Fan Out Packaging Report: Trends, Forecast and Competitive Analysis to 2030

Fan Out Packaging Trends and Forecast

The future of the global fan out packaging market looks promising with opportunities in the OSAT, foundary, and IDM markets. The global fan out packaging market is expected to reach an estimated $6.8 billion by 2030 with a CAGR of 15.7% from 2024 to 2030. The major drivers for this market are growing applications in footprint sensitive devices like smartphones, owing to requirement of high performing, energy efficient, thin, and small form factor packages.

A more than 150-page report is developed to help in your business decisions.

Fan Out Packaging by Segment

The study includes a forecast for the global fan out packaging by type, carrier ttype, business model, and region

Fan Out Packaging Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Core Fan-Out
• High-Density Fan-Out
• Ultra High-density Fan Out

Fan Out Packaging Market by Carrier Type [Shipment Analysis by Value from 2018 to 2030]:

• 200 mm
• 300 mm
• Panel

Fan Out Packaging Market by Business Model [Shipment Analysis by Value from 2018 to 2030]:

• OSAT
• Foundary
• IDM

Fan Out Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Fan Out Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies fan out packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the fan out packaging companies profiled in this report include-

• Taiwan Semiconductor
• Jiangsu Changjiang Electronics
• Samsung Electro-Mechanics
• Powertech Technology
• Amkor Technology
• Advanced Semiconductor
• Nepes Corporation

Fan Out Packaging Market Insights

Lucintel forecast that high-density fan out will remain the largest segment over the forecast period as it helps in meeting the requirement of miniaturization by fabrication capabilities of wafer-level processing along with its ability to develop 3D structures utilizing through-mold interconnects, such as tall copper (CU) pillars and through package vias (TPVS) and advanced flip chip packaging technologies.

Within this market, foundary will remain the largest segment.

APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturers in the region.

Features of the Global Fan Out Packaging Market

Market Size Estimates: Fan out packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Fan out packaging market size by type, carrier type, business model, and region in terms of value ($B).

Regional Analysis: Fan out packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, carrier types, business models, and regions for the fan out packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the fan out packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the fan out packaging market size?

Answer: The global fan out packaging market is expected to reach an estimated $6.8 billion by 2030.

Q.2 What is the growth forecast for fan out packaging market?

Answer: The global fan out packaging market is expected to grow with a CAGR of 15.7% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the fan out packaging market?

Answer: The major drivers for this market are growing applications in footprint sensitive devices like smartphones, owing to requirement of high performing, energy efficient, thin, and small form factor packages.

Q4. What are the major segments for fan out packaging market?

Answer: The future of the fan out packaging market looks promising with opportunities in the OSAT, foundary, IDM markets.

Q5. Who are the key fan out packaging market companies?

Answer: Some of the key fan out packaging companies are as follows:

• Taiwan Semiconductor
• Jiangsu Changjiang Electronics
• Samsung Electro-Mechanics
• Powertech Technology
• Amkor Technology
• Advanced Semiconductor
• Nepes Corporation

Q6. Which fan out packaging market segment will be the largest in future?

Answer: Lucintel forecast that high-density fan out will remain the largest segment over the forecast period as it helps in meeting the requirement of miniaturization by fabrication capabilities of wafer-level processing along with its ability to develop 3D structures utilizing through-mold interconnects, such as tall copper (CU) pillars and through package vias (TPVS) and advanced flip chip packaging technologies.

Q7. In fan out packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturers in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the fan out packaging market by type (core fan-out, high-density fan-out, and ultra high-density fan out), carrier type (200 mm, 300 mm, and panel), business model (OSAT, foundary, and IDM), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?