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Market Research Report

Circuit Materials

Published by Global Industry Analysts, Inc. Product code 956811
Published Content info 481 Pages
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Circuit Materials
Published: September 1, 2020 Content info: 481 Pages
Description

Global Circuit Materials Market to Reach US$39.2 Billion by the Year 2027

Amid the COVID-19 crisis, the global market for Circuit Materials estimated at US$30.4 Billion in the year 2020, is projected to reach a revised size of US$39.2 Billion by 2027, growing at a CAGR of 3.7% over the analysis period 2020-2027.Fiberglass Epoxy, one of the segments analyzed in the report, is projected to grow at a 4.1% CAGR to reach US$14.6 Billion by the end of the analysis period.After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Paper-Phenolic segment is readjusted to a revised 3.6% CAGR for the next 7-year period. This segment currently accounts for a 20% share of the global Circuit Materials market.

The U.S. Accounts for Over 28.9% of Global Market Size in 2020, While China is Forecast to Grow at a 6.1% CAGR for the Period of 2020-2027

The Circuit Materials market in the U.S. is estimated at US$8.8 Billion in the year 2020. The country currently accounts for a 28.87% share in the global market. China, the world second largest economy, is forecast to reach an estimated market size of US$6.7 Billion in the year 2027 trailing a CAGR of 6.1% through 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 2.2% and 3% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 2.8% CAGR while Rest of European market (as defined in the study) will reach US$6.7 Billion by the year 2027.

CEM Segment Corners a 19% Share in 2020

In the global CEM segment, USA, Canada, Japan, China and Europe will drive the 3.6% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$4.4 Billion in the year 2020 will reach a projected size of US$5.6 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$5.2 Billion by the year 2027, while Latin America will expand at a 4.1% CAGR through the analysis period. We bring years of research experience to this 7th edition of our report. The 481-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.

Competitors identified in this market include, among others,

  • Arlon Electronic Materials Division
  • Chang Chun Group
  • D. D. Enterprises
  • Doosan Corporation Electro-Materials
  • DowDuPont, Inc.
  • Eternal Materials Co., Ltd.
  • International Laminate Material Ltd.
  • Isola Group
  • Iteq Corporation
  • Kingboard Laminates Holdings Ltd.
  • Mitsubishi Materials Corporation
  • Nam Hing Industrial Laminate Ltd.
  • Nikkan Industries Co., Ltd.
  • Nikko-Materials Co., Ltd.
  • Panasonic Corporation
  • Park Electrochemical Corporation
  • Rogers Corporation
  • Shanghai Nanya Copper Clad Laminate Co., Ltd.
  • Shengyi Technology Co., Ltd.
  • Taconic Biosciences, Inc.
  • TAIFLEX Scientific Co., Ltd.
  • Tamura Corporation
  • Tongling Huake Electronic Material Co., Ltd.
  • Ventec International Group
Table of Contents
Product Code: MCP11030

TABLE OF CONTENTS

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Impact of Covid-19 and a Looming Global Recession
    • Global Competitor Market Shares
    • Circuit Materials Competitor Market Share Scenario Worldwide (in %): 2018E
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Current & Future Analysis for Circuit Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 2: World Historic Review for Circuit Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 3: World 15-Year Perspective for Circuit Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2012, 2018 & 2027
    • TABLE 4: World Current & Future Analysis for Fiberglass Epoxy by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 5: World Historic Review for Fiberglass Epoxy by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 6: World 15-Year Perspective for Fiberglass Epoxy by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 7: World Current & Future Analysis for Paper-Phenolic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 8: World Historic Review for Paper-Phenolic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 9: World 15-Year Perspective for Paper-Phenolic by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 10: World Current & Future Analysis for CEM by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 11: World Historic Review for CEM by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 12: World 15-Year Perspective for CEM by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 13: World Current & Future Analysis for Polyimide by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 14: World Historic Review for Polyimide by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 15: World 15-Year Perspective for Polyimide by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 16: World Current & Future Analysis for Other Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 17: World Historic Review for Other Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 18: World 15-Year Perspective for Other Substrates by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 19: World Current & Future Analysis for Copper by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 20: World Historic Review for Copper by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 21: World 15-Year Perspective for Copper by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 22: World Current & Future Analysis for Other Conducting Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 23: World Historic Review for Other Conducting Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 24: World 15-Year Perspective for Other Conducting Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 25: World Current & Future Analysis for Liquid Ink Photoimageable Solder Mask by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 26: World Historic Review for Liquid Ink Photoimageable Solder Mask by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 27: World 15-Year Perspective for Liquid Ink Photoimageable Solder Mask by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 28: World Current & Future Analysis for Dry Film Photoimageable by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 29: World Historic Review for Dry Film Photoimageable by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 30: World 15-Year Perspective for Dry Film Photoimageable by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 31: World Current & Future Analysis for Other Outer Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 32: World Historic Review for Other Outer Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 33: World 15-Year Perspective for Other Outer Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 34: World Current & Future Analysis for Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 35: World Historic Review for Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 36: World 15-Year Perspective for Communications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 37: World Current & Future Analysis for Industrial Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 38: World Historic Review for Industrial Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 39: World 15-Year Perspective for Industrial Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 40: World Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 41: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 42: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 43: World Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 44: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 45: World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027
    • TABLE 46: World Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 47: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 48: World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2012, 2018 & 2027

