PUBLISHER: KBV Research | PRODUCT CODE: 1871367
PUBLISHER: KBV Research | PRODUCT CODE: 1871367
Asia Pacific LCP Based Molded Interconnect Devices Market Size, Share & Industry Analysis Report By Process (Laser Direct Structuring, Two-Shot Molding, and Other Process), By Product, By End Use, By Country and Growth Forecast, 2025 - 2032
The Asia Pacific LCP Based Molded Interconnect Devices Market would witness market growth of 17.5% CAGR during the forecast period (2025-2032).
The China market dominated the Asia Pacific LCP Based Molded Interconnect Devices Market by Country in 2024, and would continue to be a dominant market till 2032; thereby, achieving a market value of $347.2 million by 2032. The Japan market is registering a CAGR of 16.6% during (2025 - 2032). Additionally, The India market would showcase a CAGR of 18.7% during (2025 - 2032). The China and Japan led the Asia Pacific LCP Based Molded Interconnect Devices Market by Country with a market share of 44.4% and 17.2% in 2024.The Singapore market is expected to witness a CAGR of 19.7% during throughout the forecast period.
The Asia Pacific region has become a major center for molded interconnect devices (MIDs) based on LCP. This is because it has a strong electronics manufacturing base, a high demand for consumer electronics, and ecosystems in the automotive and telecom industries. Additive metallization and two-shot molding were used to make the first MID devices, but LCP made it possible to make them more precise, more resistant to heat, and to add circuitry to complex shapes. Regional OEMs and suppliers worked together on micro-injection molding, laser activation, and plating methods, going from making prototypes to making small amounts of products. Today, Asia Pacific is the leader in both consumption and innovation, providing MID modules, design tools, and process knowledge to the rest of the world.
LCP parts are becoming more popular in mobile communications and antennas, automotive electronics, and sensor modules. They make things lighter, combine wiring, and can handle tough conditions. The area also focuses on localized design frameworks, MID libraries, and ecosystem development to help OEMs who don't have a lot of experience adopt the technology. To get the best cost, yield, and responsiveness, leading companies work together vertically, co-develop with domestic OEMs, offer localized support, and scale up production. There is a lot of competition, but it is divided into levels. The biggest companies win by having more resources, better processes, and better designs. Smaller companies fill in the gaps or focus on specific regions.
Product Outlook
Based on Process, the market is segmented into Laser Direct Structuring (LDS), Two-Shot Molding, and Other Process. Based on Product, the market is segmented into Antennas, Connectors & Interconnects, Sensor Housings, and Other Product. With a compound annual growth rate (CAGR) of 15.2% over the projection period, the Antennas Market, dominate the China LCP Based Molded Interconnect Devices Market by Product in 2024 and would be a prominent market until 2032. The Sensor Housings market is expected to witness a CAGR of 16.6% during (2025 - 2032).
Process Outlook
The Laser Direct Structuring (LDS) market segment dominated the Singapore LCP Based Molded Interconnect Devices Market by Process is expected to grow at a CAGR of 19.1 % during the forecast period thereby continuing its dominance until 2032. Also, The Two-Shot Molding market is anticipated to grow as a CAGR of 20.1 % during the forecast period during (2025 - 2032).
Country Outlook
China is the leader in LCP-based molded interconnect devices (MIDs) in the Asia-Pacific region. This is because it has a large electronics manufacturing ecosystem, a well-developed polymer and laser infrastructure, and strong domestic demand for smartphones, IoT, cars, and telecom. Government policies that support adding value locally and developing semiconductors speed up adoption even more. Laser Direct Structuring (LDS) is the most popular method for making high-precision, miniaturized interconnects. MID integration started out focusing on high-end products like 5G antennas, sensors, wearables, and automotive modules. As economies of scale and process maturity improve, it is expected to grow. Local PCB and flex circuit makers, as well as partnerships between polymer, laser, and OEM companies, improve the skills of local companies. China is the regional leader in LCP-based MID adoption because it has a deep supply chain, a lot of technical know-how, and a lot of demand.
List of Key Companies Profiled
- Molex, LLC (Koch Industries, Inc.)
- TE Connectivity Ltd.
- Kyocera Corporation
- Amphenol Corporation
- Sumitomo Electric Industries, Ltd.
