equipment Market to Reach US$118.4 Billion by 2030

The global market for Semiconductor Manufacturing Back-End Equipment estimated at US$69.2 Billion in the year 2024, is expected to reach US$118.4 Billion by 2030, growing at a CAGR of 9.4% over the analysis period 2024-2030. Wafer Testing, one of the segments analyzed in the report, is expected to record a 11.4% CAGR and reach US$49.7 Billion by the end of the analysis period. Growth in the Dicing segment is estimated at 6.7% CAGR over the analysis period.

The U.S. Market is Estimated at US$18.2 Billion While China is Forecast to Grow at 8.9% CAGR

The Semiconductor Manufacturing Back-End Equipment market in the U.S. is estimated at US$18.2 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$18.7 Billion by the year 2030 trailing a CAGR of 8.9% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 8.8% and 7.7% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 7.3% CAGR.

Global Semiconductor Manufacturing Back-End Equipment Market - Key Trends & Drivers Summarized

Why Is Back-End Equipment Gaining Strategic Significance in Semiconductor Value Chains?

Semiconductor manufacturing is broadly divided into front-end and back-end processes. While front-end involves wafer fabrication and lithography, back-end encompasses wafer testing, dicing, die attach, wire bonding, flip chip, encapsulation, and final testing before packaging and shipping. The back-end segment has gained strategic prominence in recent years as chip complexity increases with system-in-package (SiP), 2.5D/3D packaging, and heterogeneous integration. These packaging innovations place greater demands on precision, cleanliness, and interconnect integrity, raising the bar for back-end equipment performance.

Back-end processes have also become critical in determining chip performance, form factor, and thermal behavior. For example, advanced packaging technologies such as fan-out wafer-level packaging (FOWLP), chiplets, and embedded die require highly specialized assembly and inspection tools. The ability to support complex interconnect architectures and maintain process consistency across high-volume manufacturing environments has made back-end equipment central to semiconductor cost-efficiency and innovation. As device manufacturers race to shrink footprints and boost functionality, capital investments in back-end equipment are rising to ensure time-to-market and yield advantages.

How Are Technological Advancements Reshaping Back-End Manufacturing Toolsets?

The evolution of semiconductor packaging is closely tied to breakthroughs in back-end manufacturing tools. Dicing equipment is now expected to deliver ultra-clean, high-speed separation with minimal damage for ultra-thin wafers. Plasma dicing and stealth laser dicing have emerged as alternatives to traditional mechanical methods, minimizing chipping and contamination. Advanced bonding tools, such as thermocompression bonders and hybrid bonders, are crucial for high-density interconnects and chiplet-based packages, particularly in high-performance computing (HPC), AI, and advanced memory applications.

Wire bonding continues to be relevant in legacy and cost-sensitive applications, but die attach and flip chip technologies are dominating in high-end segments. Equipment manufacturers are focusing on die placement accuracy, throughput, and material compatibility to support new assembly architectures. Meanwhile, encapsulation tools are incorporating molding underfill, wafer-level encapsulation, and conformal coatings to ensure mechanical integrity and thermal reliability. Automated optical inspection (AOI), X-ray inspection, and 3D metrology systems are increasingly integrated into back-end lines for real-time defect detection and adaptive control. As digital twins and AI-assisted defect analytics gain traction, the sophistication of back-end equipment will define future competitiveness in semiconductor assembly.

Which Applications and Regional Trends Are Driving Demand for Back-End Equipment?

Consumer electronics, smartphones, and computing hardware continue to be the largest end-users of back-end equipment, especially in SoC packaging and memory integration. However, demand is rapidly expanding into automotive, data centers, and IoT applications, where multi-chip integration, power efficiency, and reliability are paramount. Advanced driver-assistance systems (ADAS), EV power modules, and vehicle infotainment systems require sophisticated packaging and testing capabilities. The rise of 5G and edge AI devices is also pushing demand for compact, thermally managed multi-die packages.

Geographically, Taiwan, South Korea, and China dominate back-end equipment consumption due to their robust semiconductor manufacturing base. Taiwan’s OSAT (outsourced semiconductor assembly and test) industry, led by ASE Group, continues to scale high-density packaging, while South Korea focuses on memory packaging innovations by companies like Samsung and SK hynix. China, through state-led incentives and local fab construction, is scaling up domestic back-end capacity to reduce import dependency. The U.S., Japan, and Europe are investing in advanced packaging R&D, especially for defense, HPC, and photonics. Equipment manufacturers across Japan, Germany, and the U.S. are expanding offerings to meet emerging demand for hybrid bonding, fan-out, and AI-optimized assembly.

What Factors Are Fueling Growth in the Back-End Equipment Market?

The growth in the semiconductor back-end equipment market is driven by several factors, including the increasing complexity of packaging architectures, rising adoption of advanced packaging, and demand for high-performance, low-latency chips across applications. As front-end nodes approach physical and economic limits, more value is being extracted from innovative back-end packaging. This has created a strong pull for tools that enable 2.5D interposers, 3D IC stacking, and heterogeneous integration. The need to miniaturize devices while maximizing heat dissipation and data transfer is leading to capital expansion in OSATs and IDM packaging lines.

Additionally, the shift from monolithic chips to modular chiplet-based SoCs is creating demand for die-to-die bonding equipment, redistribution layer (RDL) processing, and high-throughput die sorting. Automotive and industrial use cases impose stringent quality, reliability, and traceability standards, prompting investment in inline inspection, analytics, and smart factory platforms. Government-backed programs supporting domestic chip production in the U.S., EU, and India are also translating into new demand for back-end toolsets. As semiconductor companies adopt more integrated design-manufacture-assembly workflows, the importance and investment in back-end equipment will continue to grow significantly.

SCOPE OF STUDY:

The report analyzes the Semiconductor Manufacturing Back-End Equipment market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Wafer Testing, Dicing, Bonding, Metrology, Assembly & Packaging); Dimension (2D Dimension, 2.5D Dimension, 3D Dimension); Supply Chain (Integrated Device Manufacturer Supply Chain, Consumer Electronic Supply Chain, Foundry Supply Chain)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 48 Featured) -

  • Advantest Corporation
  • Amkor Technology, Inc.
  • Applied Materials
  • ASM International N.V.
  • ASM Pacific Technology Ltd.
  • ASML Holding N.V.
  • BESI (BE Semiconductor)
  • Brooks Automation, Inc.
  • Cohu, Inc.
  • DISCO Corporation
  • Kulicke & Soffa Industries
  • KLA Corporation
  • Lam Research Corporation
  • MKS Instruments, Inc.
  • Nanometrics Incorporated
  • Onto Innovation Inc.
  • Rudolph Technologies (Onto)
  • Screen Holdings (SCREEN)
  • SPTS Technologies (KLA)
  • Teradyne, Inc.
  • Tokyo Electron Limited (TEL)

