Semiconductor Manufacturing Equipment Market by Product Type, Dimension (2.5D ICs, 2D ICs, 3D ICs), Equipment Type

Description

List of Tables

[193 Pages Report] The Semiconductor Manufacturing Equipment Market size was estimated at USD 90.63 billion in 2023 and expected to reach USD 96.16 billion in 2024, at a CAGR 6.86% to reach USD 144.29 billion by 2030.

The semiconductor manufacturing equipment includes machinery and tools used to manufacture semiconductor devices such as integrated circuits (ICs), transistors, and other electronic components. Semiconductor manufacturing equipment refers to the production equipment required to produce various semiconductor products and belongs to the key supporting link of the semiconductor industry chain. Increasing production and sale of semiconductors elevates the demand for semiconductor manufacturing equipment. According to a recent study, the industry sold 1.15 trillion units of semiconductors in 2021. The semiconductor manufacturing equipment includes various ranges such as wafer fabrication equipment, assembly and packaging equipment, and testing and inspection equipment. The growing demand for electronic devices and technological advancements in the semiconductor industry drives the demand for semiconductor manufacturing equipment. The gradual transitions in the semiconductor industry, such as the miniaturization of nodes and wafer sizes and the demand for increasing the wafer sizes for ultra-large-scale integration technologies, are fostering the usage of semiconductor manufacturing equipment. However, the chip shortage issues worldwide are impeding the growth of the market. The ongoing introduction of advanced semiconductor manufacturing equipment by market vendors is expected to expand the market scope.

KEY MARKET STATISTICS
Base Year [2023]	USD 90.63 billion
Estimated Year [2024]	USD 96.16 billion
Forecast Year [2030]	USD 144.29 billion
CAGR (%)	6.86%

Product Type: High demand for memory logic devices in semiconductor technology for the storage and retrieval of data

Memory Logic devices form an essential component of modern semiconductor technology, enabling the storage and retrieval of data. Semiconductor manufacturing equipment for memory logic must cater to producing various types of memories, including Dynamic Random-Access Memory (DRAM), Static RAM (SRAM), and Flash memory. These devices play pivotal roles in consumer electronics, automotive, and industrial applications, calling for highly precise and efficient fabrication technologies. The demand for denser, faster, and energy-efficient memory solutions drives innovation in lithography, deposition, and etching equipment, emphasizing advancements in 3D memory structure manufacturing and scaling challenges. Micro-electromechanical Systems (MEMS) integrate mechanical and electrical components at a microscopic scale, leading to devices with moving parts with applications ranging from sensors in automotive systems to medical devices. Manufacturing MEMS involves intricate processes such as silicon micromachining and necessitates precision deposition, photolithography, etching, and packaging equipment.

As the application areas of MEMS expand, including IoT devices and wearable technology, the requirement for semiconductor manufacturing equipment evolves towards higher precision and versatility to accommodate the complex structures and diverse materials involved in MEMS fabrication. The heart of computing devices, microprocessor units (MPUs), are critical in defining performance and functionality. Manufacturing MPUs involves sophisticated semiconductor fabrication processes that require cutting-edge equipment for lithography, ion implantation, chemical vapor deposition (CVD), and metal-organic CVD, among others. The relentless pursuit of Moore's Law, aiming for smaller, faster, and more energy-efficient microprocessors, underscores the constant need for innovation in manufacturing equipment. Challenges such as reducing line widths on chips to sub-10 nm scales and mitigating defects in atomic-scale engineering underscore the strategic importance of advanced equipment in MPU production.

Dimension: Suitability of 3D ICs in applications requiring high data processing and speed levels

2D ICs represent the conventional form of semiconductor devices where components are fabricated on a single plane or layer of silicon. This approach to IC design has dominated the electronics industry for decades, providing a basis for the miniaturization & performance enhancement of electronic devices. However, with the approaching limits of Moore's Law, scaling down 2D ICs has become increasingly challenging and costly, giving rise to alternative dimensional integration techniques. 2.5D ICs offer a transitional solution towards achieving higher chip performance and functionality without the immediate complexities and costs associated with transitioning directly to 3D integration. In 2.5D ICs, multiple dies are placed side by side on an interposer (usually made of silicon), providing electrical connections between them. This architecture allows for shorter connections between dies, resulting in lower latency and higher bandwidth than traditional 2D ICs. It also enables heterogeneous integration, allowing for the combination of components built on different manufacturing processes. 3D ICs represent a significant evolution in semiconductor manufacturing, where multiple layers of active electronic components are stacked and interconnected vertically. This paradigm allows for incredibly dense configurations, potentially delivering higher performance, reduced power consumption, and smaller form factors. The vertical stacking and integration facilitate a much shorter distance between individual transistors, enhancing data transfer speeds while reducing power usage. 3D ICs are particularly beneficial in applications requiring high data processing and speed levels, such as computing, mobile communications, and high-performance graphics rendering. Despite their advantages, 3D ICs pose significant manufacturing challenges, including heat dissipation, inter-layer connectivity, and yield management, which are actively being addressed through technological advancements and design methodologies.