III. MARKET ANALYSIS

  • GEOGRAPHIC MARKET ANALYSIS
  • UNITED STATES
    • Market Facts & Figures
    • US Circuit Materials Market Share (in %) by Company: 2018 & 2027
    • Market Analytics
    • TABLE 49: USA Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 50: USA Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 51: USA 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 52: USA Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 53: USA Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 54: USA 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 55: USA Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 56: USA Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 57: USA 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 58: USA Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 59: USA Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 60: USA 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • CANADA
    • TABLE 61: Canada Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 62: Canada Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 63: Canada 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 64: Canada Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 65: Canada Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 66: Canada 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 67: Canada Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 68: Canada Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 69: Canada 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 70: Canada Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 71: Canada Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 72: Canada 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • JAPAN
    • TABLE 73: Japan Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 74: Japan Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 75: Japan 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 76: Japan Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 77: Japan Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 78: Japan 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 79: Japan Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 80: Japan Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 81: Japan 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 82: Japan Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 83: Japan Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 84: Japan 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • CHINA
    • TABLE 85: China Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 86: China Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 87: China 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 88: China Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 89: China Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 90: China 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 91: China Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 92: China Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 93: China 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 94: China Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 95: China Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 96: China 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • EUROPE
    • Market Facts & Figures
    • European Circuit Materials Market: Competitor Market Share Scenario (in %) for 2018 & 2027
    • Market Analytics
    • TABLE 97: Europe Current & Future Analysis for Circuit Materials by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 98: Europe Historic Review for Circuit Materials by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 99: Europe 15-Year Perspective for Circuit Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2012, 2018 & 2027
    • TABLE 100: Europe Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 101: Europe Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 102: Europe 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 103: Europe Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 104: Europe Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 105: Europe 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 106: Europe Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 107: Europe Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 108: Europe 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 109: Europe Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 110: Europe Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 111: Europe 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • FRANCE
    • TABLE 112: France Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 113: France Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 114: France 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 115: France Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 116: France Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 117: France 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 118: France Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 119: France Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 120: France 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 121: France Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 122: France Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 123: France 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • GERMANY
    • TABLE 124: Germany Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 125: Germany Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 126: Germany 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 127: Germany Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 128: Germany Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 129: Germany 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 130: Germany Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 131: Germany Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 132: Germany 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 133: Germany Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 134: Germany Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 135: Germany 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • ITALY
    • TABLE 136: Italy Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 137: Italy Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 138: Italy 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 139: Italy Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 140: Italy Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 141: Italy 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 142: Italy Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 143: Italy Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 144: Italy 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 145: Italy Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 146: Italy Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 147: Italy 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • UNITED KINGDOM
    • TABLE 148: UK Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 149: UK Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 150: UK 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 151: UK Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 152: UK Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 153: UK 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 154: UK Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 155: UK Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 156: UK 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 157: UK Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 158: UK Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 159: UK 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • SPAIN
    • TABLE 160: Spain Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 161: Spain Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 162: Spain 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 163: Spain Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 164: Spain Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 165: Spain 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 166: Spain Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 167: Spain Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 168: Spain 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 169: Spain Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 170: Spain Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 171: Spain 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • RUSSIA
    • TABLE 172: Russia Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 173: Russia Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 174: Russia 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 175: Russia Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 176: Russia Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 177: Russia 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 178: Russia Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 179: Russia Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 180: Russia 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 181: Russia Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 182: Russia Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 183: Russia 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • REST OF EUROPE
