PUBLISHER: TechNavio | PRODUCT CODE: 1911089
PUBLISHER: TechNavio | PRODUCT CODE: 1911089
The global solder materials market is forecasted to grow by USD 1051.6 mn during 2025-2030, accelerating at a CAGR of 4.2% during the forecast period. The report on the global solder materials market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increasing electronic components in vehicles, increasing product launches of solder materials, growing demand from consumer electronic sector.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.
| Market Scope | |
|---|---|
| Base Year | 2026 |
| End Year | 2030 |
| Series Year | 2026-2030 |
| Growth Momentum | Accelerate |
| YOY 2026 | 3.8% |
| CAGR | 4.2% |
| Incremental Value | $1051.6 mn |
Technavio's global solder materials market is segmented as below:
By Product
By End-User
By Application
Geography
This study identifies the increasing adoption of automated solutions for soldering as one of the prime reasons driving the global solder materials market growth during the next few years. Also, rise in inorganic growth strategies by companies and growing advancement in solder materials will lead to sizable demand in the market.
The report on the global solder materials market covers the following areas:
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global solder materials market vendors that include Ace Power Systems, AIM Solder Pvt. Ltd., Belmont Metals Inc., Deoksan Hi Metal, DigiKey, Fakhri Metals, Fusion Inc., GENMA Europe GmbH, Harima Chemicals Group, Indium Corp., INVENTEC PERFORMANCE, KOKI Company Ltd., Noel Precision Products, Saru Silver Alloy, Senju Metal Industry, STANNOL GMBH, Superior Flux, Tamura Corp., Warton Metals Ltd., Waytek Inc.. Also, the global solder materials market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.