- Taoglas
- HARTING Technology Group
- LPKF Laser & Electronics SE
- Celanese Corporation
- Solvay SA
Asia Pacific LCP Based Molded Interconnect Devices Market Report Segmentation
By Process
- Laser Direct Structuring (LDS)
- Two-Shot Molding
- Other Process
By Product
- Antennas
- Connectors & Interconnects
- Sensor Housings
- Other Product
By End Use
- Automotive
- Consumer Electronics
- Telecommunication
- Aerospace & Defense
- Healthcare
- Other End Use
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Table of Contents
Chapter 1. Market Scope & Methodology
- 1.1 Market Definition
- 1.2 Objectives
- 1.3 Market Scope
- 1.4 Segmentation
- 1.4.1 Asia Pacific LCP Based Molded Interconnect Devices Market, by Process
- 1.4.2 Asia Pacific LCP Based Molded Interconnect Devices Market, by Product
- 1.4.3 Asia Pacificl LCP Based Molded Interconnect Devices Market, by End Use
- 1.4.4 Asia Pacific LCP Based Molded Interconnect Devices Market, by Country
- 1.5 Methodology for the research
Chapter 2. Market at a Glance
- 2.1 Key Highlights
Chapter 3. Market Overview
- 3.1 Introduction
- 3.1.1 Overview
- 3.1.1.1 Market Composition and Scenario
- 3.1.1 Overview
- 3.2 Key Factors Impacting the Market
- 3.2.1 Market Drivers
- 3.2.2 Market Restraints
- 3.2.3 Market Opportunities
- 3.2.4 Market Challenges
Chapter 4. Market Trends - Asia Pacific LCP Based Molded Interconnect Devices Market
Chapter 5. State of Competition - Asia Pacific LCP-based Molded Interconnect Devices (MID) market
Chapter 6. Value Chain Analysis of LCP Based Molded Interconnect Devices Market
Chapter 7. Competition Analysis - Global
- 7.1 Market Share Analysis, 2024
- 7.2 Porter Five Forces Analysis
Chapter 8. Product Life Cycle - LCP Based Molded Interconnect Devices Market
Chapter 9. Market Consolidation - LCP Based Molded Interconnect Devices Market
Chapter 10. Key Customer Criteria - LCP Based Molded Interconnect Devices Market
Chapter 11. Asia Pacific LCP Based Molded Interconnect Devices Market by Process
- 11.1 Asia Pacific Laser Direct Structuring (LDS) Market by Country
- 11.2 Asia Pacific Two-Shot Molding Market by Country
- 11.3 Asia Pacific Other Process Market by Country
Chapter 12. Asia Pacific LCP Based Molded Interconnect Devices Market by Product
- 12.1 Asia Pacific Antennas Market by Country
- 12.2 Asia Pacific Connectors & Interconnects Market by Country
- 12.3 Asia Pacific Sensor Housings Market by Country
- 12.4 Asia Pacific Other Product Market by Country
Chapter 13. Asia Pacific LCP Based Molded Interconnect Devices Market by End Use
- 13.1 Asia Pacific Automotive Market by Country
- 13.2 Asia Pacific Consumer Electronics Market by Country
- 13.3 Asia Pacific Telecommunication Market by Country
- 13.4 Asia Pacific Aerospace & Defense Market by Country
- 13.5 Asia Pacific Healthcare Market by Country
- 13.6 Asia Pacific Other End Use Market by Country
Chapter 14. Asia Pacific LCP Based Molded Interconnect Devices Market by Country
- 14.1 China LCP Based Molded Interconnect Devices Market
- 14.1.1 China LCP Based Molded Interconnect Devices Market by Process
- 14.1.2 China LCP Based Molded Interconnect Devices Market by Product
- 14.1.3 China LCP Based Molded Interconnect Devices Market by End Use
- 14.2 Japan LCP Based Molded Interconnect Devices Market
- 14.2.1 Japan LCP Based Molded Interconnect Devices Market by Process
- 14.2.2 Japan LCP Based Molded Interconnect Devices Market by Product
- 14.2.3 Japan LCP Based Molded Interconnect Devices Market by End Use
- 14.3 India LCP Based Molded Interconnect Devices Market
- 14.3.1 India LCP Based Molded Interconnect Devices Market by Process
- 14.3.2 India LCP Based Molded Interconnect Devices Market by Product
- 14.3.3 India LCP Based Molded Interconnect Devices Market by End Use
- 14.4 South Korea LCP Based Molded Interconnect Devices Market
