PUBLISHER: Global Industry Analysts, Inc. | PRODUCT CODE: 1799028
PUBLISHER: Global Industry Analysts, Inc. | PRODUCT CODE: 1799028
Global Semiconductor and Circuit Manufacturing Market to Reach US$66.9 Billion by 2030
The global market for Semiconductor and Circuit Manufacturing estimated at US$60.8 Billion in the year 2024, is expected to reach US$66.9 Billion by 2030, growing at a CAGR of 1.6% over the analysis period 2024-2030. Semiconductors, one of the segments analyzed in the report, is expected to record a 1.2% CAGR and reach US$41.3 Billion by the end of the analysis period. Growth in the Circuit Boards segment is estimated at 2.3% CAGR over the analysis period.
The U.S. Market is Estimated at US$16.6 Billion While China is Forecast to Grow at 3.0% CAGR
The Semiconductor and Circuit Manufacturing market in the U.S. is estimated at US$16.6 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$12.2 Billion by the year 2030 trailing a CAGR of 3.0% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 0.7% and 1.3% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 0.9% CAGR.
Global Semiconductor And Circuit Manufacturing Market - Key Trends & Drivers Summarized
How Are Next-Generation Architectures and Lithography Techniques Reshaping Chip Manufacturing?
Semiconductor and circuit manufacturing is entering a transformative era marked by shrinking transistor geometries, heterogeneous integration, and advanced packaging innovations. With the migration toward sub-5nm and even 3nm nodes, foundries are investing heavily in extreme ultraviolet (EUV) lithography to maintain Moore’s Law scaling. EUV enables finer patterning precision, essential for accommodating the increasing density of logic gates in modern microprocessors, GPUs, and AI accelerators. Leading-edge fabs operated by TSMC, Samsung, and Intel are deploying EUV in both front-end and back-end of line processes, significantly enhancing throughput, fidelity, and energy efficiency of chips.
Beyond lithography, innovations such as gate-all-around (GAA) FETs, nanosheet transistors, and chiplet-based system-on-package (SoP) designs are redefining semiconductor architectures. These advancements allow for improved performance-per-watt, signal integrity, and interconnect density. Simultaneously, 2.5D and 3D integration techniques-like through-silicon via (TSV) stacking and interposer-based assembly-are enabling multi-die systems that combine logic, memory, and analog circuits into compact, high-bandwidth configurations. Such approaches are essential for meeting the data-intensive demands of AI, edge computing, and next-gen communications, necessitating major upgrades in fabrication facilities, materials engineering, and metrology systems.
Why Are Governments and OEMs Prioritizing Localization and Supply Chain Resilience?
Geopolitical tensions, pandemic-induced disruptions, and unprecedented demand surges have exposed vulnerabilities in the global semiconductor supply chain, prompting a paradigm shift toward regional self-sufficiency and supply chain resilience. Nations such as the U.S., EU, India, South Korea, and Japan have launched multi-billion-dollar incentive programs, including the CHIPS Act (U.S.), European Chips Act, and Make in India electronics initiatives, to localize semiconductor manufacturing and reduce reliance on foreign fabs. These programs offer subsidies, tax breaks, and infrastructure support to attract foundries, material suppliers, and equipment vendors.
Simultaneously, integrated device manufacturers (IDMs) and fabless firms are entering strategic partnerships with foundries to secure wafer capacity, diversify supplier bases, and implement supply assurance contracts. Vertical integration is on the rise, with tech giants like Apple, Tesla, and Amazon designing custom chips in-house and outsourcing manufacturing under long-term agreements. Additionally, equipment makers and EDA tool providers are collaborating with foundries to enable faster process node migration, defect reduction, and predictive yield modeling. The result is a more regionally distributed, technologically robust, and vertically integrated semiconductor value chain.
What Role Are Emerging Materials and Automation Playing in Manufacturing Efficiency?
The drive toward advanced node manufacturing and complex chip architectures is intensifying the focus on materials innovation. High-mobility channel materials such as germanium, indium gallium arsenide (InGaAs), and transition metal dichalcogenides (TMDs) are being explored to replace or augment traditional silicon in high-speed and low-leakage transistors. Simultaneously, low-k and ultra-low-k dielectric materials, advanced photoresists, and cobalt or ruthenium-based interconnects are being adopted to improve signal transmission and reduce parasitic capacitance in dense layouts.
On the automation front, smart manufacturing powered by AI, digital twins, and predictive analytics is becoming standard across leading fabs. Advanced process control (APC), fault detection and classification (FDC), and equipment health monitoring systems are optimizing tool uptime, process uniformity, and yield rates. Collaborative robots (cobots), automated material handling systems (AMHS), and fab-wide Manufacturing Execution Systems (MES) are orchestrating wafer flows with minimal human intervention. These technologies not only boost productivity and cost-efficiency but also enhance cleanroom compliance and operational flexibility in high-mix, low-volume fabrication environments.
What Is Fueling the Global Expansion of Semiconductor Manufacturing Infrastructure?
The growth in the semiconductor and circuit manufacturing market is driven by several factors, including exploding demand for chips across AI, 5G, IoT, automotive, and data center verticals; rising strategic importance of semiconductor autonomy; and rapid advancements in process technology. The digital transformation of global economies has turned semiconductors into the foundational layer of everything from cloud computing and quantum systems to smart cities and autonomous mobility. As a result, both public and private sectors are channeling record investments into wafer fabs, R&D centers, and packaging facilities to meet long-term demand.
Wafer starts are increasing not only in cutting-edge nodes but also in mature nodes such as 28nm, 45nm, and 90nm, which are critical for analog, power management, and embedded control applications. Equipment suppliers for deposition, etching, ion implantation, metrology, and inspection are scaling operations to meet this capacity surge, supported by long-term order backlogs. Talent development, foundry diversification, and localized material sourcing are also receiving policy and corporate focus, ensuring supply chain redundancy.
With rising chip content in nearly every electronic system and sustained capital outlay from governments and private enterprises, semiconductor and circuit manufacturing is entering a golden decade of strategic growth, technological reinvention, and infrastructure proliferation on a truly global scale.
SCOPE OF STUDY:
The report analyzes the Semiconductor and Circuit Manufacturing market in terms of units by the following Segments, and Geographic Regions/Countries:
Segments:
Type (Semiconductors, Circuit Boards); Application (Consumer Electronics Application, Automotive Application)
Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.
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