PUBLISHER: IMARC | PRODUCT CODE: 1722911
PUBLISHER: IMARC | PRODUCT CODE: 1722911
The global copper foil market size was valued at USD 6.44 Billion in 2024. Looking forward, IMARC Group estimates the market to reach USD 10.8 Billion by 2033, exhibiting a CAGR of 5.9% during 2025-2033. Asia Pacific currently dominates the market, holding a significant market share of over 78.3% in 2024, driven by rapid industrialization, high demand for electronics, and advancements in electric vehicle production.
Copper foil is a thin sheet of copper with a thickness of a few microns made by electroplating or rolling the copper sheet. It is a versatile material that conducts electricity and heat. As a result, it is widely used in circuit boards, batteries, and solar energy appliances. Besides this, it is utilized in the printed circuit boards (PCBs) that are incorporated into telecommunications equipment, such as personal computers (PCs), mobile phones, current collectors of lithium-ion secondary batteries, and the electromagnetic wave shield material of plasma displays (PDPs).
The growing sales of electronic devices, such as smartphones, laptops, computers, and tabs across the globe, represent one of the key factors driving the market. Moreover, the improving 5G infrastructure due to the rising need for better connecting solutions is stimulating the growth of the market. In addition, there is a rise in the demand for electric vehicles (EVs) on account of the increasing greenhouse gas (GHG) emissions from internal combustion engine (ICE) vehicles and the growing environmental awareness among individuals. This, along with the increasing applications of copper foils in decorative materials, such as monasteries, gold signs, tile mosaic, and handicrafts, is offering lucrative growth opportunities to the end-users and investors. Besides this, the rising application of copper foils in transformers and grid-level energy storage around the world is positively influencing the market. Furthermore, key market players are increasing product differentiation by improving the surface properties of the copper foil, developing new surface treatment coatings, and achieving smaller thickness and weight for numerous applications. These players are also adopting strategies, such as mergers and acquisitions (M&A), to increase their overall sales and profitability.
The competitive landscape of the industry has also been examined along with the profiles of the key players being Carl Schlenk AG, Chang Chun Group, Furukawa Electric Co. Ltd., ILJIN Materials Co. Ltd., JX Nippon Mining & Metals Corporation (ENEOS Holdings Inc.), LS Mtron Co. Ltd., Mitsui Mining & Smelting Co. Ltd., Nippon Denkai Ltd., Rogers Corporation, SKC Co. Ltd., Sumitomo Metal Mining Co. Ltd., Targray Technology International Inc. and UACJ Corporation.