- 14.4.1 South Korea LCP Based Molded Interconnect Devices Market by Process
- 14.4.2 South Korea LCP Based Molded Interconnect Devices Market by Product
- 14.4.3 South Korea LCP Based Molded Interconnect Devices Market by End Use
- 14.5 Singapore LCP Based Molded Interconnect Devices Market
- 14.5.1 Singapore LCP Based Molded Interconnect Devices Market by Process
- 14.5.2 Singapore LCP Based Molded Interconnect Devices Market by Product
- 14.5.3 Singapore LCP Based Molded Interconnect Devices Market by End Use
- 14.6 Malaysia LCP Based Molded Interconnect Devices Market
- 14.6.1 Malaysia LCP Based Molded Interconnect Devices Market by Process
- 14.6.2 Malaysia LCP Based Molded Interconnect Devices Market by Product
- 14.6.3 Malaysia LCP Based Molded Interconnect Devices Market by End Use
- 14.7 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market
- 14.7.1 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market by Process
- 14.7.2 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market by Product
- 14.7.3 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market by End Use
Chapter 15. Company Profiles
- 15.1 Molex, LLC (Koch Industries, Inc.)
- 15.1.1 Company Overview
- 15.1.2 SWOT Analysis
- 15.2 TE Connectivity Ltd.
- 15.2.1 Company Overview
- 15.2.2 Financial Analysis
- 15.2.3 Segmental and Regional Analysis
- 15.2.4 Research & Development Expense
- 15.2.5 SWOT Analysis
- 15.3 Kyocera Corporation
- 15.3.1 Company Overview
- 15.3.2 Financial Analysis
- 15.3.3 Segmental and Regional Analysis
- 15.3.4 Research & Development Expenses
- 15.3.5 SWOT Analysis
- 15.4 Amphenol Corporation
- 15.4.1 Company Overview
- 15.4.2 Financial Analysis
- 15.4.3 Segmental and Regional Analysis
- 15.4.4 Research & Development Expenses
- 15.4.5 SWOT Analysis
- 15.5 Sumitomo Electric Industries, Ltd.
- 15.5.1 Company Overview
- 15.5.2 Financial Analysis
- 15.5.3 Segmental and Regional Analysis
- 15.5.4 Research & Development Expenses
- 15.5.5 SWOT Analysis
- 15.6 Taoglas
- 15.6.1 Company Overview
- 15.7 HARTING Technology Group
- 15.7.1 Company Overview
- 15.8 LPKF Laser & Electronics SE
- 15.8.1 Company Overview
- 15.8.2 Financial Analysis
- 15.8.3 Segmental and Regional Analysis
- 15.8.4 Research & Development Expenses
- 15.9 Celanese Corporation
- 15.9.1 Company Overview
- 15.9.2 Financial Analysis
- 15.9.3 Segmental and Regional Analysis
- 15.9.4 Research & Development Expenses
- 15.9.5 SWOT Analysis
- 15.10. Solvay SA
- 15.10.1 Company Overview
- 15.10.2 Financial Analysis
- 15.10.3 Segmental Regional Analysis
- 15.10.4 Research & Development Expenses
- 15.10.5 SWOT Analysis
LIST OF TABLES
- TABLE 1 Asia Pacific LCP Based Molded Interconnect Devices Market, 2021 - 2024, USD Million
- TABLE 2 Asia Pacific LCP Based Molded Interconnect Devices Market, 2025 - 2032, USD Million
- TABLE 3 Key Customer Criteria - LCP Based Molded Interconnect Devices Market
- TABLE 4 Asia Pacific LCP Based Molded Interconnect Devices Market by Process, 2021 - 2024, USD Million
- TABLE 5 Asia Pacific LCP Based Molded Interconnect Devices Market by Process, 2025 - 2032, USD Million
- TABLE 6 Asia Pacific Laser Direct Structuring (LDS) Market by Country, 2021 - 2024, USD Million
- TABLE 7 Asia Pacific Laser Direct Structuring (LDS) Market by Country, 2025 - 2032, USD Million
- TABLE 8 Asia Pacific Two-Shot Molding Market by Country, 2021 - 2024, USD Million
- TABLE 9 Asia Pacific Two-Shot Molding Market by Country, 2025 - 2032, USD Million
- TABLE 10 Asia Pacific Other Process Market by Country, 2021 - 2024, USD Million
- TABLE 11 Asia Pacific Other Process Market by Country, 2025 - 2032, USD Million
- TABLE 12 Asia Pacific LCP Based Molded Interconnect Devices Market by Product, 2021 - 2024, USD Million
- TABLE 13 Asia Pacific LCP Based Molded Interconnect Devices Market by Product, 2025 - 2032, USD Million
