PUBLISHER: IMARC | PRODUCT CODE: 1467760
PUBLISHER: IMARC | PRODUCT CODE: 1467760
3D IC Market by Type, Component (Through-Silicon Via, Through Glass Via, Silicon Interposer), Application, End User, and Region 2024-2032
The global 3D IC market size reached US$ 17.0 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 84.7 Billion by 2032, exhibiting a growth rate (CAGR) of 18.96% during 2024-2032. The increasing purchase of various compact and advanced consumer electronic products with superior functionality, such as laptops, smartphones, and tablets, represents the prime factor driving the market.
Three-dimensional (3D) integrated circuit (IC) refers to an umbrella term representing a manufacturing technology that involves stacking or integrating different silicon die, chips and wafers together vertically. These materials are further combined into a single package wherein the device is connected via silicon vias (TSVs) and hybrid bonding procedures. It also encompasses 3D wafer-level chip-scale packaging (WLCSP), beam re-crystallization, solid phase crystallization, and wafer bonding as standard technologies used in the stacking process. As compared to two-dimensional (2D) IC, 3D IC offers higher speed, minimized footprint, and better functional density at the same reduced power in a similar smaller area. Apart from this, it provides higher bandwidth, flexibility, and heterogeneous integration, ensures faster signal transitions, and enables better electrical performances. As a result, 3D IC finds extensive applications as a key component in microelectronics, photonics, logic imaging, optoelectronics, and sensors.
3D IC Market Trends:
The widespread utilization of 3D IC across industries, such as aerospace, automotive and communications and telecom, represents one of the key factors driving the market growth. In line with this, the considerable expansion in the electronics industry on account of the increasing purchase of various compact and advanced consumer electronics products with superior functionality, such as laptops, smartphones, and tablets, is driving the market growth. Moreover, the rising need for advanced electronics architecture and integrated circuits with minimal power consumption properties, is contributing to the market growth. This is further supported by the emerging trend of incorporating ICs and using wafer-level packaging in miniaturized electronic devices, such as gaming consoles and sensors. Additionally, the extensive incorporation of 3D IC in smart home devices, including security locks, thermostats, fan controllers, smart smoke detectors, window sensors, and energy monitors, is favoring the market growth. They are further embedded in diverse healthcare devices, such as small hearing and visual aids and heart monitors. The escalating consumer awareness regarding the multiple product benefits, including better speed, memory, durability, efficiency, performance, and reduced timing delays, is propelling the market growth. Furthermore, the integration of the Internet of Things (IoT) and artificial intelligence (AI) solutions with wireless technologies and the advent of advanced IC packaging systems by manufacturers to improve product production is impelling the market growth. Other factors, such as the fueling need for high-bandwidth memory (HBM) and ongoing product diversification, are positively stimulating the market growth.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each segment of the global 3D IC market, along with forecasts at the global, regional, and country level from 2024-2032. Our report has categorized the market based on type, component, application and end user.
Type Insights:
Stacked 3D
Monolithic 3D
The report has also provided a detailed breakup and analysis of the 3D IC market based on the type. This includes stacked and monolithic 3D. According to the report, stacked 3D represented the largest segment.
Component Insights:
Through-Silicon Via (TSV)
Through Glass Via (TGV)
Silicon Interposer
A detailed breakup and analysis of the 3D IC market based on the component has also been provided in the report. This includes through-silicon via (TSV), through glass via (TGV) and silicon interposer. According to the report, through-silicon via (TSV) accounted for the largest market share.
Application Insights:
Logic
Imaging and Optoelectronics
Memory
MEMS/Sensors
LED
Others
The report has also provided a detailed breakup and analysis of the 3D IC market based on the application. This includes logic, imaging and optoelectronics, memory, MEMS/sensors, LED, and others. According to the report, MEMS/sensors represented the largest segment.
