Intel Highlights Leading-Edge 18A Process, Upcoming Products, and New AI Strategy

Description

This IDC Market Perspective covers major announcements from Intel at ITT 2025 and OCP Global Summit 2025, including the Intel 18A manufacturing process technology, next-generation Panther Lake client CPUs, Clearwater Forest datacenter CPUs, and details on its new AI strategy and products. "Intel has been undergoing a significant period of re-engineering and transformation as it looks to regain market leadership in manufacturing and product performance," said Andrew Buss, senior research director, IDC. "If Intel can meet its objectives as outlined in major announcements during ITT 2025 and OCP Global Summit 2025, it will help customers to meet the performance, efficiency, and cost targets for next-generation PCs and digital infrastructures."

Product Code: EUR153906225

Executive Snapshot

New Market Developments and Dynamics

Intel x86 Working Group Alignment
Intel 18A Process Technology and Advanced Packaging Capabilities
RibbonFET Delivers the First New Transistor Architecture since FinFET
- PowerVia
- Advanced Packaging Enables Manufacturing Flexibility
Panther Lake Brings CPU Tile Manufacturing Back in House
- Advanced Platform Architecture and Packaging
- Combining Lunar Lake's Efficiency with Arrow Lake's Scale
- Scheduling and Power
- Xe3 Raises the Bar for Intel Tiled Graphics
- AI Engines: NPU 5 + Xe3 XMX + CPU VNNI for up to 180 TOPS
- IPU 7.5 on Panther Lake
- Wireless Connectivity on Panther Lake
- What Panther Lake Brings Over Lunar Lake and Arrow Lake
Xeon 6+ Provides a Significant Leap Forward in E-Core Server Performance
- Intel Xeon 6+ System of Chips Enabled by Advanced Packaging
- Darkmont-Based Efficient-Core Tiles
- Three Active Base Tiles with Cache and Memory Controllers
- Two Proven I/O Controllers
- Increased Reliability and Resilience with Lockstep Execution
A New AI and Datacenter GPU Strategy
- Zero-Friction Porting of Software and Models
- A Move to Annual Cadence for AI Solutions