- TABLE 14 Asia Pacific Antennas Market by Country, 2021 - 2024, USD Million
- TABLE 15 Asia Pacific Antennas Market by Country, 2025 - 2032, USD Million
- TABLE 16 Asia Pacific Connectors & Interconnects Market by Country, 2021 - 2024, USD Million
- TABLE 17 Asia Pacific Connectors & Interconnects Market by Country, 2025 - 2032, USD Million
- TABLE 18 Asia Pacific Sensor Housings Market by Country, 2021 - 2024, USD Million
- TABLE 19 Asia Pacific Sensor Housings Market by Country, 2025 - 2032, USD Million
- TABLE 20 Asia Pacific Other Product Market by Country, 2021 - 2024, USD Million
- TABLE 21 Asia Pacific Other Product Market by Country, 2025 - 2032, USD Million
- TABLE 22 Asia Pacific LCP Based Molded Interconnect Devices Market by End Use, 2021 - 2024, USD Million
- TABLE 23 Asia Pacific LCP Based Molded Interconnect Devices Market by End Use, 2025 - 2032, USD Million
- TABLE 24 Asia Pacific Automotive Market by Country, 2021 - 2024, USD Million
- TABLE 25 Asia Pacific Automotive Market by Country, 2025 - 2032, USD Million
- TABLE 26 Asia Pacific Consumer Electronics Market by Country, 2021 - 2024, USD Million
- TABLE 27 Asia Pacific Consumer Electronics Market by Country, 2025 - 2032, USD Million
- TABLE 28 Asia Pacific Telecommunication Market by Country, 2021 - 2024, USD Million
- TABLE 29 Asia Pacific Telecommunication Market by Country, 2025 - 2032, USD Million
- TABLE 30 Asia Pacific Aerospace & Defense Market by Country, 2021 - 2024, USD Million
- TABLE 31 Asia Pacific Aerospace & Defense Market by Country, 2025 - 2032, USD Million
- TABLE 32 Asia Pacific Healthcare Market by Country, 2021 - 2024, USD Million
- TABLE 33 Asia Pacific Healthcare Market by Country, 2025 - 2032, USD Million
- TABLE 34 Asia Pacific Other End Use Market by Country, 2021 - 2024, USD Million
- TABLE 35 Asia Pacific Other End Use Market by Country, 2025 - 2032, USD Million
- TABLE 36 Asia Pacific LCP Based Molded Interconnect Devices Market by Country, 2021 - 2024, USD Million
- TABLE 37 Asia Pacific LCP Based Molded Interconnect Devices Market by Country, 2025 - 2032, USD Million
- TABLE 38 China LCP Based Molded Interconnect Devices Market, 2021 - 2024, USD Million
- TABLE 39 China LCP Based Molded Interconnect Devices Market, 2025 - 2032, USD Million
- TABLE 40 China LCP Based Molded Interconnect Devices Market by Process, 2021 - 2024, USD Million
- TABLE 41 China LCP Based Molded Interconnect Devices Market by Process, 2025 - 2032, USD Million
- TABLE 42 China LCP Based Molded Interconnect Devices Market by Product, 2021 - 2024, USD Million
- TABLE 43 China LCP Based Molded Interconnect Devices Market by Product, 2025 - 2032, USD Million
- TABLE 44 China LCP Based Molded Interconnect Devices Market by End Use, 2021 - 2024, USD Million
- TABLE 45 China LCP Based Molded Interconnect Devices Market by End Use, 2025 - 2032, USD Million
- TABLE 46 Japan LCP Based Molded Interconnect Devices Market, 2021 - 2024, USD Million
- TABLE 47 Japan LCP Based Molded Interconnect Devices Market, 2025 - 2032, USD Million
- TABLE 48 Japan LCP Based Molded Interconnect Devices Market by Process, 2021 - 2024, USD Million
- TABLE 49 Japan LCP Based Molded Interconnect Devices Market by Process, 2025 - 2032, USD Million
- TABLE 50 Japan LCP Based Molded Interconnect Devices Market by Product, 2021 - 2024, USD Million
- TABLE 51 Japan LCP Based Molded Interconnect Devices Market by Product, 2025 - 2032, USD Million
- TABLE 52 Japan LCP Based Molded Interconnect Devices Market by End Use, 2021 - 2024, USD Million
- TABLE 53 Japan LCP Based Molded Interconnect Devices Market by End Use, 2025 - 2032, USD Million
- TABLE 54 India LCP Based Molded Interconnect Devices Market, 2021 - 2024, USD Million
- TABLE 55 India LCP Based Molded Interconnect Devices Market, 2025 - 2032, USD Million
- TABLE 56 India LCP Based Molded Interconnect Devices Market by Process, 2021 - 2024, USD Million
