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PUBLISHER: IMARC | PRODUCT CODE: 1287485
PUBLISHER: IMARC | PRODUCT CODE: 1287485
Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028
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Market Overview:
The global wafer level packaging market size reached US$ 4.8 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 13.2 Billion by 2028, exhibiting a growth rate (CAGR) of 18.3% during 2023-2028.
The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs). It is used for devices, such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them. This offers various benefits, such as a reduction in the size of the wafer chips, streamlining of the manufacturing processes and improvements in chip functionalities. The ultrathin wafers also provide improved heat dissipation and performance, form factor reduction and minimal power consumption.
Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors. For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global wafer level packaging market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on packaging technology and end use industry.
Breakup by Packaging Technology:
- 3D TSV WLP
- 2.5D TSV WLP
- WLCSP
- Nano WLP
- Others
Breakup by End Use Industry:
- Aerospace and Defense
- Consumer Electronics
- IT & Telecommunication
- Healthcare
- Automotive
- Others
Breakup by Region:
- North America
- United States
- Canada
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Australia
- Indonesia
- Others
- Europe
- Germany
- France
- United Kingdom
- Italy
- Spain
- Russia
- Others
- Latin America
- Brazil
- Mexico
- Others
- Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation.
Key Questions Answered in This Report:
- How has the global wafer level packaging market performed so far and how will it perform in the coming years?
- What has been the impact of COVID-19 on the global wafer level packaging market?
- What are the key regional markets?
- What is the breakup of the market based on the packaging type?
- What is the breakup of the market based on the end use industry?
- What are the various stages in the value chain of the industry?
- What are the key driving factors and challenges in the industry?
- What is the structure of the global wafer level packaging market and who are the key players?
- What is the degree of competition in the industry?
Product Code: SR1623A186_Report
Table of Contents
1 Preface
2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
- 4.1 Overview
- 4.2 Key Industry Trends
5 Global Wafer Level Packaging Market
- 5.1 Market Overview
- 5.2 Market Performance
- 5.3 Impact of COVID-19
- 5.4 Market Forecast
6 Market Breakup by Packaging Technology
- 6.1 3D TSV WLP
- 6.1.1 Market Trends
- 6.1.2 Market Forecast
- 6.2 2.5D TSV WLP
- 6.2.1 Market Trends
- 6.2.2 Market Forecast
- 6.3 WLCSP
- 6.3.1 Market Trends
- 6.3.2 Market Forecast
- 6.4 Nano WLP
- 6.4.1 Market Trends
- 6.4.2 Market Forecast
- 6.5 Others
- 6.5.1 Market Trends
- 6.5.2 Market Forecast
7 Market Breakup by End Use Industry
- 7.1 Aerospace and Defense
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
- 7.2 Consumer Electronics
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
- 7.3 IT & Telecommunication
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
- 7.4 Healthcare
- 7.4.1 Market Trends
- 7.4.2 Market Forecast