End User Insights:
Consumer Electronics
Telecommunication
Automotive
Military and Aerospace
Medical Devices
Industrial
Others
A detailed breakup and analysis of the 3D IC market based on the end user has also been provided in the report. This includes consumer electronics, telecommunication, automotive, military and aerospace, medical devices, industrial and others. According to the report, consumer electronics accounted for the largest market share.
Regional Insights:
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets that include North America (the United States and Canada), Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others), Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others), Latin America (Brazil, Mexico, and others), and the Middle East and Africa. According to the report, Asia Pacific was the largest market for 3D IC. Some of the factors driving the Asia Pacific 3D IC market included its rapid expansion in the electronics sector and the increasing purchase of compact consumer electronic products with superior functionality.
Competitive Landscape:
The report has also provided a comprehensive analysis of the competitive landscape in the global 3D IC market. Detailed profiles of all major companies have also been provided. Some of the companies covered include Advanced Micro Devices Inc., MonolithIC 3D Inc., etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.
Key Questions Answered in This Report:
- How has the global 3D IC market performed so far and how will it perform in the coming years?
- What are the drivers, restraints, and opportunities in the global 3D IC market?
- What are the key regional markets?
- Which countries represent the most attractive 3D IC markets?
- What is the breakup of the market based on the type?
- What is the breakup of the market based on the component?
- What is the breakup of the market based on the application?
- What is the breakup of the market based on the end user?
- What is the competitive structure of the global 3D IC market?
- Who are the key players/companies in the global 3D IC market?
Table of Contents
1 Preface
2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
- 4.1 Overview
- 4.2 Key Industry Trends
5 Global 3D IC Market
- 5.1 Market Overview
- 5.2 Market Performance
- 5.3 Impact of COVID-19
- 5.4 Market Forecast
6 Market Breakup by Type
- 6.1 Stacked 3D
- 6.1.1 Market Trends
- 6.1.2 Market Forecast
- 6.2 Monolithic 3D
- 6.2.1 Market Trends
- 6.2.2 Market Forecast
7 Market Breakup by Component
- 7.1 Through-Silicon Via (TSV)
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
- 7.2 Through Glass Via (TGV)
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
- 7.3 Silicon Interposer
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
8 Market Breakup by Application
- 8.1 Logic
- 8.1.1 Market Trends
- 8.1.2 Market Forecast
- 8.2 Imaging and Optoelectronics
- 8.2.1 Market Trends
- 8.2.2 Market Forecast
- 8.3 Memory
- 8.3.1 Market Trends
- 8.3.2 Market Forecast
