PUBLISHER: TechNavio | PRODUCT CODE: 2078113
PUBLISHER: TechNavio | PRODUCT CODE: 2078113
The global data center cooling solutions market is forecasted to grow by USD 67096.5 mn during 2025-2030, accelerating at a CAGR of 28.2% during the forecast period. The report on the global data center cooling solutions market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by rising of ai and high-density computing, global environmental mandates and pursuit of power usage effectiveness, proliferation of edge computing and modular infrastructure.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.
| Market Scope | |
|---|---|
| Base Year | 2025 |
| End Year | 2030 |
| Series Year | 2026-2030 |
| Growth Momentum | Accelerate |
| YOY 2026 | 27.5% |
| CAGR | 28.2% |
| Incremental Value | $67096.5 mn |
Technavio's global data center cooling solutions market is segmented as below:
By Application
By Technique
By Type
Geography
This study identifies the transition toward direct-to-chip and immersion cooling systems as one of the prime reasons driving the global data center cooling solutions market growth during the next few years. Also, institutionalization of waste heat recovery and circular energy models and rise of ai-enabled autonomous thermal management and predictive analytics will lead to sizable demand in the market.
The report on the global data center cooling solutions market covers the following areas:
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global data center cooling solutions market vendors that include Boyd Corp., Carrier Global Corp., Coolit Systems, Daikin Industries Ltd., Fujitsu Ltd., Hewlett Packard Enterprise Co., Huawei Technologies Co. Ltd., Iceotope Technologies Ltd., Johnson Controls International, Lenovo Group Ltd., LiquidCool Solutions, LiquidStack BV, Mitsubishi Electric Corp., Motivair Corp., Munters Group AB, Rittal GmbH and Co. KG, Schneider Electric SE, STULZ GmbH, Submer Technologies SL, Vertiv Holdings Co.. Also, the global data center cooling solutions market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.