IC Sockets Market by Type, Application - Global Forecast 2023-2030

List of Tables

The IC Sockets Market is projected to reach USD 6.57 billion by 2030 from USD 3.57 billion in 2022, at a CAGR of 7.90% during the forecast period.

Global IC Sockets Market

KEY MARKET STATISTICS
Base Year Value [2022]	USD 3.57 billion
Estimated Year Value [2023]	USD 3.83 billion
Forecast Year Value [2030]	USD 6.57 billion
CAGR (%)	7.90%

Market Segmentation & Coverage:

This research report analyzes various sub-markets, forecasts revenues, and examines emerging trends in each category to provide a comprehensive outlook on the IC Sockets Market.

Based on Type, market is studied across Dual In-Line Package Sockets, Land Grid Array Sockets, Pin Grid Array Sockets, Surface-Mount Device Sockets, and Zero Insertion Force Sockets. The Pin Grid Array Sockets is projected to witness significant market share during forecast period.

Based on Application, market is studied across Central Processing Unit, Cmos Image Sensors, Graphics Processing Unit, High Voltage, Memory, Radio Frequency, and System-On-A-Chip. The System-On-A-Chip is projected to witness significant market share during forecast period.

Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom. The Asia-Pacific is projected to witness significant market share during forecast period.

Market Statistics:

The report provides market sizing and forecasts across 7 major currencies - USD, EUR, JPY, GBP, AUD, CAD, and CHF; multiple currency support helps organization leaders to make well-informed decisions. In this report, 2018 to 2021 are considered as historical years, 2022 is base year, 2023 is estimated year, and years from 2024 to 2030 are considered as forecast period.

FPNV Positioning Matrix:

The FPNV Positioning Matrix is an indispensable tool for assessing the IC Sockets Market. It comprehensively evaluates vendors, analyzing key metrics related to Business Strategy and Product Satisfaction. This enables users to make informed decisions tailored to their specific needs. Through advanced analysis, vendors are categorized into four distinct quadrants, each representing a different level of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V). Be assured that this insightful framework empowers decision-makers to navigate the market with confidence.

Market Share Analysis:

The Market Share Analysis offers invaluable insights into the vendor landscape IC Sockets Market. By evaluating their impact on overall revenue, customer base, and other key metrics, we provide companies with a comprehensive understanding of their performance and the competitive environment they confront. This analysis also uncovers the level of competition in terms of market share acquisition, fragmentation, dominance, and industry consolidation during the study period.

Key Company Profiles:

The report delves into recent significant developments in the IC Sockets Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Adam Technologies, Inc., Amphenol Corporation, Aries Electronics Incorporated, AUK, Conrad Electronic International GmbH & CoKG, Enplas Corporation, FCI OEN Connectors Ltd., Hirose Electric Co., Ltd., Krishna Smart Technology, Leeno Industrial Inc., Mill-Max Mfg. Corp., MISUMI Corporation, MPE-Garry GmbH, Omron Corporation, Preci-Dip SA, Protectron, RIKA DENSHI CO., LTD., SDK Co., Ltd., SER Corp., Smiths Interconnect Group Limited, TE Connectivity Ltd., Texas Instruments Inc., and Yamaichi Electronics Co., Ltd..

The report offers valuable insights on the following aspects:

1. Market Penetration: It provides comprehensive information about key players' market dynamics and offerings.

2. Market Development: In-depth analysis of emerging markets and penetration across mature market segments, highlighting lucrative opportunities.

3. Market Diversification: Detailed information about new product launches, untapped geographies, recent developments, and investments.

4. Competitive Assessment & Intelligence: Exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of leading players.

5. Product Development & Innovation: Intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast for the IC Sockets Market?

