Advanced IC Packaging Market by Type (2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit), Application

Description

List of Tables

[197 Pages Report] The Advanced IC Packaging Market size was estimated at USD 45.02 billion in 2023 and expected to reach USD 48.51 billion in 2024, at a CAGR 8.26% to reach USD 78.50 billion by 2030.

Global Advanced IC Packaging Market

KEY MARKET STATISTICS
Base Year [2023]	USD 45.02 billion
Estimated Year [2024]	USD 48.51 billion
Forecast Year [2030]	USD 78.50 billion
CAGR (%)	8.26%

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Advanced IC Packaging Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Advanced IC Packaging Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Advanced IC Packaging Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology, Inc., ASE Technology Holding Co, Ltd., ASMPT, Broadcom, Inc., Cadence Design Systems, Inc., Carsem (M) Sdn Bhd, Faraday Technology Corporation, FormFactor, Inc., Intel Corporation, Jiangsu Changdian Technology Co., Ltd., KYOCERA Corporation, Microchip Technology Inc., Micross Components, Inc., NHanced Semiconductors, Inc., NXP Semiconductors N.V., Optima Technology Associates, Inc., Pac Tech - Packaging Technologies GmbH, Powertech Technology Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., Tektronix, Inc., Texas Instruments Incorporated, and United Microelectronics Corporation.

Market Segmentation & Coverage

This research report categorizes the Advanced IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

Type
- 2.5D Integrated Circuit
- 2D Integrated Circuit
- 3D Integrated Circuit
- Fan Out Silicon In Package
- Fan Out Wafer Level Package
- Flip Chip
- Wafer Level Chip Scale Package
Application
- Aerospace & Defense
- Automotive & Transportation
- Consumer Electronics
- IT & Telecom
Region
- Americas
  - Argentina
  - Brazil
  - Canada
  - Mexico
  - United States
    - California
    - Florida
    - Illinois
    - New York
    - Ohio
    - Pennsylvania
    - Texas
- Asia-Pacific
  - Australia
  - China
  - India
  - Indonesia
  - Japan
  - Malaysia
  - Philippines
  - Singapore
  - South Korea
  - Taiwan
  - Thailand
  - Vietnam
- Europe, Middle East & Africa
  - Denmark
  - Egypt
  - Finland
  - France
  - Germany
  - Israel
  - Italy
  - Netherlands
  - Nigeria
  - Norway
  - Poland
  - Qatar
  - Russia
  - Saudi Arabia
  - South Africa
  - Spain
  - Sweden
  - Switzerland
  - Turkey
  - United Arab Emirates
  - United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Advanced IC Packaging Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Advanced IC Packaging Market?

3. What are the technology trends and regulatory frameworks in the Advanced IC Packaging Market?

4. What is the market share of the leading vendors in the Advanced IC Packaging Market?

5. Which modes and strategic moves are suitable for entering the Advanced IC Packaging Market?

Product Code: MRR-8903005C4AFE

1. Preface

1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology

2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

4.1. Introduction
4.2. Advanced IC Packaging Market, by Region

5. Market Insights

5.1. Market Dynamics
- 5.1.1. Drivers
  - 5.1.1.1. Increasing demand and adoption of consumer electronic devices
  - 5.1.1.2. Gowing demand for miniaturized electronic products from defense sector
  - 5.1.1.3. Ongoing electrification of transportation sector across economies
- 5.1.2. Restraints
  - 5.1.2.1. High cost of advanced IC packaging processes
- 5.1.3. Opportunities
  - 5.1.3.1. Evolution and development of new advanced IC packaging solutions
  - 5.1.3.2. Rising investment in semiconductor manufacturing industry
- 5.1.4. Challenges
  - 5.1.4.1. Reliablity, power dissipation and power usage challenges associated with advanced IC packaging
5.2. Market Segmentation Analysis
5.3. Market Trend Analysis
5.4. Cumulative Impact of High Inflation
5.5. Porter's Five Forces Analysis
- 5.5.1. Threat of New Entrants
- 5.5.2. Threat of Substitutes
- 5.5.3. Bargaining Power of Customers
- 5.5.4. Bargaining Power of Suppliers
- 5.5.5. Industry Rivalry
5.6. Value Chain & Critical Path Analysis
5.7. Regulatory Framework

6. Advanced IC Packaging Market, by Type

6.1. Introduction
6.2. 2.5D Integrated Circuit
6.3. 2D Integrated Circuit
6.4. 3D Integrated Circuit
6.5. Fan Out Silicon In Package
6.6. Fan Out Wafer Level Package
6.7. Flip Chip
6.8. Wafer Level Chip Scale Package

7. Advanced IC Packaging Market, by Application

7.1. Introduction
7.2. Aerospace & Defense
7.3. Automotive & Transportation
7.4. Consumer Electronics
7.5. IT & Telecom

8. Americas Advanced IC Packaging Market

8.1. Introduction
8.2. Argentina
8.3. Brazil
8.4. Canada
8.5. Mexico
8.6. United States

9. Asia-Pacific Advanced IC Packaging Market

9.1. Introduction
9.2. Australia
9.3. China
9.4. India
9.5. Indonesia
9.6. Japan
9.7. Malaysia
9.8. Philippines
9.9. Singapore
9.10. South Korea
9.11. Taiwan
9.12. Thailand
9.13. Vietnam

10. Europe, Middle East & Africa Advanced IC Packaging Market

10.1. Introduction
10.2. Denmark
10.3. Egypt
10.4. Finland
10.5. France
10.6. Germany
10.7. Israel
10.8. Italy
10.9. Netherlands
10.10. Nigeria
10.11. Norway
10.12. Poland
10.13. Qatar
10.14. Russia
10.15. Saudi Arabia
10.16. South Africa
10.17. Spain
10.18. Sweden
10.19. Switzerland
10.20. Turkey
10.21. United Arab Emirates
10.22. United Kingdom

11. Competitive Landscape

11.1. FPNV Positioning Matrix
11.2. Market Share Analysis, By Key Player
11.3. Competitive Scenario Analysis, By Key Player

12. Competitive Portfolio

12.1. Key Company Profiles
- 12.1.1. Amkor Technology, Inc.
- 12.1.2. ASE Technology Holding Co, Ltd.
- 12.1.3. ASMPT
- 12.1.4. Broadcom, Inc.
- 12.1.5. Cadence Design Systems, Inc.
- 12.1.6. Carsem (M) Sdn Bhd
- 12.1.7. Faraday Technology Corporation
- 12.1.8. FormFactor, Inc.
- 12.1.9. Intel Corporation
- 12.1.10. Jiangsu Changdian Technology Co., Ltd.
- 12.1.11. KYOCERA Corporation
- 12.1.12. Microchip Technology Inc.
- 12.1.13. Micross Components, Inc.
- 12.1.14. NHanced Semiconductors, Inc.
- 12.1.15. NXP Semiconductors N.V.
- 12.1.16. Optima Technology Associates, Inc.
- 12.1.17. Pac Tech - Packaging Technologies GmbH
- 12.1.18. Powertech Technology Inc.
- 12.1.19. Renesas Electronics Corporation
- 12.1.20. Samsung Electronics Co., Ltd.
- 12.1.21. Taiwan Semiconductor Manufacturing Company, Ltd.
- 12.1.22. Tektronix, Inc.
- 12.1.23. Texas Instruments Incorporated
- 12.1.24. United Microelectronics Corporation
12.2. Key Product Portfolio

13. Appendix

13.1. Discussion Guide
13.2. License & Pricing