Regional Insights

The countries such as China, South Korea, Japan, and Vietnam are continuously increasing their focus on expanding their semiconductor industry, creating a scope of semiconductor manufacturing equipment in Asia-Pacific. The Chinese government is expected to add roughly 40% of the new global semiconductor capacity by 2030 and continues to prioritize the semiconductor industry as a driver of economic growth and technological leadership. In November 2022, governments in South and Central Asia launched a trade mission focused on the semiconductor industry. The objective was to provide support to India in addressing challenges within the semiconductor supply chain and to enhance the country's domestic semiconductor manufacturing capabilities. The high adoption rate of smart electronics & consumable electronics across various end-use industries, including healthcare, automobiles, and manufacturing, is creating a platform for the growth of semiconductor manufacturing equipment in Asia-Pacific. The substantial growth in the research & development, manufacturing, and distribution of semiconductors with government incentive programs propel the utilization of semiconductor manufacturing equipment to fulfill the growing demand for semiconductors in the Americas. In June 2020, the Government of the United States introduced the CHIPS Act with an approximately 39 billion manufacturing incentive program to revitalize the U.S. chipmaking ecosystem across various technologies. The CHIPS and Science Act also established a 25% advanced manufacturing investment tax credit to be implemented by the U.S. Department of Treasury to complement the manufacturing incentive program. Rapid digitalization, penetration of portable electronic devices, and rising demand for consumer electronics products and smart industrial machinery are expected to drive the growth of EMEA's semiconductor manufacturing equipment market.

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Semiconductor Manufacturing Equipment Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Semiconductor Manufacturing Equipment Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Semiconductor Manufacturing Equipment Market, highlighting leading vendors and their innovative profiles. These include Advanced Dicing Technologies Ltd., Advantest Corporation, Applied Materials, Inc., ASM International N.V., ASML Holding N.V., Atlas Copco AB, Cannon Inc., Energetiq Technology, Inc., EV Group, Ferrotec Holdings Corporation, FutureFab, Inc., Hitachi, Ltd., Intel Corporation, JEOL Ltd., KLA Corporation, Lam Research Corporation, Modutek Corporation, Nikon Corporation, Nordson Corporation, Onto Innovation Inc., Screen Holdings Co., Ltd., Support Specialties, Inc. (S-Cubed), SUSS MicroTec SE, Tokyo Seimitsu Co., Ltd., and Veeco Instruments Inc..

Market Segmentation & Coverage

This research report categorizes the Semiconductor Manufacturing Equipment Market to forecast the revenues and analyze trends in each of the following sub-markets:

Product Type
- Memory Logics
- Micro-electromechanical system
- Microprocessor Units

Dimension
- 2.5D ICs
- 2D ICs
- 3D ICs

Equipment Type
- Back-End Equipment
  - Assembly & Packaging
  - Dicing & Bonding
  - Metrology
  - Water Testing

Fab Facility Equipment
- Automation Equipment
- Chemical Control Equipment
- Gas Control Equipment

Front-End Equipment
- Deposition Equipment
  - Chemical Vapor Deposition
  - Physical Vapor Deposition

Lithography Equipment
- Deep Ultraviolet Lithography
- Extreme Ultraviolet Lithography

Wafer Cleaning Equipment
- Batch Immersion Cleaning System
- Batch Spray Cleaning System
- Scrubber
- Single-Wafer Cryogenic System
- Single-Wafer Spray System

Water Surface Conditioning Equipment
- Chemical Mechanical Planarization
- Etching

Region
- Americas
  - Argentina
  - Brazil
  - Canada
  - Mexico
  - United States
    - California
    - Florida
    - Illinois
    - New York
    - Ohio
    - Pennsylvania
    - Texas
- Asia-Pacific
  - Australia
  - China
  - India
  - Indonesia
  - Japan
  - Malaysia
  - Philippines
  - Singapore
  - South Korea
  - Taiwan
  - Thailand
  - Vietnam

Europe, Middle East & Africa
- Denmark
- Egypt
- Finland
- France
- Germany
- Israel
- Italy
- Netherlands
- Nigeria
- Norway
- Poland
- Qatar
- Russia
- Saudi Arabia
- South Africa
- Spain
- Sweden
- Switzerland
- Turkey
- United Arab Emirates
- United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Semiconductor Manufacturing Equipment Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Semiconductor Manufacturing Equipment Market?

