PUBLISHER: Inkwood Research | PRODUCT CODE: 1364662
PUBLISHER: Inkwood Research | PRODUCT CODE: 1364662
The United States thermal interface materials market is expected to register a CAGR of 10.29% during the forecasted period, 2023 to 2030. Some of the top drivers propelling the region's market growth include favorable demographic trends, marked by a rising and aging population, as well as the increasing demand for medical devices.
Thermal interface materials (TIMs) are substances or compounds employed to improve heat transfer between two surfaces. They achieve this by filling in the microscopic gaps or imperfections that naturally exist between these surfaces. TIMs play a pivotal role in enhancing the thermal conductivity between components in electronic devices and heat sinks. Their primary function is to reduce thermal resistance at the interface, typically found between a heat-generating component (e.g., CPU or GPU) and a heat sink or heat spreader.
These materials facilitate efficient heat transfer from the component to the cooling solution, which may be a heat sink or a liquid cooling system. As a result, TIMs have broad applications across various industries, including consumer electronics, automotive, aerospace, telecommunications, and data centers.
In the United States, the thermal interface materials (TIMs) market is poised for significant growth due to several key factors. Favorable demographic trends, such as a growing and aging population, are anticipated to drive the demand for medical devices, where TIMs are essential for efficient thermal management. Additionally, the automotive sector is witnessing a surge, particularly in the electric and hybrid vehicle segments, leading to increased requirements for TIMs to cool electronic components and batteries.
Eminent players operating in the market include: Honeywell International Inc, Indium Corporation, etc.