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Market Research Report

Global Semiconductor Fabrication Software Market 2021-2025

Published by TechNavio (Infiniti Research Ltd.) Product code 981804
Published Content info 120 Pages
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Global Semiconductor Fabrication Software Market 2021-2025
Published: December 31, 2020 Content info: 120 Pages
Description

Technavio has been monitoring the semiconductor fabrication software market and it is poised to grow by $ 502.58 mn during 2021-2025 progressing at a CAGR of 2% during the forecast period. Our report on semiconductor fabrication software market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the growing complexity of semiconductor device designs and increasing requirement for SoC technology. In addition, growing complexity of semiconductor device designs is anticipated to boost the growth of the market as well.

The semiconductor fabrication software market analysis includes solution segment and geographical landscapes.

Technavio's semiconductor fabrication software market is segmented as below:

By Solution

  • CAE
  • IC physical design & verification
  • PCB & MCM
  • fab management
  • others

By Geographical Landscapes

  • APAC
  • North America
  • Europe
  • MEA
  • South America

This study identifies the demand for miniaturized electronic devices of high precision across sectors as one of the prime reasons driving the semiconductor fabrication software market growth during the next few years.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. Our report on semiconductor fabrication software market covers the following areas:

  • Semiconductor fabrication software market sizing
  • Semiconductor fabrication software market forecast
  • Semiconductor fabrication software market industry analysis

Technavio's robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor fabrication software market vendors that include Agnisys Inc., ANSYS Inc., Applied Materials Inc., Cadence Design Systems Inc., KLA Corp., Onto Innovation Inc., Siemens AG, Synopsys Inc., The PEER Group Inc., and Zuken Inc.. Also, the semiconductor fabrication software market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage on all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. Technavio's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast an accurate market growth.

Table of Contents
Product Code: IRTNTR46557

Table of Contents

Executive Summary

  • Market Overview

Market Landscape

  • Market ecosystem
  • Market characteristics
  • Value chain analysis

Market Sizing

  • Market definition
  • Market segment analysis
  • Market size 2020
  • Market outlook: Forecast for 2020 - 2025

Five Forces Analysis

  • Five forces summary
  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

Market Segmentation by Solution

  • Market segments
  • Comparison by Solution
  • CAE - Market size and forecast 2020-2025
  • IC physical design and verification - Market size and forecast 2020-2025
  • PCB and MCM - Market size and forecast 2020-2025
  • Fab management software - Market size and forecast 2020-2025
  • Others - Market size and forecast 2020-2025
  • Market opportunity by Solution

Customer landscape

Geographic Landscape

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2020-2025
  • North America - Market size and forecast 2020-2025
  • Europe - Market size and forecast 2020-2025
  • MEA - Market size and forecast 2020-2025
  • South America - Market size and forecast 2020-2025
  • Key leading countries
  • Market opportunity by geography
  • Market drivers
  • Market challenges
  • Market trends

Vendor Landscape

  • Vendor landscape
  • Landscape disruption
  • Competitive scenario

Vendor Analysis

  • Vendors covered
  • Market positioning of vendors
  • Agnisys Inc.
  • ANSYS Inc.
  • Applied Materials Inc.
  • Cadence Design Systems Inc.
  • KLA Corp.
  • Onto Innovation Inc.
  • Siemens AG
  • Synopsys Inc.
  • The PEER Group Inc.
  • Zuken Inc.

Appendix

  • Scope of the report
  • Currency conversion rates for US$
  • Research methodology
  • List of abbreviations

