PUBLISHER: Lucintel | PRODUCT CODE: 1418039
PUBLISHER: Lucintel | PRODUCT CODE: 1418039
Embedded Chip Packaging Trends and Forecast
The future of the global embedded chip packaging market looks promising with opportunities in the tiny package and system-in-boards markets. The global embedded chip packaging market is expected to grow with a CAGR of 20.7% from 2024 to 2030. The major drivers for this market are continuous advancements in semiconductor packaging, include fan-out wafer-level packaging (FOWLP), system-in-package (SiP), 3D packaging, and heterogeneous integration, growing demand for thinner and smaller electronics across a variety of sectors, including wearables, smartphones, Internet of Things, and automotive electronics, as well as, increasing expectations from customers for improved usefulness and performance in electronic devices.
A more than 150-page report is developed to help in your business decisions.
Embedded Chip Packaging by Segment
The study includes a forecast for the global embedded chip packaging by type, application, and region.
List of Embedded Chip Packaging Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies embedded chip packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the embedded chip packaging companies profiled in this report include-
Embedded Chip Packaging
Lucintel forecasts that single chip is expected to witness highest growth over the forecast period because the packages offer a simpler and more economical solution compared to multi-chip or other complex configurations.
APAC is expected to witness highest growth over the forecast period because the major manufacturers of electronics, like Apple, Samsung, and Huawei, have substantial production bases in the region, especially in China, owing to strong need for cutting-edge packaging options like integrated chips.
Features of the Global Embedded Chip Packaging Market
Market Size Estimates: Embedded chip packaging market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Embedded chip packaging market size by type, application, and region in terms of value ($B).
Regional Analysis: Embedded chip packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the embedded chip packaging market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the embedded chip packaging market.
Analysis of competitive intensity of the industry based on Porter's Five Forces model.
FAQ
Q1. What is the growth forecast for embedded chip packaging market?
Answer: The global embedded chip packaging market is expected to grow with a CAGR of 20.7% from 2024 to 2030.
Q2. What are the major drivers influencing the growth of the embedded chip packaging market?
Answer: The major drivers for this market are continuous advancements in semiconductor packaging, include fan-out wafer-level packaging (FOWLP), system-in-package (SiP), 3D packaging, and heterogeneous integration, growing demand for thinner and smaller electronics across a variety of sectors, including wearables, smartphones, Internet of Things, and automotive electronics, as well as, increasing expectations from customers for improved usefulness and performance in electronic devices.
Q3. What are the major segments for embedded chip packaging market?
Answer: The future of the global embedded chip packaging market looks promising with opportunities in the tiny package and system-in-boards markets.
Q4. Who are the key embedded chip packaging market companies?
Answer: Some of the key embedded chip packaging companies are as follows.
Q5. Which embedded chip packaging market segment will be the largest in future?
Answer: Lucintel forecasts that single chip is expected to witness highest growth over the forecast period because the packages offer a simpler and more economical solution compared to multi-chip or other complex configurations.
Q6. In embedded chip packaging market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness highest growth over the forecast period because the major manufacturers of electronics, like Apple, Samsung, and Huawei, have substantial production bases in the region, especially in China, owing to strong need for cutting-edge packaging options like integrated chips.
Q7. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.