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Market Research Report

LEDs: Market Analysis and Manufacturing Trends

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LEDs: Market Analysis and Manufacturing Trends
Published: May 1, 2018 Content info:
Description

The High Brightness Light Emitting Diode (HB LED) market is exploding as unit shipments continue their upward growth. LEDs are creating a niche market for conventional suppliers of semiconductor processing tools. Markets for HB LEDs, backlight LEDs, and OLEDs are forecast.

Table of Contents

Table of Contents

Chapter 1 - Introduction

Chapter 2 - Recent Progress in High Brightness LED Technology and Applications

  • 2.1. LED: Theory of Operation
  • 2.2. Intellectual Property Map
  • 2.3. LED Manufacturing Technologies & Costs
  • 2.4. LED Market General Illumination

Chapter 3 - Processing Equipment

  • 3.1. Introduction
  • 3.2. MOCVD for SSL - Productivity Challenges and Solutions
  • 3.3. Low temperature Remote Plasma Chemical Vapor Deposition (RPCVD)
    • 3.3.1. RPCVD Process Advantages
  • 3.4. Defect Inspection and Testing
  • 3.5. Lithography
    • 3.5.1. Steppers
    • 3.5.2. Nanoimprint
    • 3.5.3. Nanopatterning of LED Wafers

Chapter 4 - Materials of Construction

  • 4.1. Introduction
  • 4.2. GaN-based LED for General Lighting
    • 4.2.1. Methods to Improve White LED Efficiency
    • 4.2.2. Time-to-Market for LED substrates
  • 4.3. LED Phosphor Manufacturing Issues
    • 4.3.1. Current LED Phosphor Manufacturing
    • 4.3.2. LED Phosphor Cost

Chapter 5 - Packaging and Assembly Issues for High Brightness LEDs

  • 5.1. Packaging for HB LEDs
    • 5.1.1. Bonding
    • 5.1.2. Die/Ball Bonding
    • 5.1.3. Scribing
  • 5.2. Wafer Level Packaging HB LEDs
  • 5.3. Thermal Issues
  • 5.4. Test and Inspection

Chapter 6 - National Programs As Innovation Drivers

  • 6.1. DOE Solid-State Lighting Manufacturing Initiative
  • 6.2. DOE Solid-State Lighting Program Mission and Goal
  • 6.3. Major National Research Programs Pertaining to LEDs
  • 6.4. Challenges Facing SSL Manufacturing
    • 6.4.1. Inconsistent Color
    • 6.4.2. Low Light Output
    • 6.4.3. Challenges Facing Market Introduction

Chapter 7 - OLED Lighting

  • 7.1. Opportunities for Luminaire Manufacturers
  • 7.2. Critical Issues for Continued OLED Market Growth
  • 7.3. Manufacturing Options and Equipment Needs
  • 7.4. Availability of Critical Materials
  • 7.5. OLED Lighting Costs

Chapter 8 - OLED Manufacturing

  • 8.1. Deposition Equipment and Processes for OLED Lighting
  • 8.2. General OLED Manufacturing Cost Considerations
  • 8.3. Roll-to-Roll OLEDs
  • 8.4. Lithography
  • 8.5. Substrates and Encapsulation
    • 8.5.1. Substrate and Encapsulation Material Selection
    • 8.5.2. Substrate Coatings
    • 8.5.3. Transparent Electrodes
    • 8.5.4. Encapsulation
  • 8.6. Inspection and Quality Control

Chapter 9 - Outlook for the Worldwide OLED Market

  • 9.1. Introduction
  • 9.2. Passive Matrix Capacity and Demand
  • 9.3. Active Matrix Capacity and Demand
  • 9.4. Cost Challenges for OLED Lighting

Chapter 10 - Outlook for the Worldwide High-Brightness LED Market

  • 10.1. HB LED Technology
  • 10.2. HB LED Market Overview and trends
    • 10.2.1. Market Drivers for SSL
    • 10.2.2. LED Backlights for Notebook PCs
    • 10.2.3. LED Backlights for LCD TVs
    • 10.2.4. LED Backlights for Other Applications
    • 10.2.5. LED Lighting Market
    • 10.2.6. LED Active Outdoor Display Market
    • 10.2.7. LED Signal Market
    • 10.2.8. LED Automotive Market
    • 10.2.9. LED Mobile Market