Exhibit

  • 1: Key Finding 1
  • 2: Key Finding 2
  • 3: Key Finding 3
  • 4: Key Finding 5
  • 5: Key Finding 6
  • 6: Key Finding 7
  • 7: Key Finding 8
  • 8: Parent market
  • 9: Market characteristics
  • 10: Offerings of vendors included in the market definition
  • 11: Market segments
  • 12: Global - Market size and forecast 2020 - 2025 ($ million)
  • 13: Global market: Year-over-year growth 2020 - 2025 (%)
  • 14: Five forces analysis 2020 & 2025
  • 15: Bargaining power of buyers
  • 16: Bargaining power of suppliers
  • 17: Threat of new entrants
  • 18: Threat of substitutes
  • 19: Threat of rivalry
  • 20: Market condition - Five forces 2020
  • 21: Solution - Market share 2020-2025 (%)
  • 22: Comparison by Solution
  • 23: CAE - Market size and forecast 2020-2025 ($ million)
  • 24: CAE - Year-over-year growth 2020-2025 (%)
  • 25: IC physical design and verification - Market size and forecast 2020-2025 ($ million)
  • 26: IC physical design and verification - Year-over-year growth 2020-2025 (%)
  • 27: PCB and MCM - Market size and forecast 2020-2025 ($ million)
  • 28: PCB and MCM - Year-over-year growth 2020-2025 (%)
  • 29: Fab management software - Market size and forecast 2020-2025 ($ million)
  • 30: Fab management software - Year-over-year growth 2020-2025 (%)
  • 31: Others - Market size and forecast 2020-2025 ($ million)
  • 32: Others - Year-over-year growth 2020-2025 (%)
  • 33: Market opportunity by Solution
  • 34: Customer landscape
  • 35: Market share by geography 2020-2025 (%)
  • 36: Geographic comparison
  • 37: APAC - Market size and forecast 2020-2025 ($ million)
  • 38: APAC - Year-over-year growth 2020-2025 (%)
  • 39: North America - Market size and forecast 2020-2025 ($ million)
  • 40: North America - Year-over-year growth 2020-2025 (%)
  • 41: Europe - Market size and forecast 2020-2025 ($ million)
  • 42: Europe - Year-over-year growth 2020-2025 (%)
  • 43: MEA - Market size and forecast 2020-2025 ($ million)
  • 44: MEA - Year-over-year growth 2020-2025 (%)
  • 45: South America - Market size and forecast 2020-2025 ($ million)
  • 46: South America - Year-over-year growth 2020-2025 (%)
  • 47: Key leading countries
  • 48: Market opportunity by geography ($ million)
  • 49: Impact of drivers and challenges
  • 50: Vendor landscape
  • 51: Landscape disruption
  • 52: Industry risks
  • 53: Vendors covered
  • 54: Market positioning of vendors
  • 55: Agnisys Inc. - Overview
  • 56: Agnisys Inc. - Product and service
  • 57: Agnisys Inc. - Key offerings
  • 58: Agnisys Inc. - Key customers
  • 59: Agnisys Inc. - Segment focus
  • 60: ANSYS Inc. - Overview
  • 61: ANSYS Inc. - Business segments
  • 62: ANSYS Inc. - Key offerings
  • 63: ANSYS Inc. - Key customers
  • 64: ANSYS Inc. - Segment focus
  • 65: Applied Materials Inc. - Overview
  • 66: Applied Materials Inc. - Business segments
  • 67: Applied Materials Inc. - Key offerings
  • 68: Applied Materials Inc. - Key customers
  • 69: Applied Materials Inc. - Segment focus
  • 70: Cadence Design Systems Inc. - Overview
  • 71: Cadence Design Systems Inc. - Business segments
  • 72: Cadence Design Systems Inc. - Key offerings
  • 73: Cadence Design Systems Inc. - Key customers
  • 74: Cadence Design Systems Inc. - Segment focus
  • 75: KLA Corp. - Overview
  • 76: KLA Corp. - Business segments
  • 77: KLA Corp. - Key offerings
  • 78: KLA Corp. - Key customers
  • 79: KLA Corp. - Segment focus
  • 80: Onto Innovation Inc. - Overview
  • 81: Onto Innovation Inc. - Product and service
  • 82: Onto Innovation Inc. - Key offerings
  • 83: Onto Innovation Inc. - Key customers
  • 84: Onto Innovation Inc. - Segment focus
  • 85: Siemens AG - Overview
  • 86: Siemens AG - Business segments
  • 87: Siemens AG - Key offerings
  • 88: Siemens AG - Key customers
  • 89: Siemens AG - Segment focus
  • 90: Synopsys Inc. - Overview
  • 91: Synopsys Inc. - Business segments
  • 92: Synopsys Inc. - Key offerings
  • 93: Synopsys Inc. - Key customers
  • 94: Synopsys Inc. - Segment focus
  • 95: The PEER Group Inc. - Overview
  • 96: The PEER Group Inc. - Product and service
  • 97: The PEER Group Inc. - Key offerings
  • 98: The PEER Group Inc. - Key customers
  • 99: The PEER Group Inc. - Segment focus
  • 100: Zuken Inc. - Overview
  • 101: Zuken Inc. - Product and service
  • 102: Zuken Inc. - Key offerings
  • 103: Zuken Inc. - Key customers
  • 104: Zuken Inc. - Segment focus
  • 105: Currency conversion rates for US$
  • 106: Research Methodology
  • 107: Validation techniques employed for market sizing
  • 108: Information sources
  • 109: List of abbreviations
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