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

Show more
Product Code: MCP37997

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • Semiconductor Manufacturing Back-End Equipment - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Growth in Advanced Packaging Technologies Throws the Spotlight on Back-End Semiconductor Equipment Demand
    • Rising Adoption of Chiplet and 2.5D/3D Architectures Spurs Demand for Precision Die-Attach Tools
    • Proliferation of Heterogeneous Integration Techniques Expands Addressable Market for Advanced Bonding Systems
    • Miniaturization Trends in Consumer Electronics Propel Demand for Fine-Pitch Wire Bonders and Flip-Chip Bonders
    • Increased Outsourcing to OSAT Providers Strengthens Business Case for High-Volume Automated Back-End Lines
    • Emerging Use of Fan-Out Wafer-Level Packaging Drives Innovation in Mold and Singulation Technologies
    • Surging Automotive Semiconductor Demand Spurs Equipment Investments for High-Reliability Back-End Processing
    • Integration of AI and ML in Equipment Control Systems Enhances Throughput and Defect Detection Capabilities
    • Global Capacity Expansion Initiatives Accelerate Equipment Sales Across Emerging Foundry Hubs
    • Focus on Yield Optimization in Advanced Nodes Fuels Growth in Inspection and Metrology Equipment
    • Escalating Demand for Power Semiconductor Devices Drives Adoption of Back-End Equipment for Thick Wafers
    • Advancement in Low-K Dielectric and TSV Technologies Creates New Equipment Requirements
    • Shift Toward Green Manufacturing Practices Encourages Development of Eco-Efficient Equipment Solutions
    • Rise in Government Funding and Semiconductor Subsidies Globally Boosts Capital Equipment Procurement
    • Reliability Requirements in Aerospace and Defense Electronics Create Need for High-Precision Packaging Equipment
    • Integration of IoT in Equipment Monitoring Systems Strengthens Predictive Maintenance Capabilities
    • Convergence of Logic and Memory Packaging Trends Broadens Scope for Hybrid Equipment Tools
    • Increasing Design Complexity in AI and HPC Chips Spurs Demand for Multi-Layer Interconnect Assembly Systems
    • Trade Tensions and Localization Strategies Drive Regional Diversification in Equipment Supply Chains
    • Technological Convergence Between Front-End and Back-End Processes Spurs Cross-Segment Equipment Innovation
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Semiconductor Manufacturing Back-End Equipment Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Semiconductor Manufacturing Back-End Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 4: World 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Wafer Testing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Wafer Testing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 7: World 16-Year Perspective for Wafer Testing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Dicing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Dicing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 10: World 16-Year Perspective for Dicing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Bonding by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Bonding by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 13: World 16-Year Perspective for Bonding by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Metrology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Metrology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 16: World 16-Year Perspective for Metrology by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Assembly & Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Assembly & Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 19: World 16-Year Perspective for Assembly & Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Consumer Electronic Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Consumer Electronic Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 22: World 16-Year Perspective for Consumer Electronic Supply Chain by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Foundry Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Foundry Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 25: World 16-Year Perspective for Foundry Supply Chain by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for Integrated Device Manufacturer Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 27: World Historic Review for Integrated Device Manufacturer Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 28: World 16-Year Perspective for Integrated Device Manufacturer Supply Chain by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for 2D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 30: World Historic Review for 2D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 31: World 16-Year Perspective for 2D Dimension by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for 2.5D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 33: World Historic Review for 2.5D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 34: World 16-Year Perspective for 2.5D Dimension by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 35: World Recent Past, Current & Future Analysis for 3D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 36: World Historic Review for 3D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 37: World 16-Year Perspective for 3D Dimension by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 38: USA Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 40: USA 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 41: USA Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 42: USA Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 43: USA 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 44: USA Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: USA Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 46: USA 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • CANADA
    • TABLE 47: Canada Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 48: Canada Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 49: Canada 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 50: Canada Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Canada Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 52: Canada 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 53: Canada Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Canada Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 55: Canada 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • JAPAN
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 56: Japan Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Japan Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 58: Japan 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 59: Japan Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Japan Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 61: Japan 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 62: Japan Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Japan Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 64: Japan 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • CHINA
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 65: China Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 66: China Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 67: China 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 68: China Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: China Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 70: China 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 71: China Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 72: China Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 73: China 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • EUROPE
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 74: Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 75: Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 76: Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2025 & 2030
    • TABLE 77: Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 78: Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 79: Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 80: Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 82: Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 83: Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 85: Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • FRANCE
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 86: France Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: France Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 88: France 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 89: France Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 90: France Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 91: France 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 92: France Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: France Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 94: France 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • GERMANY
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 95: Germany Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Germany Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 97: Germany 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 98: Germany Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Germany Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 100: Germany 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 101: Germany Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 102: Germany Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 103: Germany 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • ITALY
    • TABLE 104: Italy Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Italy Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 106: Italy 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 107: Italy Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Italy Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 109: Italy 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 110: Italy Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Italy Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 112: Italy 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • UNITED KINGDOM
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 113: UK Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 114: UK Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 115: UK 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 116: UK Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 117: UK Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 118: UK 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 119: UK Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 120: UK Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 121: UK 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • REST OF EUROPE
    • TABLE 122: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 123: Rest of Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 124: Rest of Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 125: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 126: Rest of Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 127: Rest of Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 128: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Rest of Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 130: Rest of Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • ASIA-PACIFIC
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 131: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 132: Asia-Pacific Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 133: Asia-Pacific 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 134: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Asia-Pacific Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 136: Asia-Pacific 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 137: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Asia-Pacific Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 139: Asia-Pacific 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • REST OF WORLD
    • TABLE 140: Rest of World Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Rest of World Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 142: Rest of World 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 143: Rest of World Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Rest of World Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 145: Rest of World 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 146: Rest of World Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Rest of World Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 148: Rest of World 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030

IV. COMPETITION

Show more
Have a question?
Picture

Jeroen Van Heghe

Manager - EMEA

+32-2-535-7543

Picture

Christine Sirois

Manager - Americas

+1-860-674-8796

Questions? Please give us a call or visit the contact form.
Contact Us +1-866-353-3335
Hi, how can we help?
Contact us!