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Semiconductor Manufacturing & Equipment

PUBLISHER: Global Industry Analysts, Inc. | PRODUCT CODE: 1280584

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PUBLISHER: Global Industry Analysts, Inc. | PRODUCT CODE: 1280584

3D IC and 2.5D IC Packaging

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Table of Contents

What`s New for 2023?

»Special coverage on Russia-Ukraine war; global inflation; easing of "zero-Covid" policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.

»Global competitiveness and key competitor percentage market shares

» Market presence across multiple geographies - Strong/Active/Niche/Trivial

»Online interactive peer-to-peer collaborative bespoke updates

»Access to our digital archives and MarketGlass Research Platform

»Complimentary updates for one year

Looking Ahead to 2023

The global economy is at a critical crossroads with a number of interlocking challenges and crises running in parallel. The uncertainty around how Russia`s war on Ukraine will play out this year and the war`s role in creating global instability means that the trouble on the inflation front is not over yet. Food and fuel inflation will remain a persistent economic problem. Higher retail inflation will impact consumer confidence and spending. As governments combat inflation by raising interest rates, new job creation will slowdown and impact economic activity and growth. Lower capital expenditure is in the offing as companies go slow on investments, held back by inflation worries and weaker demand. With slower growth and high inflation, developed markets seem primed to enter into a recession. Fears of new COVID outbreaks and China's already uncertain post-pandemic path poses a real risk of the world experiencing more acute supply chain pain and manufacturing disruptions this year. Volatile financial markets, growing trade tensions, stricter regulatory environment and pressure to mainstream climate change into economic decisions will compound the complexity of challenges faced. Year 2023 is expected to be tough year for most markets, investors and consumers. Nevertheless, there is always opportunity for businesses and their leaders who can chart a path forward with resilience and adaptability.

Global 3D IC and 2.5D IC Packaging Market to Reach $6.4 Billion by 2030

In the changed post COVID-19 business landscape, the global market for 3D IC and 2.5D IC Packaging estimated at US$3.3 Billion in the year 2022, is projected to reach a revised size of US$6.4 Billion by 2030, growing at a CAGR of 8.7% over the analysis period 2022-2030. 3D Wafer-level Chip-Scale Packaging, one of the segments analyzed in the report, is projected to record a 8.7% CAGR and reach US$2.8 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the 3D TSV segment is readjusted to a revised 9.4% CAGR for the next 8-year period.

The U.S. Market is Estimated at $955 Million, While China is Forecast to Grow at 8.2% CAGR

The 3D IC and 2.5D IC Packaging market in the U.S. is estimated at US$955 Million in the year 2022. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.1 Billion by the year 2030 trailing a CAGR of 8.2% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 7.8% and 7.2% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 6.7% CAGR.

Select Competitors (Total 13 Featured) -

  • Amkor Technology: ASE Group
  • Broadcom Ltd.
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Samsung Electronics Co., Ltd.
  • Stmicroelectronics Nv
  • Taiwan Semiconductor Manufacturing Company Limited
  • Toshiba Corp.
  • United Microelectronics Corp.
Show more
Product Code: MCP21006

