Package Substrate Market Report: Trends, Forecast and Competitive Analysis to 2030

Package Substrate Trends and Forecast

The future of the global package substrate market looks promising with opportunities in the mobile device and automotive markets. The global package substrate market is expected to grow with a CAGR of 6.8% from 2024 to 2030. The major drivers for this market are rising trend of miniaturization of electronic devices, growing adoption of advanced packaging technologies, and increasing demand for high-performance memory devices.

A more than 150-page report is developed to help in your business decisions.

Package Substrate by Segment

The study includes a forecast for the global package substrate by type, application, and region.

Package Substrate Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Flip Chip Chip Scale Package
• Wire Bonding Chip Scale Package
• Ball Over Chip
• System In Package
• Flip Chip-Ball Grid Array

Package Substrate Market by Application [Shipment Analysis by Value from 2018 to 2030]:

• Mobile Devices
• Automotive Industry
• Others

Package Substrate Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Package Substrate Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies package substrate companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the package substrate companies profiled in this report include-

• Ibiden
• Shinko Electric Industries
• Kyocera
• Samsung Electro-Mechanics
• Fujitsu
• Hitachi
• Eastern
• LG Innotek
• Simmtech
• Daeduck

Package Substrate Market Insights

Lucintel forecasts that flip chip chip scale package is expected to witness the highest growth over the forecast period due to its improved thermal conductivity and low manufacturing cost.

Within this market, automotive is expected to witness the higher growth due to increasing usage in communication control and data processing applications.

APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturing and electronics production hubs in the region.

Features of the Global Package Substrate Market

Market Size Estimates: Package substrate market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Package substrate market size by type, application, and region in terms of value ($B).

Regional Analysis: Package substrate market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the package substrate market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the package substrate market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for package substrate market?

Answer: The global package substrate market is expected to grow with a CAGR of 6.8% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the package substrate market?

Answer: The major drivers for this market are rising trend of miniaturization of electronic devices, growing adoption of advanced packaging technologies, and increasing demand for high-performance memory devices.

Q3. What are the major segments for package substrate market?

Answer: The future of the global package substrate market looks promising with opportunities in the mobile device and automotive markets.

Q4. Who are the key package substrate market companies?

Answer: Some of the key package substrate companies are as follows.

• Ibiden
• Shinko Electric Industries
• Kyocera
• Samsung Electro-Mechanics
• Fujitsu
• Hitachi
• Eastern
• LG Innotek
• Simmtech
• Daeduck

Q5. Which package substrate market segment will be the largest in future?

Answer: Lucintel forecasts that flip chip chip scale package is expected to witness the highest growth over the forecast period due to its improved thermal conductivity and low manufacturing cost.

Q6. In package substrate market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturing and electronics production hubs in the region.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the package substrate market by type (flip chip chip scale package, wire bonding chip scale package, ball over chip, system in package, and flip chip-ball grid array), application (mobile devices, automotive industry, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?