Market Research Report
Flip Chip/WLP Manufacturing and Market Analysis
|Published by||Information Network||Product code||42277|
Delivery time: 2-3 business days
|Flip Chip/WLP Manufacturing and Market Analysis|
|Published: November 1, 2019||Content info:||
Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today. WLP offers lower cost, a smaller package, higher performance and added functionality compared to older methods. In the world of high-speed/high-performance IC and package design, flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computing.
This report examines the market for flip chip ICs, and the lithography and wet etch tools used in their manufacture.