- 8.4 MEMS/Sensors
- 8.4.1 Market Trends
- 8.4.2 Market Forecast
- 8.5 LED
- 8.5.1 Market Trends
- 8.5.2 Market Forecast
- 8.6 Others
- 8.6.1 Market Trends
- 8.6.2 Market Forecast
9 Market Breakup by End User
- 9.1 Consumer Electronics
- 9.1.1 Market Trends
- 9.1.2 Market Forecast
- 9.2 Telecommunication
- 9.2.1 Market Trends
- 9.2.2 Market Forecast
- 9.3 Automotive
- 9.3.1 Market Trends
- 9.3.2 Market Forecast
- 9.4 Military and Aerospace
- 9.4.1 Market Trends
- 9.4.2 Market Forecast
- 9.5 Medical Devices
- 9.5.1 Market Trends
- 9.5.2 Market Forecast
- 9.6 Industrial
- 9.6.1 Market Trends
- 9.6.2 Market Forecast
- 9.7 Others
- 9.7.1 Market Trends
- 9.7.2 Market Forecast
10 Market Breakup by Region
- 10.1 North America
- 10.1.1 United States
- 10.1.1.1 Market Trends
- 10.1.1.2 Market Forecast
- 10.1.2 Canada
- 10.1.2.1 Market Trends
- 10.1.2.2 Market Forecast
- 10.1.1 United States
- 10.2 Asia-Pacific
- 10.2.1 China
- 10.2.1.1 Market Trends
- 10.2.1.2 Market Forecast
- 10.2.2 Japan
- 10.2.2.1 Market Trends
- 10.2.2.2 Market Forecast
- 10.2.3 India
- 10.2.3.1 Market Trends
- 10.2.3.2 Market Forecast
- 10.2.4 South Korea
- 10.2.4.1 Market Trends
- 10.2.4.2 Market Forecast
- 10.2.5 Australia
- 10.2.5.1 Market Trends
- 10.2.5.2 Market Forecast
- 10.2.6 Indonesia
- 10.2.6.1 Market Trends
- 10.2.6.2 Market Forecast
- 10.2.7 Others
- 10.2.7.1 Market Trends
- 10.2.7.2 Market Forecast
- 10.2.1 China
- 10.3 Europe
- 10.3.1 Germany
- 10.3.1.1 Market Trends
- 10.3.1.2 Market Forecast
- 10.3.2 France
- 10.3.2.1 Market Trends
- 10.3.2.2 Market Forecast
- 10.3.3 United Kingdom
- 10.3.3.1 Market Trends
- 10.3.3.2 Market Forecast
- 10.3.4 Italy
- 10.3.4.1 Market Trends
- 10.3.4.2 Market Forecast
- 10.3.5 Spain
- 10.3.5.1 Market Trends
- 10.3.5.2 Market Forecast
- 10.3.6 Russia
- 10.3.6.1 Market Trends
- 10.3.6.2 Market Forecast
- 10.3.7 Others
- 10.3.7.1 Market Trends
- 10.3.7.2 Market Forecast
- 10.3.1 Germany
- 10.4 Latin America
- 10.4.1 Brazil
- 10.4.1.1 Market Trends
- 10.4.1.2 Market Forecast
- 10.4.2 Mexico
- 10.4.2.1 Market Trends
- 10.4.2.2 Market Forecast
- 10.4.3 Others
- 10.4.3.1 Market Trends
- 10.4.3.2 Market Forecast
- 10.4.1 Brazil
- 10.5 Middle East and Africa
- 10.5.1 Market Trends
- 10.5.2 Market Breakup by Country
- 10.5.3 Market Forecast
11 Drivers, Restraints, and Opportunities
- 11.1 Overview
- 11.2 Drivers
- 11.3 Restraints
- 11.4 Opportunities
12 Value Chain Analysis
13 Porters Five Forces Analysis
- 13.1 Overview
- 13.2 Bargaining Power of Buyers
- 13.3 Bargaining Power of Suppliers
- 13.4 Degree of Competition
- 13.5 Threat of New Entrants
- 13.6 Threat of Substitutes
14 Price Analysis
15 Competitive Landscape
- 15.1 Market Structure
- 15.2 Key Players
- 15.3 Profiles of Key Players
- 15.3.1 Advanced Micro Devices Inc.
- 15.3.1.1 Company Overview
- 15.3.1.2 Product Portfolio
- 15.3.1.3 SWOT Analysis
- 15.3.2 MonolithIC 3D Inc.
- 15.3.2.1 Company Overview
- 15.3.2.2 Product Portfolio
- 15.3.1 Advanced Micro Devices Inc.
Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report
List of Figures
- Figure 1: Global: 3D IC Market: Major Drivers and Challenges
- Figure 2: Global: 3D IC Market: Sales Value (in Billion US$), 2018-2023
- Figure 3: Global: 3D IC Market Forecast: Sales Value (in Billion US$), 2024-2032
- Figure 4: Global: 3D IC Market: Breakup by Type (in %), 2023
- Figure 5: Global: 3D IC Market: Breakup by Component (in %), 2023
- Figure 6: Global: 3D IC Market: Breakup by Application (in %), 2023
- Figure 7: Global: 3D IC Market: Breakup by End User (in %), 2023
- Figure 8: Global: 3D IC Market: Breakup by Region (in %), 2023
- Figure 9: Global: 3D IC (Stacked 3D) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 10: Global: 3D IC (Stacked 3D) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 11: Global: 3D IC (Monolithic 3D) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 12: Global: 3D IC (Monolithic 3D) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 13: Global: 3D IC (Through-Silicon Via (TSV)) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 14: Global: 3D IC (Through-Silicon Via (TSV)) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 15: Global: 3D IC (Through Glass Via (TGV)) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 16: Global: 3D IC (Through Glass Via (TGV)) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 17: Global: 3D IC (Silicon Interposer) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 18: Global: 3D IC (Silicon Interposer) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 19: Global: 3D IC (Logic) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 20: Global: 3D IC (Logic) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 21: Global: 3D IC (Imaging and Optoelectronics) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 22: Global: 3D IC (Imaging and Optoelectronics) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 23: Global: 3D IC (Memory) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 24: Global: 3D IC (Memory) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 25: Global: 3D IC (MEMS/Sensors) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 26: Global: 3D IC (MEMS/Sensors) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 27: Global: 3D IC (LED) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 28: Global: 3D IC (LED) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 29: Global: 3D IC (Other Applications) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 30: Global: 3D IC (Other Applications) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 31: Global: 3D IC (Consumer Electronics) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 32: Global: 3D IC (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 33: Global: 3D IC (Telecommunication) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 34: Global: 3D IC (Telecommunication) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 35: Global: 3D IC (Automotive) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 36: Global: 3D IC (Automotive) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 37: Global: 3D IC (Military and Aerospace) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 38: Global: 3D IC (Military and Aerospace) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 39: Global: 3D IC (Medical Devices) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 40: Global: 3D IC (Medical Devices) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 41: Global: 3D IC (Industrial) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 42: Global: 3D IC (Industrial) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 43: Global: 3D IC (Other End Users) Market: Sales Value (in Million US$), 2018 & 2023
- Figure 44: Global: 3D IC (Other End Users) Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 45: North America: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 46: North America: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 47: United States: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 48: United States: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 49: Canada: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 50: Canada: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 51: Asia-Pacific: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 52: Asia-Pacific: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 53: China: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 54: China: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 55: Japan: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 56: Japan: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 57: India: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 58: India: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 59: South Korea: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 60: South Korea: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 61: Australia: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 62: Australia: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 63: Indonesia: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 64: Indonesia: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 65: Others: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 66: Others: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 67: Europe: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 68: Europe: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 69: Germany: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 70: Germany: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 71: France: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 72: France: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 73: United Kingdom: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 74: United Kingdom: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 75: Italy: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 76: Italy: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 77: Spain: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 78: Spain: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 79: Russia: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 80: Russia: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 81: Others: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 82: Others: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 83: Latin America: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 84: Latin America: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 85: Brazil: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 86: Brazil: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 87: Mexico: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 88: Mexico: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 89: Others: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 90: Others: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 91: Middle East and Africa: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
- Figure 92: Middle East and Africa: 3D IC Market: Breakup by Country (in %), 2023
- Figure 93: Middle East and Africa: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
- Figure 94: Global: 3D IC Industry: Drivers, Restraints, and Opportunities
- Figure 95: Global: 3D IC Industry: Value Chain Analysis
- Figure 96: Global: 3D IC Industry: Porter's Five Forces Analysis
List of Tables
- Table 1: Global: 3D IC Market: Key Industry Highlights, 2023 and 2032
- Table 2: Global: 3D IC Market Forecast: Breakup by Type (in Million US$), 2024-2032
- Table 3: Global: 3D IC Market Forecast: Breakup by Component (in Million US$), 2024-2032
- Table 4: Global: 3D IC Market Forecast: Breakup by Application (in Million US$), 2024-2032
- Table 5: Global: 3D IC Market Forecast: Breakup by End User (in Million US$), 2024-2032
- Table 6: Global: 3D IC Market Forecast: Breakup by Region (in Million US$), 2024-2032
- Table 7: Global: 3D IC Market: Competitive Structure
- Table 8: Global: 3D IC Market: Key Player