List of Tables

  • 2.1: Color, Wavelength Material Of LED
  • 2.2: Light Source Comparison
  • 2.3: Comparison of LED, HB-LED, UHB-LED Characteristics
  • 3.1: Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap
  • 3.2: Process Control Metrics
  • 4.1: Production Method for Various LEDs
  • 4.2: LED Cost Model: Impact of Substrate Choice
  • 4.3: Comparison of $/klm for LED Made on Various 2" Substrates
  • 5.1: Properties Of Die Bonding Processes
  • 7.1: Comparison Of Lighting Technologies
  • 7.2: OLED Displays vs OLED lighting
  • 8.1: Manufacturing Roadmap for Sheet Processing of OLED Lighting Panels
  • 8.2: Manufacturing Roadmap for Web Processing of OLED Lighting Panels
  • 8.3: Projected Costs of OLED Lighting Panels (Sheet Processed) Stage
  • 8.4: Projected Costs of OLED Lighting Panels (Web Processed) Stage
  • 10.1: Forecast Of LED Backlights For Notebook PCs
  • 10.2: Forecast Of LED Backlights For LCD TVs
  • 10.3: Forecast Of LED Backlights For Other Application
  • 10.4: Forecast Of LED Lighting Market
  • 10.5: Forecast Of LED Active Outdoor Display Market
  • 10.6: Forecast Of LED Signal Market
  • 10.7: Forecast Of LED Automotive Market
  • 10.8: Forecast Of LED Mobile Market
  • 10.9: Top 10 LED Vendors

List of Figures

  • 2.1: Operation of LED
  • 2.2: Key Intellectual Property Relationships
  • 2.3: DOE Roadmap
  • 2.4: Relative Manufacturing Costs
  • 2.5: Pareto Analysis Of SSL Manufacturing Costs
  • 2.6: Market drivers for LED Biz and Applications
  • 2.7: SSL vs. Classical Technologies
  • 2.8: LED Performance vs. Traditional Light Sources
  • 2.9: Energy Production and Use Comparison
  • 2.10: White-LEDs for General Lighting Market estimates in $B to 2020
  • 2.11: Wafer Needs for General Lighting (2" wafer equivalents, million units to 2020)
  • 3.1: SSL - LED manufacturing with MOCVD: productivity and Cost Analysis
  • 3.2: Larger Wafer Size: GaN LEDs
  • 3.3: Global Shipments Of MOCVD Tools By Vendor
  • 3.4: Global Shipments Of MOCVD Tools By Region
  • 3.5: Diagram of RPCVD Reactor
  • 3.6: Comparison between MOCVD and RPCVD
  • 3.7: Nanoimprint Lithography System
  • 3.8: The Phlatlight Chip
  • 4.1: Regular LED (white) Front-End Steps
  • 4.2: Current Blocking Layer
  • 4.3: Regular LED (white) Production Costs for 100k wafers/year
  • 4.4: HB LED (white) Production Costs for 100k wafers/year
  • 4.5: Main Manufacturing Steps for GaN-based LED
  • 4.6: Regular LED (white) Back-End
  • 4.7: Methods to Improve White LED Efficiency
  • 4.8: Phosphor Coating - Four Approaches
  • 5.1: Hybrid Integration Approach to HD-LED Package
  • 5.2: Chain Wire Bond
  • 5.3: HB-LED with Silicon Carrier Submount
  • 5.4: Silicon interposer for MEMS / LED Applications
  • 5.5: High Brightness LED
  • 5.6: SMD Package Cost Structure
  • 5.7: Packaging Changes Result in Optical Improvements
  • 5.8: Substrate Solutions for HB/HP LEDs
  • 6.1: DOE Solid-State Lighting Program Strategy
  • 6.2: DOE Efficacy Targets
  • 6.3: Congressional Appropriations
  • 6.4: SSL R&D Project Funding
  • 6.5: Price Targets
  • 7.1: Status of Technology Towards Lighting Targets
  • 7.2: Maximizing Internal Quantum Efficiency
  • 7.3: Manufacturing Options
  • 7.4: Kodak VIST Deposition Source
  • 7.5: OLED Lighting Costs - VTE process
  • 7.6: OLED Lighting Costs: Glass Substrate
  • 8.1: Steps of OLED Production
  • 8.2: Industrial Coater Design Approaches
  • 8.3: Comparison Cluster vs. In-Line - Gen 2
  • 8.4: Comparison Cluster vs. In-Line - Gen 4/5
  • 8.5: Process Flow for OLED stack
  • 8.6: Comparison of Deposition Sources
  • 8.7: Roll-to-Roll OLED Fabrication
  • 9.1: Schematic of PMOLED
  • 9.2: PMOLED Stack/Driving Architecture
  • 9.3: Schematic of AMOLED
  • 9.4: Passive Matrix OLED Capacity and Demand
  • 9.5: Active Matrix OLED Capacity and Demand
  • 10.1: LED Market by Sector
  • 10.2: Worldwide LED Market Forecast
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