Global Embedded Systems Power Amplifier Market 2024-2028

Description

List of Tables

The embedded systems power amplifier market is forecasted to grow by USD 2.06 bn during 2023-2028, accelerating at a CAGR of 6.55% during the forecast period. The report on the embedded systems power amplifier market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increasing adoption of IoT, global rollout of 5G networks, and growing trend of industrial automation and smart manufacturing.

Technavio's embedded systems power amplifier market is segmented as below:

Market Scope
Base Year	2024
End Year	2028
Series Year	2024-2028
Growth Momentum	Accelerate
YOY 2024	5.85%
CAGR	6.55%
Incremental Value	$2.06bn

By Application

Consumer electronics
Wireless communication
Industrial

By Technology

CMOS
GaAs/GaN/SiGe

By Geographical Landscape

APAC
North America
Europe
South America
Middle East and Africa

This study identifies the increasing adoption of GaN technology in power amplifiers as one of the prime reasons driving the embedded systems power amplifier market growth during the next few years. Also, trend towards smaller and more compact embedded systems and increasing inclination towards software-defined systems will lead to sizable demand in the market.

The report on the embedded systems power amplifier market covers the following areas:

Embedded systems power amplifier market sizing
Embedded systems power amplifier market forecast
Embedded systems power amplifier market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading embedded systems power amplifier market vendors that include Amcom Communications Inc., Analog Devices Inc., Broadcom Inc., Ciao Wireless Inc., Infineon Technologies AG, Microchip Technology Inc., NuWaves RF Solutions, NXP Semiconductors NV, ON Semiconductor Corp., Qorvo Inc., RFHIC Corp., ROHM Co. Ltd., Silicon Laboratories Inc., Skyworks Solutions Inc., STMicroelectronics International NV, TE Connectivity Ltd., Renesas Electronics Corp., and Texas Instruments Inc.. Also, the embedded systems power amplifier market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.

Product Code: IRTNTR77588

1 Executive Summary

1.1 Market overview

2 Market Landscape

2.1 Market ecosystem

3 Market Sizing

3.1 Market definition
3.2 Market segment analysis
3.3 Market size 2023
3.4 Market outlook: Forecast for 2023-2028

4 Historic Market Size

4.1 Global embedded systems power amplifier market 2018 - 2022
4.2 Application Segment Analysis 2018 - 2022
4.3 Technology Segment Analysis 2018 - 2022
4.4 Geography Segment Analysis 2018 - 2022
4.5 Country Segment Analysis 2018 - 2022

5 Five Forces Analysis

5.1 Five forces summary
5.2 Bargaining power of buyers
5.3 Bargaining power of suppliers
5.4 Threat of new entrants
5.5 Threat of substitutes
5.6 Threat of rivalry
5.7 Market condition

6 Market Segmentation by Application

6.1 Market segments
6.2 Comparison by Application
6.3 Consumer electronics - Market size and forecast 2023-2028
6.4 Wireless communication - Market size and forecast 2023-2028
6.5 Industrial - Market size and forecast 2023-2028
6.6 Market opportunity by Application

7 Market Segmentation by Technology

7.1 Market segments
7.2 Comparison by Technology
7.3 CMOS - Market size and forecast 2023-2028
7.4 GaAs/GaN/SiGe - Market size and forecast 2023-2028
7.5 Market opportunity by Technology

8 Customer Landscape

8.1 Customer landscape overview

9 Geographic Landscape

9.1 Geographic segmentation
9.2 Geographic comparison
9.3 APAC - Market size and forecast 2023-2028
9.4 North America - Market size and forecast 2023-2028
9.5 Europe - Market size and forecast 2023-2028
9.6 South America - Market size and forecast 2023-2028
9.7 Middle East and Africa - Market size and forecast 2023-2028
9.8 China - Market size and forecast 2023-2028
9.9 US - Market size and forecast 2023-2028
9.10 Japan - Market size and forecast 2023-2028
9.11 South Korea - Market size and forecast 2023-2028
9.12 Germany - Market size and forecast 2023-2028
9.13 Market opportunity By Geographical Landscape

10 Drivers, Challenges, and Trends

10.1 Market drivers
10.2 Market challenges
10.3 Impact of drivers and challenges
10.4 Market trends

11 Vendor Landscape

11.1 Overview
11.2 Vendor landscape
11.3 Landscape disruption
11.4 Industry risks

12 Vendor Analysis

12.1 Vendors covered
12.2 Market positioning of vendors
12.3 Analog Devices Inc.
12.4 Broadcom Inc.
12.5 Infineon Technologies AG
12.6 Microchip Technology Inc.
12.7 NXP Semiconductors NV
12.8 ON Semiconductor Corp.
12.9 Qorvo Inc.
12.10 Renesas Electronics Corp.
12.11 RFHIC Corp.
12.12 ROHM Co. Ltd.
12.13 Silicon Laboratories Inc.
12.14 Skyworks Solutions Inc.
12.15 STMicroelectronics International NV
12.16 TE Connectivity Ltd.
12.17 Texas Instruments Inc.

13 Appendix

13.1 Scope of the report
13.2 Inclusions and exclusions checklist
13.3 Currency conversion rates for US$
13.4 Research methodology
13.5 List of abbreviations