2. Which products, segments, applications, and areas hold the highest investment potential in the IC Sockets Market?

3. What is the competitive strategic window for identifying opportunities in the IC Sockets Market?

4. What are the latest technology trends and regulatory frameworks in the IC Sockets Market?

5. What is the market share of the leading vendors in the IC Sockets Market?

6. Which modes and strategic moves are suitable for entering the IC Sockets Market?

Product Code: MRR-C002B1C996B4

1. Preface

1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology

2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

4.1. Introduction
4.2. IC Sockets Market, by Region

5. Market Insights

5.1. Market Dynamics
- 5.1.1. Drivers
  - 5.1.1.1. Growing demand for higher performance and compact electronic devices
  - 5.1.1.2. Miniaturization of ICs coupled with need for multifunctionality in automotive sector
  - 5.1.1.3. Rise in need for high-speed communication worldwide
- 5.1.2. Restraints
  - 5.1.2.1. High cost of IC sockets due to their small size and complex design features
- 5.1.3. Opportunities
  - 5.1.3.1. Technological advancements in IC sockets
  - 5.1.3.2. Ongoing research to expand applications of IC sockets
- 5.1.4. Challenges
  - 5.1.4.1. Concerns associated with short lifespans of IC sockets
5.2. Market Segmentation Analysis
5.3. Market Trend Analysis
5.4. Cumulative Impact of High Inflation
5.5. Porter's Five Forces Analysis
- 5.5.1. Threat of New Entrants
- 5.5.2. Threat of Substitutes
- 5.5.3. Bargaining Power of Customers
- 5.5.4. Bargaining Power of Suppliers
- 5.5.5. Industry Rivalry
5.6. Value Chain & Critical Path Analysis
5.7. Regulatory Framework

6. IC Sockets Market, by Type

6.1. Introduction
6.2. Dual In-Line Package Sockets
6.3. Land Grid Array Sockets
6.4. Pin Grid Array Sockets
6.5. Surface-Mount Device Sockets
6.6. Zero Insertion Force Sockets

7. IC Sockets Market, by Application

7.1. Introduction
7.2. Central Processing Unit
7.3. Cmos Image Sensors
7.4. Graphics Processing Unit
7.5. High Voltage
7.6. Memory
7.7. Radio Frequency
7.8. System-On-A-Chip

8. Americas IC Sockets Market

8.1. Introduction
8.2. Argentina
8.3. Brazil
8.4. Canada
8.5. Mexico
8.6. United States

9. Asia-Pacific IC Sockets Market

9.1. Introduction
9.2. Australia
9.3. China
9.4. India
9.5. Indonesia
9.6. Japan
9.7. Malaysia
9.8. Philippines
9.9. Singapore
9.10. South Korea
9.11. Taiwan
9.12. Thailand
9.13. Vietnam

10. Europe, Middle East & Africa IC Sockets Market

10.1. Introduction
10.2. Denmark
10.3. Egypt
10.4. Finland
10.5. France
10.6. Germany
10.7. Israel
10.8. Italy
10.9. Netherlands
10.10. Nigeria
10.11. Norway
10.12. Poland
10.13. Qatar
10.14. Russia
10.15. Saudi Arabia
10.16. South Africa
10.17. Spain
10.18. Sweden
10.19. Switzerland
10.20. Turkey
10.21. United Arab Emirates
10.22. United Kingdom

11. Competitive Landscape

11.1. FPNV Positioning Matrix
11.2. Market Share Analysis, By Key Player
11.3. Competitive Scenario Analysis, By Key Player

12. Competitive Portfolio

12.1. Key Company Profiles
- 12.1.1. 3M Company
- 12.1.2. Adam Technologies, Inc.
- 12.1.3. Amphenol Corporation
- 12.1.4. Aries Electronics Incorporated
- 12.1.5. AUK
- 12.1.6. Conrad Electronic International GmbH & CoKG
- 12.1.7. Enplas Corporation
- 12.1.8. FCI OEN Connectors Ltd.
- 12.1.9. Hirose Electric Co., Ltd.
- 12.1.10. Krishna Smart Technology
- 12.1.11. Leeno Industrial Inc.
- 12.1.12. Mill-Max Mfg. Corp.
- 12.1.13. MISUMI Corporation
- 12.1.14. MPE-Garry GmbH
- 12.1.15. Omron Corporation
- 12.1.16. Preci-Dip SA
- 12.1.17. Protectron
- 12.1.18. RIKA DENSHI CO., LTD.
- 12.1.19. SDK Co., Ltd.
- 12.1.20. SER Corp.
- 12.1.21. Smiths Interconnect Group Limited
- 12.1.22. TE Connectivity Ltd.
- 12.1.23. Texas Instruments Inc.
- 12.1.24. Yamaichi Electronics Co., Ltd.
12.2. Key Product Portfolio

13. Appendix

13.1. Discussion Guide
13.2. License & Pricing