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Impact of Covid-19 and a Looming Global Recession
    • Influencer Market Insights
    • World Market Trajectories
    • 3D IC and 2.5D IC Packaging - Global Key Competitors Percentage Market Share in 2022 (E)
    • 3D IC and 2.5D IC Packaging Competitor Market Share Scenario Worldwide (in %): 2018E
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World 3D IC and 2.5D IC Packaging Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 3: World Historic Review for 3D IC and 2.5D IC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 4: World 16-Year Perspective for 3D IC and 2.5D IC Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2023 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for 3D Wafer-level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 6: World Historic Review for 3D Wafer-level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 7: World 16-Year Perspective for 3D Wafer-level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for 3D TSV by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 9: World Historic Review for 3D TSV by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 10: World 16-Year Perspective for 3D TSV by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 12: World Historic Review for 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 13: World 16-Year Perspective for 2.5D by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Logic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Logic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 16: World 16-Year Perspective for Logic by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 19: World 16-Year Perspective for Imaging & Optoelectronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 22: World 16-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for MEMS / Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 24: World Historic Review for MEMS / Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 25: World 16-Year Perspective for MEMS / Sensors by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for LED by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 27: World Historic Review for LED by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 28: World 16-Year Perspective for LED by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 30: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 31: World 16-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 33: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 34: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 35: World Recent Past, Current & Future Analysis for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 36: World Historic Review for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 37: World 16-Year Perspective for Telecommunication by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 38: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 39: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 40: World 16-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 41: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 42: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 43: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 44: World Recent Past, Current & Future Analysis for Smart Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 45: World Historic Review for Smart Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 46: World 16-Year Perspective for Smart Technologies by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
    • TABLE 47: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 48: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 49: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Market Facts & Figures
    • US 3D IC and 2.5D IC Packaging Market Share (in %) by Company: 2018 & 2027
    • 3D Wafer-level Chip-Scale Packaging (Packaging Technology) Market Share Analysis (in %) of Leading Players in the US for 2018 & 2027
    • 3D TSV (Packaging Technology) Competitor Revenue Share (in %) in the US: 2018 & 2027
    • 2.5D (Packaging Technology) Market Share Breakdown (in %) of Major Players in the US: 2018 & 2027
    • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
    • Market Analytics
    • TABLE 50: USA Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 51: USA Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 52: USA 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2023 & 2030
    • TABLE 53: USA Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 54: USA Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 55: USA 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2023 & 2030
    • TABLE 56: USA Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 57: USA Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 58: USA 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2023 & 2030
  • CANADA
    • TABLE 59: Canada Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 60: Canada Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 61: Canada 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2023 & 2030
    • TABLE 62: Canada Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 63: Canada Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 64: Canada 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2023 & 2030
    • TABLE 65: Canada Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 66: Canada Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 67: Canada 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2023 & 2030
  • JAPAN
    • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
    • TABLE 68: Japan Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 69: Japan Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 70: Japan 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2023 & 2030
    • TABLE 71: Japan Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 72: Japan Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 73: Japan 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2023 & 2030
    • TABLE 74: Japan Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 75: Japan Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 76: Japan 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2023 & 2030
  • CHINA
    • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)
    • TABLE 77: China Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 78: China Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 79: China 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2023 & 2030
    • TABLE 80: China Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 81: China Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 82: China 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2023 & 2030
    • TABLE 83: China Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 84: China Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 85: China 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2023 & 2030
  • EUROPE
    • Market Facts & Figures
    • European 3D IC and 2.5D IC Packaging Market: Competitor Market Share Scenario (in %) for 2018 & 2027
    • 3D Wafer-level Chip-Scale Packaging (Packaging Technology) Market Share (in %) by Company in Europe: 2018 & 2027
    • 3D TSV (Packaging Technology) Market Share (in %) of Major Players in Europe: 2018 & 2027
    • 2.5D (Packaging Technology) Competitor Market Share Analysis (in %) in Europe: 2018 & 2027
    • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
    • Market Analytics
    • TABLE 86: Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 87: Europe Historic Review for 3D IC and 2.5D IC Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 88: Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2023 & 2030
    • TABLE 89: Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 90: Europe Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 91: Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2023 & 2030
    • TABLE 92: Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 93: Europe Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 94: Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2023 & 2030
    • TABLE 95: Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 96: Europe Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 97: Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2023 & 2030
  • FRANCE
    • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)
    • TABLE 98: France Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 99: France Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 100: France 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2023 & 2030
    • TABLE 101: France Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 102: France Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 103: France 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2023 & 2030
    • TABLE 104: France Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 105: France Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 106: France 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2023 & 2030
  • GERMANY
    • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
    • TABLE 107: Germany Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 108: Germany Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 109: Germany 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2023 & 2030
    • TABLE 110: Germany Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 111: Germany Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 112: Germany 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2023 & 2030
    • TABLE 113: Germany Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 114: Germany Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 115: Germany 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2023 & 2030
  • ITALY
    • TABLE 116: Italy Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 117: Italy Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 118: Italy 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2023 & 2030
    • TABLE 119: Italy Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 120: Italy Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 121: Italy 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2023 & 2030
    • TABLE 122: Italy Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 123: Italy Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 124: Italy 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2023 & 2030
  • UNITED KINGDOM
    • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)
    • TABLE 125: UK Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 126: UK Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 127: UK 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2023 & 2030
    • TABLE 128: UK Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 129: UK Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 130: UK 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2023 & 2030
    • TABLE 131: UK Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 132: UK Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 133: UK 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2023 & 2030
  • REST OF EUROPE
    • TABLE 134: Rest of Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 135: Rest of Europe Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 136: Rest of Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2023 & 2030
    • TABLE 137: Rest of Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 138: Rest of Europe Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 139: Rest of Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2023 & 2030
    • TABLE 140: Rest of Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 141: Rest of Europe Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 142: Rest of Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2023 & 2030
  • ASIA-PACIFIC
    • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
    • TABLE 143: Asia-Pacific Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 144: Asia-Pacific Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 145: Asia-Pacific 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2023 & 2030
    • TABLE 146: Asia-Pacific Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 147: Asia-Pacific Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 148: Asia-Pacific 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2023 & 2030
    • TABLE 149: Asia-Pacific Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 150: Asia-Pacific Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 151: Asia-Pacific 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2023 & 2030
  • REST OF WORLD
    • TABLE 152: Rest of World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 153: Rest of World Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 154: Rest of World 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2023 & 2030
    • TABLE 155: Rest of World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 156: Rest of World Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 157: Rest of World 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2023 & 2030
    • TABLE 158: Rest of World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 159: Rest of World Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
    • TABLE 160: Rest of World 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2023 & 2030

IV. COMPETITION

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