- TABLE 57 India LCP Based Molded Interconnect Devices Market by Process, 2025 - 2032, USD Million
- TABLE 58 India LCP Based Molded Interconnect Devices Market by Product, 2021 - 2024, USD Million
- TABLE 59 India LCP Based Molded Interconnect Devices Market by Product, 2025 - 2032, USD Million
- TABLE 60 India LCP Based Molded Interconnect Devices Market by End Use, 2021 - 2024, USD Million
- TABLE 61 India LCP Based Molded Interconnect Devices Market by End Use, 2025 - 2032, USD Million
- TABLE 62 South Korea LCP Based Molded Interconnect Devices Market, 2021 - 2024, USD Million
- TABLE 63 South Korea LCP Based Molded Interconnect Devices Market, 2025 - 2032, USD Million
- TABLE 64 South Korea LCP Based Molded Interconnect Devices Market by Process, 2021 - 2024, USD Million
- TABLE 65 South Korea LCP Based Molded Interconnect Devices Market by Process, 2025 - 2032, USD Million
- TABLE 66 South Korea LCP Based Molded Interconnect Devices Market by Product, 2021 - 2024, USD Million
- TABLE 67 South Korea LCP Based Molded Interconnect Devices Market by Product, 2025 - 2032, USD Million
- TABLE 68 South Korea LCP Based Molded Interconnect Devices Market by End Use, 2021 - 2024, USD Million
- TABLE 69 South Korea LCP Based Molded Interconnect Devices Market by End Use, 2025 - 2032, USD Million
- TABLE 70 Singapore LCP Based Molded Interconnect Devices Market, 2021 - 2024, USD Million
- TABLE 71 Singapore LCP Based Molded Interconnect Devices Market, 2025 - 2032, USD Million
- TABLE 72 Singapore LCP Based Molded Interconnect Devices Market by Process, 2021 - 2024, USD Million
- TABLE 73 Singapore LCP Based Molded Interconnect Devices Market by Process, 2025 - 2032, USD Million
- TABLE 74 Singapore LCP Based Molded Interconnect Devices Market by Product, 2021 - 2024, USD Million
- TABLE 75 Singapore LCP Based Molded Interconnect Devices Market by Product, 2025 - 2032, USD Million
- TABLE 76 Singapore LCP Based Molded Interconnect Devices Market by End Use, 2021 - 2024, USD Million
- TABLE 77 Singapore LCP Based Molded Interconnect Devices Market by End Use, 2025 - 2032, USD Million
- TABLE 78 Malaysia LCP Based Molded Interconnect Devices Market, 2021 - 2024, USD Million
- TABLE 79 Malaysia LCP Based Molded Interconnect Devices Market, 2025 - 2032, USD Million
- TABLE 80 Malaysia LCP Based Molded Interconnect Devices Market by Process, 2021 - 2024, USD Million
- TABLE 81 Malaysia LCP Based Molded Interconnect Devices Market by Process, 2025 - 2032, USD Million
- TABLE 82 Malaysia LCP Based Molded Interconnect Devices Market by Product, 2021 - 2024, USD Million
- TABLE 83 Malaysia LCP Based Molded Interconnect Devices Market by Product, 2025 - 2032, USD Million
- TABLE 84 Malaysia LCP Based Molded Interconnect Devices Market by End Use, 2021 - 2024, USD Million
- TABLE 85 Malaysia LCP Based Molded Interconnect Devices Market by End Use, 2025 - 2032, USD Million
- TABLE 86 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market, 2021 - 2024, USD Million
- TABLE 87 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market, 2025 - 2032, USD Million
- TABLE 88 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market by Process, 2021 - 2024, USD Million
- TABLE 89 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market by Process, 2025 - 2032, USD Million
- TABLE 90 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market by Product, 2021 - 2024, USD Million
- TABLE 91 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market by Product, 2025 - 2032, USD Million
- TABLE 92 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market by End Use, 2021 - 2024, USD Million
- TABLE 93 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market by End Use, 2025 - 2032, USD Million
- TABLE 94 Key Information - Molex, LLC
- TABLE 95 Key information -TE Connectivity Ltd.
