PUBLISHER: Grand View Research | PRODUCT CODE: 1790005
PUBLISHER: Grand View Research | PRODUCT CODE: 1790005
MicroLED Interconnect Market Summary
The global microLED interconnect market size was estimated at USD 142.7 million in 2024 and is projected to reach USD 722.0 million by 2033, growing at a CAGR of 18.8% from 2025 to 2033. The increasing demand for high-performance, low-power, and high-bandwidth data transfer solutions in various applications primarily drives the market growth.
This includes sectors like high-performance computing, AI, and data centers. The increasing adoption of chiplet-based architectures in AI and HPC systems is driving the need for high-density, low-latency, and energy-efficient interconnects. Traditional electrical interconnects, such as copper traces, struggle with signal integrity and power loss at scale. MicroLED-based optical interconnects offer a compelling alternative by enabling ultra-short-range optical communication between GPUs, memory modules, and computer chips. This demand is pushing rapid investment in chip-to-chip, GPU-to-GPU, and GPU-to-memory optical links, all of which require specialized microLED interconnect solutions to deliver high-speed, low-power performance at the package level.
AI training workloads, high-frequency trading, and simulation-based workloads in scientific computing increasingly require high-bandwidth (>50 Gbps) communication between processing elements. MicroLEDs, with their high modulation speeds and energy-efficient optical emissions, are emerging as a promising light source for short-reach optical links within boards and between tightly packed modules. Unlike traditional copper interconnects, which face signal degradation and thermal constraints at higher data rates and tighter geometries, microLEDs enable direct optical transmission at chip-to-chip and GPU-to-GPU levels, supporting latencies below one ns and energy consumption as low as a few fJ/bit under optimal conditions.
Recent R&D breakthroughs in microLED driver design, wafer bonding, and co-packaged optics have significantly enhanced the viability of µLEDs for high-speed interconnects. Researchers have demonstrated modulation speeds exceeding 10 GHz, and multi-wavelength µLED arrays are being integrated into optical interposers and co-packaged optical modules. These advances are translating into early-stage commercialization opportunities for interconnects in data centers, AI accelerators, and edge computing devices. As system architects shift toward ultra-dense, low-latency compute fabrics, microLED interconnects are emerging as a scalable solution for achieving terabit-level bandwidth within compact, power-constrained environments.
Global MicroLED Interconnect Market Report Segmentation
This report forecasts revenue growth at the global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the global microLED interconnect market report based on product type, data rate, distance, and region: