PUBLISHER: TechNavio | PRODUCT CODE: 1915520
PUBLISHER: TechNavio | PRODUCT CODE: 1915520
The electronics parts forward logistics market in apac is forecasted to grow by USD 2217.0 mn during 2024-2029, accelerating at a CAGR of 9.6% during the forecast period. The report on the electronics parts forward logistics market in apac provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by proliferation of manufacturing in apac, technological advancements in electronics, rise of e-commerce and digital transformation.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.
| Market Scope | |
|---|---|
| Base Year | 2025 |
| End Year | 2029 |
| Series Year | 2025-2029 |
| Growth Momentum | Accelerate |
| YOY 2025 | 8.5% |
| CAGR | 9.6% |
| Incremental Value | $2217.0 mn |
Technavio's electronics parts forward logistics market in apac is segmented as below:
By Service
By Type
By Mode Of Transportation
Geography
This study identifies the increased adoption of automation and AI in warehousing as one of the prime reasons driving the electronics parts forward logistics market in apac growth during the next few years. Also, emphasis on supply chain resilience and diversification and sustainability and green logistics initiatives will lead to sizable demand in the market.
The report on the electronics parts forward logistics market in apac covers the following areas:
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading electronics parts forward logistics market in apac vendors that include AP Moller Maersk AS, C H Robinson Worldwide Inc., CMA CGM Group, DHL International GmbH, DSV AS, Expeditors International Inc., FedEx Corp., GEODIS, Hellmann Worldwide Logistics, Kerry Logistics Network Ltd., Kuehne Nagel Management AG, LOGISTEED Ltd., Nippon Express Holdings Inc., Sinotrans Ltd., Toll Holdings Ltd., United Parcel Service Inc., XPO Inc., YUSEN LOGISTICS CO. LTD.. Also, the electronics parts forward logistics market in apac analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.