Semiconductor Bonding Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030

Semiconductor Bonding Equipment Trends and Forecast

The future of the global semiconductor bonding equipment market looks promising with opportunities in the advanced packaging, power IC and power discrete, photonic device, MEMs sensors and actuators, engineered substrates, CMOS image sensor markets. The global semiconductor bonding equipment market is expected to reach an estimated $1.1 billion by 2030 with a CAGR of 10.8% from 2024 to 2030. The major drivers for this market are growing need for semiconductor devices with reduced footprints, more processing power, and improved efficiency, increasing investments in research and development activities by semiconductor manufacturers, as well as, rising adoption of semiconductor chips in various industries, including automotive, healthcare, and industrial.

A more than 150-page report is developed to help in your business decisions.

Semiconductor Bonding Equipment by Segment

The study includes a forecast for the global semiconductor bonding equipment by type, application, and region.

Semiconductor Bonding Equipment Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Permanent Bonding Equipment
• Temporary Bonding Equipment
• Hybrid Bonding Equipment

Semiconductor Bonding Equipment Market by Application [Shipment Analysis by Value from 2018 to 2030]:

• Advanced Packaging
• Power IC and Power Discrete
• Photonic Devices
• MEMS Sensors and Actuators
• Engineered Substrates
• CMOS Image Sensors

Semiconductor Bonding Equipment Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Semiconductor Bonding Equipment Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor bonding equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor bonding equipment companies profiled in this report include-

• EV Group
• ASMPT Semiconductor Solutions
• MRSI Systems
• WestBond
• Panasonic Industry
• Palomar Technologies
• Dr. Tresky
• BE Semiconductor Industries
• Fasford Technology
• Kulicke and Soffa Industries

Semiconductor Bonding Equipment Market Insights

Lucintel forecasts that hybrid bonding equipment is expected to witness the highest growth over the forecast period because it can deliver superior electrical and thermal performance compared to traditional methods.

APAC is expected to witness highest growth over the forecast period due to strategic investments by key domestic suppliers and the well-established semiconductor sector in the region.

Features of the Global Semiconductor Bonding Equipment Market

Market Size Estimates: Semiconductor bonding equipment market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Semiconductor bonding equipment market size by type, application, and region in terms of value ($B).

Regional Analysis: Semiconductor bonding equipment market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the semiconductor bonding equipment market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the semiconductor bonding equipment market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the semiconductor bonding equipment market size?

Answer: The global semiconductor bonding equipment market is expected to reach an estimated $1.1 billion by 2030.

Q2. What is the growth forecast for semiconductor bonding equipment market?

Answer: The global semiconductor bonding equipment market is expected to grow with a CAGR of 10.8% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the semiconductor bonding equipment market?

Answer: The major drivers for this market are growing need for semiconductor devices with reduced footprints, more processing power, and improved efficiency, increasing investments in research and development activities by semiconductor manufacturers, as well as, rising adoption of semiconductor chips in various industries, including automotive, healthcare, and industrial.

Q4. What are the major segments for semiconductor bonding equipment market?

Answer: The future of the global semiconductor bonding equipment market looks promising with opportunities in the advanced packaging, power IC and power discrete, photonic device, MEMs sensors and actuators, engineered substrates, CMOS image sensor markets.

Q5. Who are the key semiconductor bonding equipment market companies?

Answer: Some of the key semiconductor bonding equipment companies are as follows.

• EV Group
• ASMPT Semiconductor Solutions
• MRSI Systems
• WestBond
• Panasonic Industry
• Palomar Technologies
• Dr. Tresky
• BE Semiconductor Industries
• Fasford Technology
• Kulicke and Soffa Industries

Q6. Which semiconductor bonding equipment market segment will be the largest in future?

Answer: Lucintel forecasts that hybrid bonding equipment is expected to witness the highest growth over the forecast period because it can deliver superior electrical and thermal performance compared to traditional methods.

Q7. In semiconductor bonding equipment market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to strategic investments by key domestic suppliers and the well-established semiconductor sector in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the semiconductor bonding equipment market by type (permanent bonding equipment, temporary bonding equipment, and hybrid bonding equipment), application (advanced packaging, power IC and power discrete, photonic devices, MEMS sensors and actuators, engineered substrates, and CMOS image sensors), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?