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Market Research Report

Applied Materials: Competitive Analysis of Served Markets

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Applied Materials: Competitive Analysis of Served Markets
Published: May 1, 2021 Content info:
Description

Applied Materials has achieved a dominant position in the semiconductor equipment market by focusing on a global presence, a broad and expanding product line, and exacting customer support -- a strategy initiated in the mid-80s. In the '90s, most of its competitors had recognized that to be competitive with Applied Materials, they too must duplicate these tactics.

AMAT competes against Lam Research and Tokyo Electron in deposition and etch, and against ASML and KLA in metrology/inspection. Also, as foundry/logic companies move from DUV, with multiple patterning steps, to EUV, deposition-etch steps are minimized, reducing the need for these process tools from AMAT, KLAC, and Tokyo Electron.

Semiconductor equipment players' revenues are highly sensitive to chipmakers' capex. They are exposed to foundry/logic players (Intel, TSMC, Samsung LSI) and the memory names (Micron, SK Hynix and Samsung).

Semiconductor equipment is required more in making leading-edge chips and computationally intense applications such as application processors, server chips and CPUs. The semiconductor equipment industry's revenue will be highly sensitive to a COVID-19 impact on demand for these types of chips.

After nearly 20 years as market leader in the semiconductor equipment front end market, Applied Materials lost its dominance in 2019 and but regained it in 2020.

This report discusses the current strategies of Applied Materials as it competes for world dominance. Strategies of its competitors are also analyzed. Markets are analyzed and projected, and market shares for Applied Materials and its competitors are detailed.

Table of Contents

Table of Contents

Chapter 1. Introduction

Chapter 2. Applied's Strategies

  • 2.1. Market Strategies
    • 2.1.1. Driving Demand for Processing Equipment
    • 2.1.2. A Global Presence
    • 2.1.3. Meeting Customer Needs
    • 2.1.4. New CEO's Strategy
  • 2.2. Business Strategies. 2.
    • 2.2.1. Silicon Systems Group
    • 2.2.2. Applied Global Services
    • 2.2.3. Display
    • 2.2.4. Energy and Environmental Solutions
  • 2.3. Technology Strategies
  • 2.4. Product Strategies
  • 2.5. Acquisition Strategies
  • 2.6. Legal Strategies
  • 2.7. Financial Analysis

Chapter 3. Market Forecast

  • 3.1. Market Drivers
    • 3.1.1. Semiconductor Market
    • 3.1.2. Technical Trends
    • 3.1.3. Economic Trends
  • 3.2. Applied Materials - Global Market Leader Until 2019
  • 3.3. Market Size and Market Shares
    • 3.3.1. Chemical Vapor Deposition
    • 3.3.2. Physical Vapor Deposition
    • 3.3.3. Dry Etch
    • 3.3.4. Rapid Thermal Processing/Oxidation/Diffusion
    • 3.3.5. Silicon Epitaxy
    • 3.3.6. Chemical Mechanical Planarization
    • 3.3.7. Metrology and Inspection
    • 3.3.8. Ion Implantation

Chapter 4. Competitive Environment

  • 4.1. Introduction
  • 4.2. Lam Research
    • 4.2.1. Strategies
    • 4.2.2. Products
    • 4.2.3. Financial Analysis
  • 4.3. Tokyo Electron Limited
    • 4.3.1. Strategies
    • 4.3.2. Products
    • 4.3.3. Financial Analysis
  • 4.4. KLA
    • 4.4.1. Strategies
    • 4.4.2. Products
    • 4.4.3. Financial Analysis
  • 4.5. ASM International
    • 4.5.1. Strategies
    • 4.5.2. Products
    • 4.5.3. Financial Analysis
  • 4.6. Axcelis
    • 4.6.1. Strategies
    • 4.6.2. Products
    • 4.6.3. Financial Analysis
  • 4.7. Canon Anelva
    • 4.7.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.7.2. Company Profile
    • 4.7.3. Company Financials
  • 4.8. Ebara
    • 4.8.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.8.2. Company Profile
    • 4.8.3. Company Financials
  • 4.9. Eugene Technology
    • 4.9.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.9.2. Company Profile
    • 4.9.3. Company Financials
  • 4.10. Hitachi High-Technologies
    • 4.10.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.10.2. Company Profile
    • 4.10.3. Company Financials
  • 4.11. Hitachi Kokusai Electric
    • 4.11.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.11.2. Company Profile
    • 4.11.3. Company Financials
  • 4.12. Jusung Engineering
    • 4.12.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.12.2. Company Profile
    • 4.12.3. Company Financials
  • 4.13. KC Tech
    • 4.13.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.13.2. Company Profile
    • 4.13.3. Company Financials
  • 4.14. Lasertec
    • 4.14.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.14.2. Company Profile
    • 4.14.3. Company Financials
  • 4.15. Nissin Ion Equipment
    • 4.15.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.15.2. Company Profile
    • 4.15.3. Company Financials
  • 4.16. NuFlare Technology
    • 4.16.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.16.2. Company Profile
    • 4.16.3. Company Financials
  • 4.17. Screen Semiconductor Solutions
    • 4.17.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.17.2. Company Profile
    • 4.17.3. Company Financials
  • 4.18. SEMES
    • 4.18.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.18.2. Company Profile
    • 4.18.3. Company Financials
  • 4.19. SEN
    • 4.19.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.19.2. Company Profile
    • 4.19.3. Company Financials
  • 4.20. TES
    • 4.20.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.20.2. Company Profile
    • 4.20.3. Company Financials
  • 4.21. Ulvac
    • 4.21.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.21.2. Company Profile
    • 4.21.3. Company Financials
  • 4.22. Wonik IPS
    • 4.22.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.22.2. Company Profile
    • 4.22.3. Company Financials

LIST OF TABLES

  • 3.1. Worldwide Capital Spending
  • 3.2. Wafer Front End (WFE) Market By Device Type
  • 3.3. Top Semiconductor Equipment Revenues
  • 3.4. Worldwide CVD Market Forecast
  • 3.5. Worldwide CVD Market Shares
  • 3.6. Worldwide PVD Market Forecast
  • 3.7. Worldwide PVD Market Shares
  • 3.8. Worldwide Dry Etch Market Forecast
  • 3.9. Worldwide Dry Etch Market Shares
  • 3.10. Worldwide RTP Market Forecast
  • 3.11. Worldwide RTP Market Shares
  • 3.12. Worldwide Silicon Epitaxy Market Forecast
  • 3.13. Worldwide Silicon Epitaxy Market Shares
  • 3.14. Worldwide CMP Market Forecast
  • 3.15. Worldwide CMP Market Shares
  • 3.16. Worldwide M&I Market Forecast
  • 3.17. Worldwide M&I Market Shares
  • 3.18. Worldwide Ion Implantation Market Forecast
  • 3.19. Worldwide Ion Implantation Market Shares

LIST OF FIGURES

  • 3.1. Semiconductor vs Equipment vs GDP
  • 3.2. Recession Cycle
  • 3.3. Semiconductor Equipment Share
  • 3.4. Worldwide CVD Market Shares
  • 3.5. Worldwide PVD Market Shares
  • 3.6. Worldwide Dry Etch Market Shares
  • 3.7. Worldwide RTP/Oxidation/Diffusion Market Shares
  • 3.8. Worldwide Silicon Epitaxy Market Shares
  • 3.9. Worldwide CMP Market Shares
  • 3.10. Worldwide M&I Market Shares
  • 3.11. Worldwide Ion Implantation Market Shares
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