3. What are the technology trends and regulatory frameworks in the Semiconductor Manufacturing Equipment Market?

4. What is the market share of the leading vendors in the Semiconductor Manufacturing Equipment Market?

5. Which modes and strategic moves are suitable for entering the Semiconductor Manufacturing Equipment Market?

Product Code: MRR-010D72467DC9

1. Preface

1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders

2. Research Methodology

2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

5.1. Market Dynamics
- 5.1.1. Drivers
  - 5.1.1.1. Rising demand for miniaturized semiconductor components in consumer electronics
  - 5.1.1.2. Growing Integration of Advanced electronic Systems in Automotive & Aerospace
  - 5.1.1.3. Proliferation of government initiatives for semiconductor manufacturing
- 5.1.2. Restraints
  - 5.1.2.1. Concerns Related to Chip Shortage and Supply Chain Management
- 5.1.3. Opportunities
  - 5.1.3.1. Technological advancements in semiconductor manufacturing
  - 5.1.3.2. Improvements in semiconductor packaging technology and overall standardization
- 5.1.4. Challenges
  - 5.1.4.1. Limitations of semiconductor fabrication procedure and presence of strict manufacturing standards
5.2. Market Segmentation Analysis
- 5.2.1. Product Type: High demand for memory logic devices in semiconductor technology for the storage and retrieval of data
- 5.2.2. Dimension: Suitability of 3D ICs in applications requiring high data processing and speed levels
5.3. Market Trend Analysis
- 5.3.1. Federal Government initiatives and investments reinforced the semiconductor manufacturing capacities to expand in the Americas
- 5.3.2. Presence of major market vendors focused on the advancement in technology such as nanotechnology and semiconductor fabrication from the end-use industries
- 5.3.3. The potential adoption of advanced consumer electronics products and smart industrial machinery in EMEA economies strengthening their value chain for consumer goods and services
5.4. Cumulative Impact of Russia-Ukraine Conflict
5.5. Cumulative Impact of High Inflation
5.6. Porter's Five Forces Analysis
- 5.6.1. Threat of New Entrants
- 5.6.2. Threat of Substitutes
- 5.6.3. Bargaining Power of Customers
- 5.6.4. Bargaining Power of Suppliers
- 5.6.5. Industry Rivalry
5.7. Value Chain & Critical Path Analysis
5.8. Regulatory Framework Analysis
5.9. Client Customization

6. Semiconductor Manufacturing Equipment Market, by Product Type

6.1. Introduction
6.2. Memory Logics
6.3. Micro-electromechanical system
6.4. Microprocessor Units

7. Semiconductor Manufacturing Equipment Market, by Dimension

7.1. Introduction
7.2. 2.5D ICs
7.3. 2D ICs
7.4. 3D ICs

8. Semiconductor Manufacturing Equipment Market, by Equipment Type

8.1. Introduction
8.2. Back-End Equipment
8.3. Fab Facility Equipment
8.4. Front-End Equipment

9. Americas Semiconductor Manufacturing Equipment Market

9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States

10. Asia-Pacific Semiconductor Manufacturing Equipment Market

10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam

11. Europe, Middle East & Africa Semiconductor Manufacturing Equipment Market

11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom

12. Competitive Landscape

12.1. Market Share Analysis, 2023
12.2. FPNV Positioning Matrix, 2023
12.3. Competitive Scenario Analysis
- 12.3.1. IBM and Rapidus Form Strategic Partnership to Build Advanced Semiconductor Technology and Ecosystem in Japan
- 12.3.2. TSMC wins approval to invest USD 3.5 billion in Arizona
- 12.3.3. The U.S. finds India as a trusted partner for diversifying semiconductor supply chain, to sign an MoU
- 12.3.4. Applied Materials to Extend Global Leadership in Semiconductor Manufacturing Technology
- 12.3.5. EV GROUP and Toppan Photomask join forces
- 12.3.6. Lam Research Acquires SEMSYSCO to Advance Chip Packaging
- 12.3.7. Global chip firms expand R&D footprint in India
- 12.3.8. Historic USD 280 Billion Investment in Domestic Semiconductor Manufacturing and STEM Research and Development to Be Signed into Law
- 12.3.9. Atlas Copco completes acquisition of manufacturer of process equipment for the semiconductor industry
- 12.3.10. Asm International N.V. Launches Sonora Vertical Furnace System
- 12.3.11. Advantest and Singapore Polytechnic Jointly Establish New Test Engineering Centre to Boost Capabilities of Integrated Circuit Test Engineers in Southeast Asia
- 12.3.12. Hitachi High-Tech Launches Dark Field Wafer Defect Inspection System DI2800, Achieving High-Sensitivity 100% Inspection for Semiconductor Devices in the IoT and Automotive Fields
- 12.3.13. Ferrotec Chooses Malaysia To Expand Manufacturing Capacity To Grow Its Global Business
- 12.3.14. SUSS MicroTec announces merger of two subsidiaries
- 12.3.15. Government of Canada announces significant investment in the Canadian semiconductor and photonics industries

13. Competitive Portfolio

13.1. Key Company Profiles
13.2. Key Product Portfolio