- 7.5 Automotive
- 7.5.1 Market Trends
- 7.5.2 Market Forecast
- 7.6 Others
- 7.6.1 Market Trends
- 7.6.2 Market Forecast
8 Market Breakup by Region
- 8.1 North America
- 8.1.1 United States
- 8.1.1.1 Market Trends
- 8.1.1.2 Market Forecast
- 8.1.2 Canada
- 8.1.2.1 Market Trends
- 8.1.2.2 Market Forecast
- 8.1.1 United States
- 8.2 Asia-Pacific
- 8.2.1 China
- 8.2.1.1 Market Trends
- 8.2.1.2 Market Forecast
- 8.2.2 Japan
- 8.2.2.1 Market Trends
- 8.2.2.2 Market Forecast
- 8.2.3 India
- 8.2.3.1 Market Trends
- 8.2.3.2 Market Forecast
- 8.2.4 South Korea
- 8.2.4.1 Market Trends
- 8.2.4.2 Market Forecast
- 8.2.5 Australia
- 8.2.5.1 Market Trends
- 8.2.5.2 Market Forecast
- 8.2.6 Indonesia
- 8.2.6.1 Market Trends
- 8.2.6.2 Market Forecast
- 8.2.7 Others
- 8.2.7.1 Market Trends
- 8.2.7.2 Market Forecast
- 8.2.1 China
- 8.3 Europe
- 8.3.1 Germany
- 8.3.1.1 Market Trends
- 8.3.1.2 Market Forecast
- 8.3.2 France
- 8.3.2.1 Market Trends
- 8.3.2.2 Market Forecast
- 8.3.3 United Kingdom
- 8.3.3.1 Market Trends
- 8.3.3.2 Market Forecast
- 8.3.4 Italy
- 8.3.4.1 Market Trends
- 8.3.4.2 Market Forecast
- 8.3.5 Spain
- 8.3.5.1 Market Trends
- 8.3.5.2 Market Forecast
- 8.3.6 Russia
- 8.3.6.1 Market Trends
- 8.3.6.2 Market Forecast
- 8.3.7 Others
- 8.3.7.1 Market Trends
- 8.3.7.2 Market Forecast
- 8.3.1 Germany
- 8.4 Latin America
- 8.4.1 Brazil
- 8.4.1.1 Market Trends
- 8.4.1.2 Market Forecast
- 8.4.2 Mexico
- 8.4.2.1 Market Trends
- 8.4.2.2 Market Forecast
- 8.4.3 Others
- 8.4.3.1 Market Trends
- 8.4.3.2 Market Forecast
- 8.4.1 Brazil
- 8.5 Middle East and Africa
- 8.5.1 Market Trends
- 8.5.2 Market Breakup by Country
- 8.5.3 Market Forecast
9 SWOT Analysis
- 9.1 Overview
- 9.2 Strengths
- 9.3 Weaknesses
- 9.4 Opportunities
- 9.5 Threats
10 Value Chain Analysis
11 Porters Five Forces Analysis
- 11.1 Overview
- 11.2 Bargaining Power of Buyers
- 11.3 Bargaining Power of Suppliers
- 11.4 Degree of Competition
- 11.5 Threat of New Entrants
- 11.6 Threat of Substitutes
12 Price Analysis
13 Competitive Landscape
- 13.1 Market Structure
- 13.2 Key Players
- 13.3 Profiles of Key Players
- 13.3.1 Amkor Technology Inc.
- 13.3.1.1 Company Overview
- 13.3.1.2 Product Portfolio
- 13.3.1.3 Financials
- 13.3.1.4 SWOT Analysis
- 13.3.2 China Wafer Level CSP Co. Ltd.
- 13.3.2.1 Company Overview
- 13.3.2.2 Product Portfolio
- 13.3.2.3 SWOT Analysis
- 13.3.3 Chipbond Technology Corporation
- 13.3.3.1 Company Overview
- 13.3.3.2 Product Portfolio
- 13.3.3.3 SWOT Analysis
- 13.3.4 Deca Technologies Inc. (Infineon Technologies AG)
- 13.3.4.1 Company Overview
- 13.3.4.2 Product Portfolio
- 13.3.5 Fujitsu Limited
- 13.3.5.1 Company Overview
- 13.3.5.2 Product Portfolio
- 13.3.5.3 Financials
- 13.3.5.4 SWOT Analysis
- 13.3.6 IQE PLC
- 13.3.6.1 Company Overview
- 13.3.6.2 Product Portfolio
- 13.3.6.3 SWOT Analysis
- 13.3.7 JCET Group Co. Ltd.
- 13.3.7.1 Company Overview
- 13.3.7.2 Product Portfolio
- 13.3.7.3 SWOT Analysis
- 13.3.8 Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
- 13.3.8.1 Company Overview
- 13.3.8.2 Product Portfolio
- 13.3.8.3 Financials
- 13.3.9 Tokyo Electron Ltd.
- 13.3.9.1 Company Overview
- 13.3.9.2 Product Portfolio
- 13.3.9.3 Financials
- 13.3.9.4 SWOT Analysis
- 13.3.10 Toshiba Corporation
- 13.3.10.1 Company Overview
- 13.3.10.2 Product Portfolio
- 13.3.10.3 Financials
- 13.3.10.4 SWOT Analysis
- 13.3.1 Amkor Technology Inc.