    • TABLE 184: Rest of Europe Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 185: Rest of Europe Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 186: Rest of Europe 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 187: Rest of Europe Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 188: Rest of Europe Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 189: Rest of Europe 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 190: Rest of Europe Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 191: Rest of Europe Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 192: Rest of Europe 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 193: Rest of Europe Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 194: Rest of Europe Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 195: Rest of Europe 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • ASIA-PACIFIC
    • TABLE 196: Asia-Pacific Current & Future Analysis for Circuit Materials by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 197: Asia-Pacific Historic Review for Circuit Materials by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 198: Asia-Pacific 15-Year Perspective for Circuit Materials by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2012, 2018 & 2027
    • TABLE 199: Asia-Pacific Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 200: Asia-Pacific Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 201: Asia-Pacific 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 202: Asia-Pacific Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 203: Asia-Pacific Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 204: Asia-Pacific 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 205: Asia-Pacific Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 206: Asia-Pacific Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 207: Asia-Pacific 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 208: Asia-Pacific Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 209: Asia-Pacific Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 210: Asia-Pacific 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • AUSTRALIA
    • TABLE 211: Australia Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 212: Australia Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 213: Australia 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 214: Australia Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 215: Australia Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 216: Australia 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 217: Australia Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 218: Australia Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 219: Australia 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 220: Australia Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 221: Australia Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 222: Australia 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • INDIA
    • TABLE 223: India Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 224: India Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 225: India 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 226: India Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 227: India Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 228: India 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 229: India Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 230: India Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 231: India 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 232: India Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 233: India Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 234: India 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • SOUTH KOREA
    • TABLE 235: South Korea Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 236: South Korea Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 237: South Korea 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 238: South Korea Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 239: South Korea Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 240: South Korea 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 241: South Korea Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 242: South Korea Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 243: South Korea 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 244: South Korea Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 245: South Korea Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 246: South Korea 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • REST OF ASIA-PACIFIC
    • TABLE 247: Rest of Asia-Pacific Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 248: Rest of Asia-Pacific Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 249: Rest of Asia-Pacific 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 250: Rest of Asia-Pacific Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 251: Rest of Asia-Pacific Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 252: Rest of Asia-Pacific 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 253: Rest of Asia-Pacific Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 254: Rest of Asia-Pacific Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 255: Rest of Asia-Pacific 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 256: Rest of Asia-Pacific Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 257: Rest of Asia-Pacific Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 258: Rest of Asia-Pacific 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • LATIN AMERICA
    • TABLE 259: Latin America Current & Future Analysis for Circuit Materials by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 260: Latin America Historic Review for Circuit Materials by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 261: Latin America 15-Year Perspective for Circuit Materials by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2012, 2018 & 2027
    • TABLE 262: Latin America Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 263: Latin America Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 264: Latin America 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 265: Latin America Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 266: Latin America Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 267: Latin America 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 268: Latin America Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 269: Latin America Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 270: Latin America 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 271: Latin America Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 272: Latin America Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 273: Latin America 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • ARGENTINA
    • TABLE 274: Argentina Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 275: Argentina Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 276: Argentina 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 277: Argentina Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 278: Argentina Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 279: Argentina 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 280: Argentina Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 281: Argentina Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 282: Argentina 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 283: Argentina Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 284: Argentina Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 285: Argentina 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • BRAZIL
    • TABLE 286: Brazil Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 287: Brazil Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 288: Brazil 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 289: Brazil Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 290: Brazil Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 291: Brazil 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 292: Brazil Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 293: Brazil Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 294: Brazil 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 295: Brazil Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 296: Brazil Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 297: Brazil 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • MEXICO
