Semiconductor Packaging and Assembly Equipment Market - Forecasts from 2025 to 2030

The global semiconductor packaging and assembly equipment market is projected to grow at a CAGR of 4.60% during the forecast period, reaching US$5,217.123 million in 2025 and increasing to US$6,532.643 million by 2030.

The increasing application of semiconductor-integrated chips across various industries is driving this market's growth. The ever-changing market, which demands multiple functions that can be performed by semiconductor-integrated chips, is growing. In addition, the rising number of mergers and acquisitions in the market, the increasing adoption of these chips in automobiles, and technological developments within the semiconductor industry are current market trends that are driving global demand for semiconductor packaging and assembly equipment.

Market Trends:

• The growing demand for die-bonding equipment is driving market expansion.

The market for die-bonding equipment is expected to see substantial growth during the forecast period, spurred by the increasing need for semiconductor-integrated chips. Rising sales of mobile and consumer electronics are boosting the semiconductor market, while emerging technologies like the Internet of Things (IoT), machine-to-machine communication, ultra-high-definition TVs, hybrid laptops, and vehicle automation are further amplifying the demand for these chips. This heightened demand for semiconductor-integrated chips is, in turn, increasing the need for packaging and assembly equipment, thereby accelerating market growth. A key trend gaining momentum in the die-bonding sector is the automation of automobiles, which relies on various semiconductor chips for functions such as airbag control, automatic braking, GPS, power windows and doors, car navigation, displays, and autonomous driving. This trend is heightening the need for innovative, power-efficient, and reliable semiconductor devices, necessitating advanced packaging solutions like die bonders.

• Technological advancements are also contributing to market growth.

Continuous improvements in semiconductor technology, such as the development of smaller, more powerful chips, are driving demand for more advanced assembly process equipment. The surging popularity of smartphones, laptops, tablets, and other consumer electronics is increasing the need for semiconductor assembly equipment to support production demands. Additionally, the widespread adoption of AI and IoT technologies across industries is fueling the demand for semiconductors, further boosting the need for assembly process equipment.

• The Asia Pacific region is poised to lead the global semiconductor packaging and assembly equipment market, due to the presence of major industry players. The IoT is expected to play a pivotal role in driving this market's growth in the region. With access to plentiful, cost-effective local hardware and software, and fewer outdated technologies to phase out, Asia Pacific is well-positioned for growth. By replicating successful IoT initiatives pioneered in Europe and leveraging affordable technology, the region has the potential to become a global leader in industrialized IoT applications, further strengthening its semiconductor packaging and assembly equipment market.

Some of the major players covered in this report include Amkor Technology Inc., Toshiba Corporation, Qualcomm Technologies, Inc., Disco Corporation, Rudolph Technologies, Inc., ChipMOS Technologies Inc., Powertech Technologies, Inc., Renesas Electronics Corporation, among others.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

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Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

Global Semiconductor Packaging and Assembly Equipment Market Segmentation:

By Type

• Plating Equipment
• Inspection and Dicing Equipment
• Wire Bonding Equipment
• Die Bonding Equipment
• Others

By Application

• Consumer Electronics
• Healthcare Devices
• Automotive Application
• Enterprise Storage
• Industrial Application

By Geography

• Americas
• US
• Europe, Middle East, and Africa
• Germany
• Netherlands
• Others
• Asia Pacific
• China
• Japan
• Taiwan
• South Korea
• Others