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PUBLISHER: MIC - Market Intelligence & Consulting Institute | PRODUCT CODE: 1351494

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PUBLISHER: MIC - Market Intelligence & Consulting Institute | PRODUCT CODE: 1351494

Development of the China IC Packaging and Testing Industry and Key Players

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PAGES: 17 Pages
DELIVERY TIME: 1-2 business days
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According to statistics from the China Semiconductor Industry Association (CSIA), the sales revenue of China's semiconductor industry in 2022 amounted to 1.2 trillion RMB (US$171.4 billion; US$=7 RMB). Among them, the proportions of IC design industry, IC manufacturing industry, and IC packaging and testing industry in the total sales revenue were 43%, 32%, and 25%, respectively. The IC packaging and testing industry was one of the early semiconductor sub-industries to be developed in China. Before 2016, China's IC packaging and testing industry consistently held a leading position in the semiconductor industry. However, due to the rapid expansion of the IC design and wafer foundry industries, the proportion of the IC packaging and testing industry in China's semiconductor industry revenue has decreased. This report provides an overview of the development of the IC packaging and testing industry in China, focusing on aspects such as market size, changes in industry structure, and the dynamics of major players.

Product Code: SCRPT23071801

Table of Contents

1.Development of China IC Packaging and Testing Industry

  • 1.1 Market Size and Recent Changes in China's IC Packaging and Testing Industry
  • 1.2 Regional Distribution of IC Packaging and Testing Industry Players in China

2.Development of major IC Packaging and Testing Players in China

  • 2.1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies
  • 2.2 Recent Performance of the Top-3 Chinese IC Packaging and Testing Companies
    • 2.2.1 JCET
    • 2.2.2 Tongfu Microelectronics
    • 2.2.3 Huatian Technology

3.Outlook for the Industry

  • 3.1 Effects of National Integrated Circuit Industry Investment Fund
  • 3.2 Impact of US-China Conflict and Decoupling from China
  • 3.3 China Shifting Focus to Automotive Semiconductors Following Obstacles in Advanced Process Technology

Appendix

  • List of Companies

List of Tables

  • Table 1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies in 2022

List of Figures

  • Figure 1 Chinese IC Packaging and Testing Shipment Value, 2018-2022
  • Figure 2 Regional Distribution of IC Packaging and Testing Brands in China
  • Figure 3 Financial Information of JCET, 2018-2022
  • Figure 4 Revenue of JCET by Product Application, 2021-2022
  • Figure 5 Financial Information of Tongfu Microelectronics, 2018-2022
  • Figure 6 Financial Information of Huatian Technology, 2018-2022
Product Code: SCRPT23071801

Companies covered

AMD
Amkor
Ardentec Technology
ASE Group
ASEN Semiconductors
Bosch
Broadcom
China Wafer Level
Chipmore Technology
Chrysler
FlipChip International
Ford
Forehope Electronic
General Motors
Hana Microelectronics
Hua Hong Semiconductor
Huatian Technology
Infineon
Intel
JCET
Kore Semiconductor
KYEC
Lingsen Precision
Micron
Nepes
NXP
Onsemi
Payton Technology
Powertech Technology
Qorvo
Samsung
SFA
Sigurd Microelectronics
Siliconware
SJ Semiconductor
SK Hynix
Skyworks
SMIC
Sony
STATS ChipPAC
STMicro
Texas Instruments
Tongfu Electronics
Unimos Microelectronics
Unisem
Unitech Holdings
UTAC
Walton Advanced Engineering
Wise Road Capital
Xilinx
YTEC

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+1-860-674-8796

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