    • TABLE 298: Mexico Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 299: Mexico Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 300: Mexico 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 301: Mexico Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 302: Mexico Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 303: Mexico 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 304: Mexico Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 305: Mexico Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 306: Mexico 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 307: Mexico Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 308: Mexico Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 309: Mexico 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • REST OF LATIN AMERICA
    • TABLE 310: Rest of Latin America Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 311: Rest of Latin America Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 312: Rest of Latin America 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 313: Rest of Latin America Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 314: Rest of Latin America Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 315: Rest of Latin America 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 316: Rest of Latin America Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 317: Rest of Latin America Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 318: Rest of Latin America 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 319: Rest of Latin America Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 320: Rest of Latin America Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 321: Rest of Latin America 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • MIDDLE EAST
    • TABLE 322: Middle East Current & Future Analysis for Circuit Materials by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2018 through 2027
    • TABLE 323: Middle East Historic Review for Circuit Materials by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 324: Middle East 15-Year Perspective for Circuit Materials by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2012, 2018 & 2027
    • TABLE 325: Middle East Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 326: Middle East Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 327: Middle East 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 328: Middle East Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 329: Middle East Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 330: Middle East 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 331: Middle East Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 332: Middle East Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 333: Middle East 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 334: Middle East Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 335: Middle East Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 336: Middle East 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • IRAN
    • TABLE 337: Iran Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 338: Iran Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 339: Iran 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 340: Iran Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 341: Iran Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 342: Iran 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 343: Iran Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 344: Iran Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 345: Iran 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 346: Iran Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 347: Iran Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 348: Iran 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • ISRAEL
    • TABLE 349: Israel Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 350: Israel Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 351: Israel 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 352: Israel Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 353: Israel Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 354: Israel 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 355: Israel Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 356: Israel Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 357: Israel 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 358: Israel Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 359: Israel Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 360: Israel 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • SAUDI ARABIA
    • TABLE 361: Saudi Arabia Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 362: Saudi Arabia Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 363: Saudi Arabia 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 364: Saudi Arabia Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 365: Saudi Arabia Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 366: Saudi Arabia 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 367: Saudi Arabia Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 368: Saudi Arabia Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 369: Saudi Arabia 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 370: Saudi Arabia Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 371: Saudi Arabia Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 372: Saudi Arabia 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • UNITED ARAB EMIRATES
    • TABLE 373: UAE Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 374: UAE Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 375: UAE 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 376: UAE Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 377: UAE Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 378: UAE 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 379: UAE Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 380: UAE Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 381: UAE 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 382: UAE Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 383: UAE Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 384: UAE 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • REST OF MIDDLE EAST
    • TABLE 385: Rest of Middle East Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 386: Rest of Middle East Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 387: Rest of Middle East 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 388: Rest of Middle East Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 389: Rest of Middle East Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 390: Rest of Middle East 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 391: Rest of Middle East Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 392: Rest of Middle East Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 393: Rest of Middle East 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 394: Rest of Middle East Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 395: Rest of Middle East Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 396: Rest of Middle East 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027
  • AFRICA
    • TABLE 397: Africa Current & Future Analysis for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 398: Africa Historic Review for Circuit Materials by Substrate - Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 399: Africa 15-Year Perspective for Circuit Materials by Substrate - Percentage Breakdown of Value Sales for Fiberglass Epoxy, Paper-Phenolic, CEM, Polyimide and Other Substrates for the Years 2012, 2018 & 2027
    • TABLE 400: Africa Current & Future Analysis for Circuit Materials by Conducting Material - Copper and Other Conducting Materials - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 401: Africa Historic Review for Circuit Materials by Conducting Material - Copper and Other Conducting Materials Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 402: Africa 15-Year Perspective for Circuit Materials by Conducting Material - Percentage Breakdown of Value Sales for Copper and Other Conducting Materials for the Years 2012, 2018 & 2027
    • TABLE 403: Africa Current & Future Analysis for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 404: Africa Historic Review for Circuit Materials by Outer Layer - Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 405: Africa 15-Year Perspective for Circuit Materials by Outer Layer - Percentage Breakdown of Value Sales for Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable and Other Outer Layers for the Years 2012, 2018 & 2027
    • TABLE 406: Africa Current & Future Analysis for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications - Independent Analysis of Annual Sales in US$ Billion for the Years 2018 through 2027
    • TABLE 407: Africa Historic Review for Circuit Materials by Application - Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications Markets - Independent Analysis of Annual Sales in US$ Billion for Years 2012 through 2017
    • TABLE 408: Africa 15-Year Perspective for Circuit Materials by Application - Percentage Breakdown of Value Sales for Communications, Industrial Electronics, Automotive, Aerospace & Defense and Other Applications for the Years 2012, 2018 & 2027

IV. COMPETITION

  • Total Companies Profiled: 48
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