Product Code: SR1623A186_Report
List of Figures
- Figure 1: Global: Wafer Level Packaging Market: Major Drivers and Challenges
- Figure 2: Global: Wafer Level Packaging Market: Sales Value (in Billion US$), 2017-2022
- Figure 3: Global: Wafer Level Packaging Market Forecast: Sales Value (in Billion US$), 2023-2028
- Figure 4: Global: Wafer Level Packaging Market: Breakup by Packaging Technology (in %), 2022
- Figure 5: Global: Wafer Level Packaging Market: Breakup by End Use Industry (in %), 2022
- Figure 6: Global: Wafer Level Packaging Market: Breakup by Region (in %), 2022
- Figure 7: Global: Wafer Level Packaging (3D TSV WLP) Market: Sales Value (in Million US$), 2017 & 2022
- Figure 8: Global: Wafer Level Packaging (3D TSV WLP) Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 9: Global: Wafer Level Packaging (2.5D TSV WLP) Market: Sales Value (in Million US$), 2017 & 2022
- Figure 10: Global: Wafer Level Packaging (2.5D TSV WLP) Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 11: Global: Wafer Level Packaging (WLCSP) Market: Sales Value (in Million US$), 2017 & 2022
- Figure 12: Global: Wafer Level Packaging (WLCSP) Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 13: Global: Wafer Level Packaging (Nano WLP) Market: Sales Value (in Million US$), 2017 & 2022
- Figure 14: Global: Wafer Level Packaging (Nano WLP) Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 15: Global: Wafer Level Packaging (Others) Market: Sales Value (in Million US$), 2017 & 2022
- Figure 16: Global: Wafer Level Packaging (Others) Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 17: Global: Wafer Level Packaging (Aerospace and Defense) Market: Sales Value (in Million US$), 2017 & 2022
- Figure 18: Global: Wafer Level Packaging (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 19: Global: Wafer Level Packaging (Consumer Electronics) Market: Sales Value (in Million US$), 2017 & 2022
- Figure 20: Global: Wafer Level Packaging (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 21: Global: Wafer Level Packaging (IT & Telecommunication) Market: Sales Value (in Million US$), 2017 & 2022
- Figure 22: Global: Wafer Level Packaging (IT & Telecommunication) Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 23: Global: Wafer Level Packaging (Healthcare) Market: Sales Value (in Million US$), 2017 & 2022
- Figure 24: Global: Wafer Level Packaging (Healthcare) Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 25: Global: Wafer Level Packaging (Automotive) Market: Sales Value (in Million US$), 2017 & 2022
- Figure 26: Global: Wafer Level Packaging (Automotive) Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 27: Global: Wafer Level Packaging (Others) Market: Sales Value (in Million US$), 2017 & 2022
- Figure 28: Global: Wafer Level Packaging (Others) Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 29: North America: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 30: United States: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 31: United States: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 32: Canada: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 33: Canada: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 34: North America: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 35: Asia-Pacific: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 36: China: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 37: China: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 38: Japan: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 39: Japan: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 40: India: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 41: India: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 42: South Korea: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 43: South Korea: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 44: Australia: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 45: Australia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 46: Indonesia: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 47: Indonesia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 48: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 49: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 50: Asia-Pacific: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 51: Europe: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 52: Germany: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 53: Germany: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 54: France: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 55: France: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 56: United Kingdom: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 57: United Kingdom: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 58: Italy: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 59: Italy: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 60: Spain: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 61: Spain: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 62: Russia: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 63: Russia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 64: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 65: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 66: Europe: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 67: Latin America: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 68: Brazil: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 69: Brazil: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 70: Mexico: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 71: Mexico: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 72: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 73: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 74: Latin America: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 75: Middle East and Africa: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
- Figure 76: Middle East and Africa: Wafer Level Packaging Market: Breakup by Country (in %), 2022
- Figure 77: Middle East and Africa: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
- Figure 78: Global: Wafer Level Packaging Industry: SWOT Analysis
- Figure 79: Global: Wafer Level Packaging Industry: Value Chain Analysis
- Figure 80: Global: Wafer Level Packaging Industry: Porter's Five Forces Analysis
List of Tables
- Table 1: Global: Wafer Level Packaging Market: Key Industry Highlights, 2022 and 2028
- Table 2: Global: Wafer Level Packaging Market Forecast: Breakup by Packaging Technology (in Million US$), 2023-2028
- Table 3: Global: Wafer Level Packaging Market Forecast: Breakup by End Use Industry (in Million US$), 2023-2028
- Table 4: Global: Wafer Level Packaging Market Forecast: Breakup by Region (in Million US$), 2023-2028
- Table 5: Global: Wafer Level Packaging Market: Competitive Structure
- Table 6: Global: Wafer Level Packaging Market: Key Players
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