- TABLE 96 Key Information - Kyocera Corporation
- TABLE 97 key information - Amphenol Corporation
- TABLE 98 Key Information - Sumitomo Electric Industries, Ltd.
- TABLE 99 Key Information - Taoglas
- TABLE 100 Key Information - HARTING Technology Group
- TABLE 101 Key Information - LPKF Laser & Electronics SE
- TABLE 102 Key Information - Celanese Corporation
- TABLE 103 Key Information - Solvay SA
LIST OF FIGURES
- FIG 1 Methodology for the research
- FIG 2 Asia Pacific LCP Based Molded Interconnect Devices Market, 2021 - 2032, USD Million
- FIG 3 Key Factors Impacting asia pacific LCP Based Molded Interconnect Devices Market
- FIG 4 Value Chain Analysis of LCP Based Molded Interconnect Devices Market
- FIG 5 Market Share Analysis, 2024
- FIG 6 Porter's Five Forces Analysis - LCP Based Molded Interconnect Devices Market
- FIG 7 Product Life Cycle - LCP Based Molded Interconnect Devices Market
- FIG 8 Market Consolidation - LCP Based Molded Interconnect Devices Market
- FIG 9 Key Customer Criteria - LCP Based Molded Interconnect Devices Market
- FIG 10 Asia Pacific LCP Based Molded Interconnect Devices Market share by Process, 2024
- FIG 11 Asia Pacific LCP Based Molded Interconnect Devices Market share by Process, 2032
- FIG 12 Asia Pacific LCP Based Molded Interconnect Devices Market by Process, 2021 - 2032, USD Million
- FIG 13 Asia Pacific LCP Based Molded Interconnect Devices Market share by Product, 2024
- FIG 14 Asia Pacific LCP Based Molded Interconnect Devices Market share by Product, 2032
- FIG 15 Asia Pacific LCP Based Molded Interconnect Devices Market by Product, 2021 - 2032, USD Million
- FIG 16 Asia Pacific LCP Based Molded Interconnect Devices Market share by End Use, 2024
- FIG 17 Asia Pacific LCP Based Molded Interconnect Devices Market share by End Use, 2032
- FIG 18 Asia Pacific LCP Based Molded Interconnect Devices Market by End Use, 2021 - 2032, USD Million
- FIG 19 Asia Pacific LCP Based Molded Interconnect Devices Market share by Country, 2024
- FIG 20 Asia Pacific LCP Based Molded Interconnect Devices Market share by Country, 2032
- FIG 21 Asia Pacific LCP Based Molded Interconnect Devices Market by Country, 2021 - 2032, USD Million
- FIG 22 SWOT Analysis: Molex, LLC
- FIG 23 SWOT Analysis: TE Connectivity Ltd.
- FIG 24 SWOT Analysis: Kyocera Corporation
- FIG 25 SWOT Analysis: Amphenol Corporation
- FIG 26 SWOT Analysis: Sumitomo Electric Industries, Ltd.
- FIG 27 SWOT Analysis: Celanese Corporation
- FIG 28 SWOT Analysis: Solvay SA
