PUBLISHER: TechNavio | PRODUCT CODE: 1349901
PUBLISHER: TechNavio | PRODUCT CODE: 1349901
The data center cooling market in Southeast Asia is forecasted to grow by USD 531.36 mn during 2022-2027, accelerating at a CAGR of 6.78% during the forecast period. The report on the data center cooling market in Southeast Asia provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by the rising adoption of mini data centers, the growth of the data center market through government support, and the increasing number of data centers.
Technavio's data center cooling market in Southeast Asia is segmented as below:
Market Scope | |
---|---|
Base Year | 2022 |
End Year | 2027 |
Series Year | 2023-2027 |
Growth Momentum | Accelerate |
YOY 2023 | 6.08% |
CAGR | 6.78% |
Incremental Value | $531.36mn |
By Type
By Technology
By Component
By Geographical Landscape
This study identifies the increasing adoption of DCIM solutions as one of the prime reasons driving the data center cooling market in Southeast Asia growth during the next few years. Also, the rise in strategic alliances among vendors and the growing adoption of liquid immersion solutions in hyperscale data centers will lead to sizable demand in the market.
The report on the data center cooling market in Southeast Asia covers the following areas:
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading data center cooling market in Southeast Asia vendors that include 3M Co., AIRSYS Refrigeration Engineering Technology Co. Ltd., Alfa Laval AB, Alphabet Inc., Amazon.com Inc., Cisco Systems Inc., Daikin Industries Ltd., Dell Technologies Inc., Emerson Electric Co., Hewlett Packard Enterprise Co., Hitachi Ltd., Huawei Technologies Co. Ltd., International Business Machines Corp., Lenovo Group Ltd., Mitsubishi Electric Corp., Modine Manufacturing Co., NEC Corp., Nortek, Oracle Corp., Quanta Computer Inc., Schneider Electric SE, Vertiv Holdings Co., and Wiwynn Corp. Also, the data center cooling market in Southeast Asia analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Exhibits: