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Semiconductor Manufacturing & Equipment

PUBLISHER: MarketsandMarkets | PRODUCT CODE: 1424580

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PUBLISHER: MarketsandMarkets | PRODUCT CODE: 1424580

Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design, Packaging, Device, Industry - Global Forecast to 2029

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Table of Contents

The global interposer and FOWLP market is expected to be valued at USD 35.6 billion in 2024 and is projected to reach USD 63.5 billion by 2029; it is expected to grow at a CAGR of 12.3% from 2024 to 2029. Increasing demand for advanced packaging in AI and high-performance computing serves as a significant driver for the Interposer and FOWLP market.

Scope of the Report
Years Considered for the Study2020-2029
Base Year2023
Forecast Period2024-2029
Units ConsideredValue (USD Billion)
SegmentsBy Component, Offering, Industry and Re By Packaging Component & Design, Device, Industry and Region
Regions coveredAsia Pacific, North America, Europe, RoW

"3D packaging by packaging type segment to account higher CAGR in Interposer and FOWLP market during the forecast period"

The semiconductor packaging industry is witnessing a surge in 3D packaging due to its ability to enhance performance, reduce form factor, and address challenges associated with traditional 2D packaging. As demand for compact and powerful electronic devices increases, 3D packaging technologies, such as stacked integrated circuits and through-silicon vias, are gaining prominence for their efficiency in meeting these evolving market needs.

"Consumer Electronics to hold the largest share in Interposer and FOWLP market in 2029"

Semiconductor packaging plays a crucial role in consumer electronics by enabling miniaturization, improved performance, and energy efficiency. The demand for smaller, more powerful, and energy-efficient devices, such as smartphones and wearables, is driving continuous innovation in semiconductor packaging technologies to meet the evolving requirements of the consumer electronics market.

"Asia Pacific region growing at highest CAGR in Interposer and FOWLP market"

The growth of semiconductor packaging in Asia Pacific can be attributed to the region's strong presence in electronics manufacturing, the availability of skilled labor, and the establishment of advanced packaging facilities by major semiconductor companies seeking cost-effective production and proximity to key markets. Additionally, supportive government policies and investment in research and development contribute to the region's prominence in semiconductor packaging.

The study contains insights from various industry experts, ranging from component suppliers to Tier 1 companies and OEMs. The break-up of the primaries is as follows:

  • By Company Type: Tier 1 - 38%, Tier 2 - 28%, and Tier 3 - 34%
  • By Designation: C-level Executives - 40%, Directors - 30%, and Others - 30%
  • By Region: North America - 35%, Europe - 20%, Asia Pacific - 35%, and RoW - 10%

The key players operating in the Interposer and FOWLP market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), among others.

Research Coverage:

The research reports the Interposer and FOWLP Market, by Packaging Component & Design (Interposer, FOWLP); Packaging Type (2.5D,3D); Device Type (Logic ICs, Imaging & Optoelectronics, LEDs, MEMS/Sensors, Memory Devices and Other Device Types), End-user Industry (Consumer Electronics, Communications, Manufacturing, Automotive, Medical Devices, Aerospace); Region (North America, Europe, Asia Pacific, RoW)

The scope of the report covers detailed information regarding the major factors, such as drivers, restraints, challenges, and opportunities, influencing the growth of the interposer and FOWLP market. A detailed analysis of the key industry players has been done to provide insights into their business overviews, products, key strategies, contracts, partnerships, and agreements. New product & service launches, mergers and acquisitions, and recent developments associated with the Interposer and FOWLP market. Competitive analysis of upcoming startups in the Interposer and FOWLP market ecosystem is covered in this report.

Key Benefits of Buying the Report

  • Analysis of key drivers (Rising trend of miniaturization and form factor requirements; Increasing demand for advanced packaging in AI and high-performance computing; Growing demand for consumer electronics and gaming devices; Cost advantages offered by advanced packaging), restraints (Environmental concerns due to the usage of certain materials and chemicals; Complex manufacturing process), opportunities (Growing demand for IoT devices and wearables; Integration of advanced electronics in automobiles), and challenges (Thermal issues in wafer level packaging; Complexities in supply chain) influencing the growth of the Interposer and FOWLP market.
  • Product Development/Innovation: Detailed insights on upcoming technologies, research and development activities, and new product launches in the Interposer and FOWLP market
  • Market Development: Comprehensive information about lucrative markets - the report analyses the Interposer and FOWLP market across varied regions.
  • Market Diversification: Exhaustive information about new products/services, untapped geographies, recent developments, and investments in the Interposer and FOWLP market
  • Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players like Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), among others in the interposers and FOWLP market.
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Product Code: SE 5184

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 STUDY OBJECTIVES
  • 1.2 MARKET DEFINITION
  • 1.3 INCLUSIONS AND EXCLUSIONS
  • 1.4 STUDY SCOPE
    • FIGURE 1 INTERPOSER AND FOWLP MARKET SEGMENTATION
    • 1.4.1 REGIONAL SCOPE
    • 1.4.2 YEARS CONSIDERED
    • 1.4.3 CURRENCY CONSIDERED
    • 1.4.4 UNITS CONSIDERED
  • 1.5 LIMITATIONS
  • 1.6 STAKEHOLDERS
  • 1.7 SUMMARY OF CHANGES
  • 1.8 IMPACT OF RECESSION

2 RESEARCH METHODOLOGY

  • 2.1 RESEARCH DATA
    • FIGURE 2 INTERPOSER AND FOWLP MARKET: RESEARCH DESIGN
    • 2.1.1 SECONDARY AND PRIMARY RESEARCH
    • 2.1.2 SECONDARY DATA
      • 2.1.2.1 List of major secondary sources
      • 2.1.2.2 Key data from secondary sources
    • 2.1.3 PRIMARY DATA
      • 2.1.3.1 Breakdown of primaries
      • 2.1.3.2 Key data from primary sources
      • 2.1.3.3 Key industry insights
      • 2.1.3.4 List of primary interview participants
  • 2.2 MARKET SIZE ESTIMATION METHODOLOGY
    • FIGURE 3 INTERPOSER AND FOWLP MARKET: MARKET SIZE ESTIMATION METHODOLOGY
    • 2.2.1 BOTTOM-UP APPROACH
      • 2.2.1.1 Approach to arrive at market size using bottom-up analysis (demand side)
    • FIGURE 4 INTERPOSER AND FOWLP MARKET: BOTTOM-UP APPROACH
    • 2.2.2 TOP-DOWN APPROACH
      • 2.2.2.1 Approach to arrive at market size using top-down analysis (supply side)
    • FIGURE 5 INTERPOSER AND FOWLP MARKET: TOP-DOWN APPROACH
    • FIGURE 6 INTERPOSER AND FOWLP MARKET: SUPPLY-SIDE ANALYSIS
  • 2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
    • FIGURE 7 INTERPOSER AND FOWLP MARKET: DATA TRIANGULATION
  • 2.4 RESEARCH ASSUMPTIONS
    • TABLE 1 INTERPOSER AND FOWLP MARKET: RESEARCH ASSUMPTIONS
  • 2.5 RESEARCH LIMITATIONS
    • FIGURE 8 INTERPOSER AND FOWLP MARKET: RESEARCH LIMITATIONS
  • 2.6 RISK ASSESSMENT
    • TABLE 2 INTERPOSER AND FOWLP MARKET: RISK ASSESSMENT
  • 2.7 PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET
    • TABLE 3 INTERPOSER AND FOWLP MARKET: PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET

3 EXECUTIVE SUMMARY

    • FIGURE 9 CONSUMER ELECTRONICS TO HOLD LARGEST SHARE OF INTERPOSER AND FOWLP MARKET IN 2029
    • FIGURE 10 MEMS/SENSORS TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
    • FIGURE 11 2.5D PACKAGING TYPE TO ACCOUNT FOR LARGER MARKET SHARE IN 2024
    • FIGURE 12 INTERPOSER AND FOWLP PACKAGING MARKET IN ASIA PACIFIC TO RECORD HIGHEST CAGR FROM 2024 TO 2029

4 PREMIUM INSIGHTS

  • 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN INTERPOSER AND FOWLP MARKET
    • FIGURE 13 GROWING DEMAND FOR CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH
  • 4.2 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN
    • FIGURE 14 INTERPOSERS TO ACCOUNT FOR LARGER MARKET SHARE IN 2029
  • 4.3 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY
    • FIGURE 15 MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
  • 4.4 INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC, BY END-USER INDUSTRY AND COUNTRY
    • FIGURE 16 CONSUMER ELECTRONICS END-USER INDUSTRY AND CHINA HELD LARGEST SHARES OF INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC IN 2023
  • 4.5 INTERPOSER AND FOWLP MARKET, BY COUNTRY
    • FIGURE 17 CHINA TO REGISTER HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD

5 MARKET OVERVIEW

  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    • FIGURE 18 INTERPOSER AND FOWLP MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
    • 5.2.1 DRIVERS
      • 5.2.1.1 Surging demand for miniaturized electronic devices
      • 5.2.1.2 Growing reliance on AI and high-performance computing technologies
      • 5.2.1.3 Rising popularity of esports and game streaming platforms
    • FIGURE 19 NUMBER OF GLOBAL SMARTPHONE AND MOBILE PHONE USERS, 2020-2025
      • 5.2.1.4 Increasing focus on developing advanced chip packaging techniques
    • FIGURE 20 IMPACT ANALYSIS: DRIVERS
    • 5.2.2 RESTRAINTS
      • 5.2.2.1 Environmental concerns associated with use of chemicals in interposer production facilities
      • 5.2.2.2 Requirement for advanced and high-cost manufacturing techniques
    • FIGURE 21 IMPACT ANALYSIS: RESTRAINTS
    • 5.2.3 OPPORTUNITIES
      • 5.2.3.1 Growing demand for wearable IoT devices
      • 5.2.3.2 Integration of advanced electronics into automobiles
    • FIGURE 22 IMPACT ANALYSIS: OPPORTUNITIES
    • 5.2.4 CHALLENGES
      • 5.2.4.1 Thermal issues in interposer and wafer-level packaging
      • 5.2.4.2 Managing complex semiconductor supply chain
    • FIGURE 23 IMPACT ANALYSIS: CHALLENGES
  • 5.3 SUPPLY CHAIN ANALYSIS
    • FIGURE 24 INTERPOSER AND FOWLP MARKET: SUPPLY CHAIN ANALYSIS
  • 5.4 ECOSYSTEM/MARKET MAP
    • FIGURE 25 KEY PLAYERS IN INTERPOSER AND FOWLP ECOSYSTEM
    • TABLE 4 COMPANIES AND THEIR ROLES IN INTERPOSER AND FOWLP ECOSYSTEM
  • 5.5 PRICING ANALYSIS
    • 5.5.1 AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS
    • FIGURE 26 AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS (USD/THOUSAND UNITS)
    • 5.5.2 AVERAGE SELLING PRICE OF 12-INCH WAFERS
    • TABLE 5 AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019-2023 (USD/THOUSAND UNITS)
    • FIGURE 27 AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019-2023
    • 5.5.3 AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION
    • FIGURE 28 AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION, 2019-2023
  • 5.6 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS' BUSINESSES
    • FIGURE 29 INTERPOSER AND FOWLP MARKET: TRENDS/DISRUPTIONS IMPACTING CUSTOMERS' BUSINESSES
  • 5.7 TECHNOLOGY ANALYSIS
    • 5.7.1 3D STACKING
    • 5.7.2 FAN-OUT PANEL-LEVEL PACKAGING
    • 5.7.3 MONOLITHIC 3D
    • 5.7.4 3D IC
  • 5.8 PORTER'S FIVE FORCES ANALYSIS
    • FIGURE 30 INTERPOSER AND FOWLP MARKET: PORTER'S FIVE FORCES ANALYSIS
    • TABLE 6 INTERPOSER AND FOWLP MARKET: PORTER'S FIVE FORCES ANALYSIS
    • 5.8.1 INTENSITY OF COMPETITIVE RIVALRY
    • 5.8.2 BARGAINING POWER OF SUPPLIERS
    • 5.8.3 BARGAINING POWER OF BUYERS
    • 5.8.4 THREAT OF SUBSTITUTES
    • 5.8.5 THREAT OF NEW ENTRANTS
  • 5.9 KEY STAKEHOLDERS AND BUYING CRITERIA
    • 5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
    • FIGURE 31 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES
    • TABLE 7 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES (%)
    • 5.9.2 BUYING CRITERIA
    • FIGURE 32 KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES
    • TABLE 8 KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES
  • 5.10 CASE STUDY ANALYSIS
    • 5.10.1 SPTS TECHNOLOGIES PARTNERS WITH IMEC TO REDUCE WAFER THINNING COSTS
    • 5.10.2 SEMICONDUCTOR FOUNDRY USES SPTS OMEGA RAPIER XE TO ENHANCE PRODUCTIVITY OF WAFER BACKSIDE VIA REVEAL PROCESS
    • 5.10.3 CHROMALOX, INC. DEVELOPS KAPTON HEATERS TO GAIN CONTROL OVER TEMPERATURE-SENSITIVE ETCHING CHEMICALS
  • 5.11 TRADE ANALYSIS
    • 5.11.1 IMPORT SCENARIO
    • FIGURE 33 IMPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018-2022 (USD MILLION)
    • 5.11.2 EXPORT SCENARIO
    • FIGURE 34 EXPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018-2022 (USD MILLION)
  • 5.12 PATENT ANALYSIS
    • FIGURE 35 INTERPOSER AND FOWLP MARKET: PATENTS APPLIED AND GRANTED, 2013-2023
    • TABLE 9 LIST OF PATENTS IN INTERPOSER AND FOWLP MARKET
  • 5.13 KEY CONFERENCES AND EVENTS, 2024-2025
    • TABLE 10 INTERPOSER AND FOWLP MARKET: LIST OF CONFERENCES AND EVENTS, 2024-2025
  • 5.14 TARIFF, REGULATORY LANDSCAPE, AND STANDARDS
    • 5.14.1 COUNTRY-WISE TARIFF FOR HS CODE 381800-COMPLIANT PRODUCTS
    • TABLE 11 MFN TARIFF FOR PRODUCTS UNDER HS CODE 381800 EXPORTED BY BRAZIL
    • 5.14.2 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 15 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • 5.14.3 REGULATIONS
      • 5.14.3.1 North America
      • 5.14.3.2 Europe
      • 5.14.3.3 Asia Pacific
      • 5.14.3.4 RoW
    • 5.14.4 STANDARDS

6 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN

  • 6.1 INTRODUCTION
    • FIGURE 36 INTERPOSERS TO REGISTER HIGHER CAGR BETWEEN 2024 AND 2029
    • TABLE 16 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD BILLION)
    • TABLE 17 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD BILLION)
  • 6.2 INTERPOSERS
    • TABLE 18 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD BILLION)
    • TABLE 19 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD BILLION)
    • TABLE 20 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT, 2020-2023 (USD MILLION)
    • TABLE 21 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT, 2024-2029 (USD MILLION)
    • TABLE 22 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 23 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
    • 6.2.1 SILICON
      • 6.2.1.1 Implementation of silicon interposers to stack multiple semiconductor dies in single package to foster segmental growth
    • 6.2.2 ORGANIC
      • 6.2.2.1 Adoption of organic interposers to facilitate effective thermal management to accelerate segmental growth
    • 6.2.3 GLASS
      • 6.2.3.1 Use of glass interposers to ensure high-speed electrical data transfer to fuel segmental growth
    • 6.2.4 CERAMIC
      • 6.2.4.1 Trend of electronic device miniaturization to augment demand for ceramic interposers
    • 6.2.5 OTHER INTERPOSERS
  • 6.3 FOWLP
    • 6.3.1 VERSATILITY AND FLEXIBLE DESIGN TO BOOST ADOPTION OF FOWLP TECHNOLOGY
    • TABLE 24 FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD BILLION)
    • TABLE 25 FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD BILLION)
    • TABLE 26 FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 27 FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
    • 6.3.2 SINGLE-DIE
    • 6.3.3 MULTI-DIE

7 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE

  • 7.1 INTRODUCTION
    • FIGURE 37 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE
    • FIGURE 38 3D PACKAGING TYPE TO DEPICT HIGHER CAGR FROM 2024 TO 2029
    • TABLE 28 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD BILLION)
    • TABLE 29 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD BILLION)
  • 7.2 2.5D
    • 7.2.1 ADOPTION OF 2.5D PACKAGING TECHNOLOGY TO ENHANCE PERFORMANCE OF COMPUTING SOLUTIONS TO DRIVE MARKET
    • TABLE 30 2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 31 2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 7.3 3D
    • 7.3.1 USE OF 3D PACKAGING SOLUTIONS IN ADVANCED SEMICONDUCTOR MANUFACTURING FACILITIES TO FUEL SEGMENTAL GROWTH
    • TABLE 32 3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 33 3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)

8 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE

  • 8.1 INTRODUCTION
    • FIGURE 39 MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
    • TABLE 34 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD BILLION)
    • TABLE 35 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD BILLION)
  • 8.2 LOGIC ICS
    • 8.2.1 GROWING DEMAND FOR SMART HOME APPLIANCES TO CONTRIBUTE TO SEGMENTAL GROWTH
    • TABLE 36 LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 37 LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
  • 8.3 IMAGING & OPTOELECTRONICS
    • 8.3.1 RISING POPULARITY OF AUTONOMOUS VEHICLES TO ACCELERATE SEGMENTAL GROWTH
    • TABLE 38 IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 39 IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
  • 8.4 MEMORY DEVICES
    • 8.4.1 INCREASING DEMAND FOR SPECIALIZED AI AND ML HARDWARE COMPONENTS TO DRIVE MARKET
    • TABLE 40 MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 41 MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
  • 8.5 MEMS/SENSORS
    • 8.5.1 ESCALATING ADOPTION OF ADVANCED CONSUMER ELECTRONICS TO FOSTER SEGMENTAL GROWTH
    • TABLE 42 MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 43 MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
  • 8.6 LEDS
    • 8.6.1 INCREASING USE OF LEDS IN TELECOMMUNICATION DEVICES TO PROPEL MARKET
    • TABLE 44 LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 45 LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
  • 8.7 OTHER DEVICE TYPES
    • TABLE 46 OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 47 OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)

9 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY

  • 9.1 INTRODUCTION
    • FIGURE 40 AUTOMOTIVE END-USER INDUSTRY TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET FROM 2024 TO 2029
    • TABLE 48 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD BILLION)
    • TABLE 49 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD BILLION)
  • 9.2 CONSUMER ELECTRONICS
    • 9.2.1 SURGING DEMAND FOR SLEEK AND MULTIFUNCTIONAL ELECTRONIC GADGETS TO DRIVE MARKET
    • TABLE 50 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD MILLION)
    • TABLE 51 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD MILLION)
    • TABLE 52 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD MILLION)
    • TABLE 53 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD MILLION)
    • TABLE 54 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 55 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 9.3 MANUFACTURING
    • 9.3.1 ESCALATING ADOPTION OF SMART MANUFACTURING AND INDUSTRY 4.0 TECHNOLOGIES TO FUEL SEGMENTAL GROWTH
    • TABLE 56 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD MILLION)
    • TABLE 57 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD MILLION)
    • TABLE 58 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD MILLION)
    • TABLE 59 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD MILLION)
    • TABLE 60 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 61 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 9.4 COMMUNICATIONS
    • 9.4.1 INCREASING DEVELOPMENT OF DATA CENTERS TO CONTRIBUTE TO SEGMENTAL GROWTH
    • TABLE 62 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD MILLION)
    • TABLE 63 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD MILLION)
    • TABLE 64 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD MILLION)
    • TABLE 65 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD MILLION)
    • TABLE 66 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 67 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 9.5 AUTOMOTIVE
    • 9.5.1 RISING POPULARITY OF ELECTRIC VEHICLES TO ACCELERATE SEGMENTAL GROWTH
    • TABLE 68 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD MILLION)
    • TABLE 69 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD MILLION)
    • TABLE 70 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD MILLION)
    • TABLE 71 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD MILLION)
    • TABLE 72 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 73 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 9.6 HEALTHCARE
    • 9.6.1 RAPID ADVANCEMENTS IN WEARABLE HEALTHCARE DEVICES TO FOSTER SEGMENTAL GROWTH
    • TABLE 74 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD MILLION)
    • TABLE 75 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD MILLION)
    • TABLE 76 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD MILLION)
    • TABLE 77 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD MILLION)
    • TABLE 78 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 79 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 9.7 AEROSPACE
    • 9.7.1 INCREASING INTEGRATION OF COMPLEX SYSTEMS AND SENSORS INTO AIRCRAFT TO BOOST SEGMENTAL GROWTH
    • TABLE 80 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD MILLION)
    • TABLE 81 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD MILLION)
    • TABLE 82 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD MILLION)
    • TABLE 83 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD MILLION)
    • TABLE 84 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 85 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)

10 INTERPOSER AND FOWLP MARKET, BY REGION

  • 10.1 INTRODUCTION
    • FIGURE 41 ASIA PACIFIC TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET BETWEEN 2024 AND 2029
    • TABLE 86 INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD BILLION)
    • TABLE 87 INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD BILLION)
  • 10.2 NORTH AMERICA
    • FIGURE 42 NORTH AMERICA: INTERPOSER AND FOWLP MARKET SNAPSHOT
    • TABLE 88 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
    • TABLE 89 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
    • TABLE 90 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 91 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
    • TABLE 92 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD MILLION)
    • TABLE 93 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD MILLION)
    • 10.2.1 RECESSION IMPACT ON MARKET IN NORTH AMERICA
    • 10.2.2 US
      • 10.2.2.1 Rising focus on enhancing performance and functionality of electronic devices to drive market
    • 10.2.3 CANADA
      • 10.2.3.1 Growing emphasis on enhancing semiconductor design and manufacturing to contribute to market growth
    • 10.2.4 MEXICO
      • 10.2.4.1 Increasing investment in semiconductor R&D projects to fuel market growth
  • 10.3 EUROPE
    • FIGURE 43 EUROPE: INTERPOSER AND FOWLP MARKET SNAPSHOT
    • TABLE 94 EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
    • TABLE 95 EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
    • TABLE 96 EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 97 EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
    • TABLE 98 EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD MILLION)
    • TABLE 99 EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD MILLION)
    • 10.3.1 RECESSION IMPACT ON MARKET IN EUROPE
    • 10.3.2 UK
      • 10.3.2.1 Rapid advancement in 5G technology to foster market growth
    • 10.3.3 GERMANY
      • 10.3.3.1 Increased adoption of connected cars and smart home devices to accelerate market growth
    • 10.3.4 FRANCE
      • 10.3.4.1 Highly developed transport and communication networks to contribute to market growth
    • 10.3.5 REST OF EUROPE
  • 10.4 ASIA PACIFIC
    • FIGURE 44 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET SNAPSHOT
    • TABLE 100 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
    • TABLE 101 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
    • TABLE 102 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 103 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
    • TABLE 104 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD MILLION)
    • TABLE 105 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD MILLION)
    • 10.4.1 RECESSION IMPACT ON MARKET IN ASIA PACIFIC
    • 10.4.2 CHINA
      • 10.4.2.1 Increasing expansion of automobile and semiconductor manufacturing facilities to propel market
    • 10.4.3 JAPAN
      • 10.4.3.1 Rising production of advanced consumer electronics to boost market growth
    • 10.4.4 SOUTH KOREA
      • 10.4.4.1 Growing number of semiconductor fabrication plants to augment market growth
    • 10.4.5 REST OF ASIA PACIFIC
  • 10.5 ROW
    • TABLE 106 ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 107 ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
    • TABLE 108 ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 109 ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
    • TABLE 110 ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD MILLION)
    • TABLE 111 ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD MILLION)
    • 10.5.1 RECESSION IMPACT ON MARKET IN ROW
    • 10.5.2 MIDDLE EAST & AFRICA
      • 10.5.2.1 High commitment to technological innovation to contribute to market growth
    • 10.5.3 SOUTH AMERICA
      • 10.5.3.1 Increased R&D of advanced packaging technologies to propel market

11 COMPETITIVE LANDSCAPE

  • 11.1 INTRODUCTION
  • 11.2 STRATEGIES ADOPTED BY KEY PLAYERS, 2020-2023
    • TABLE 112 INTERPOSER AND FOWLP MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS, 2020-2023
    • 11.2.1 PRODUCT PORTFOLIO EXPANSION
    • 11.2.2 REGIONAL FOOTPRINT EXPANSION
    • 11.2.3 ORGANIC/INORGANIC GROWTH
  • 11.3 MARKET SHARE ANALYSIS, 2023
    • TABLE 113 INTERPOSER AND FOWLP MARKET: DEGREE OF COMPETITION
  • 11.4 REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018-2022
    • FIGURE 45 REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018-2022
  • 11.5 COMPANY EVALUATION MATRIX, 2023
    • 11.5.1 STARS
    • 11.5.2 EMERGING LEADERS
    • 11.5.3 PERVASIVE PLAYERS
    • 11.5.4 PARTICIPANTS
    • FIGURE 46 INTERPOSER AND FOWLP MARKET: COMPANY EVALUATION MATRIX, 2023
    • 11.5.5 COMPANY FOOTPRINT
    • TABLE 114 COMPANY PACKAGING TYPE FOOTPRINT (10 KEY COMPANIES)
    • TABLE 115 COMPANY PACKAGING COMPONENT AND DESIGN FOOTPRINT (10 KEY COMPANIES)
    • TABLE 116 COMPANY REGION FOOTPRINT (10 KEY COMPANIES)
    • TABLE 117 OVERALL COMPANY FOOTPRINT (10 KEY COMPANIES)
  • 11.6 START-UP/SME EVALUATION MATRIX, 2023
    • TABLE 118 INTERPOSER AND FOWLP MARKET: LIST OF KEY START-UPS/SMES
    • 11.6.1 PROGRESSIVE COMPANIES
    • 11.6.2 RESPONSIVE COMPANIES
    • 11.6.3 DYNAMIC COMPANIES
    • 11.6.4 STARTING BLOCKS
    • FIGURE 47 INTERPOSER AND FOWLP MARKET: START-UP/SME EVALUATION MATRIX, 2023
    • 11.6.5 COMPETITIVE BENCHMARKING
    • TABLE 119 INTERPOSER AND FOWLP MARKET: COMPETITIVE BENCHMARKING OF KEY START-UPS/SMES
  • 11.7 COMPETITIVE SITUATION AND TRENDS
    • 11.7.1 PRODUCT LAUNCHES
    • TABLE 120 INTERPOSER AND FOWLP MARKET: PRODUCT LAUNCHES, AUGUST 2020-NOVEMBER 2023
    • 11.7.2 DEALS
    • TABLE 121 INTERPOSER AND FOWLP MARKET: DEALS, FEBRUARY 2021-JANUARY 2024

12 COMPANY PROFILES

  • 12.1 INTRODUCTION
  • 12.2 KEY PLAYERS
  • (Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats)**
    • 12.2.1 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    • TABLE 122 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY OVERVIEW
    • FIGURE 48 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT
    • TABLE 123 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 124 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT LAUNCHES
    • TABLE 125 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: DEALS
    • 12.2.2 SAMSUNG
    • TABLE 126 SAMSUNG: COMPANY OVERVIEW
    • FIGURE 49 SAMSUNG: COMPANY SNAPSHOT
    • TABLE 127 SAMSUNG: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 128 SAMSUNG: PRODUCT LAUNCHES
    • TABLE 129 SAMSUNG: DEALS
    • 12.2.3 ASE TECHNOLOGY HOLDING CO., LTD.
    • TABLE 130 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW
    • FIGURE 50 ASE TECHNOLOGY HOLDING CO. LTD.: COMPANY SNAPSHOT
    • TABLE 131 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 132 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCT LAUNCHES
    • TABLE 133 ASE TECHNOLOGY HOLDING CO., LTD.: DEALS
    • 12.2.4 AMKOR TECHNOLOGY
    • TABLE 134 AMKOR TECHNOLOGY: COMPANY OVERVIEW
    • FIGURE 51 AMKOR TECHNOLOGY: COMPANY SNAPSHOT
    • TABLE 135 AMKOR TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 136 AMKOR TECHNOLOGY: DEALS
    • TABLE 137 AMKOR TECHNOLOGY: OTHERS
    • 12.2.5 SK HYNIX INC.
    • TABLE 138 SK HYNIX INC.: COMPANY OVERVIEW
    • FIGURE 52 SK HYNIX INC.: COMPANY SNAPSHOT
    • TABLE 139 SK HYNIX INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 140 SK HYNIX INC.: PRODUCT LAUNCHES
    • 12.2.6 GLOBAL FOUNDRIES INC.
    • TABLE 141 GLOBAL FOUNDRIES INC.: COMPANY OVERVIEW
    • FIGURE 53 GLOBAL FOUNDRIES INC.: COMPANY SNAPSHOT
    • TABLE 142 GLOBAL FOUNDRIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 143 GLOBAL FOUNDRIES INC.: DEALS
    • TABLE 144 GLOBAL FOUNDRIES INC.: OTHERS
    • 12.2.7 DECA TECHNOLOGIES
    • TABLE 145 DECA TECHNOLOGIES: COMPANY OVERVIEW
    • TABLE 146 DECA TECHNOLOGIES: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 147 DECA TECHNOLOGIES: DEALS
    • 12.2.8 JCET GROUP LTD.
    • TABLE 148 JCET GROUP LTD.: COMPANY OVERVIEW
    • FIGURE 54 JCET GROUP LTD.: COMPANY SNAPSHOT
    • TABLE 149 JCET GROUP LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 150 JCET GROUP LTD.: PRODUCT LAUNCHES
    • TABLE 151 JCET GROUP LTD.: OTHERS
    • 12.2.9 POWERTECH TECHNOLOGY INC.
    • TABLE 152 POWERTECH TECHNOLOGY INC.: COMPANY OVERVIEW
    • FIGURE 55 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT
    • TABLE 153 POWERTECH TECHNOLOGY INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 154 POWERTECH TECHNOLOGY INC.: DEALS
    • 12.2.10 ADVANCED MICRO DEVICES, INC.
    • TABLE 155 ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW
    • FIGURE 56 ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT
    • TABLE 156 ADVANCED MICRO DEVICES, INC.: PRODUCTS/SOLUTIONS/SERVICES
    • TABLE 157 ADVANCED MICRO DEVICES, INC.: PRODUCT LAUNCHES
  • 12.3 OTHER PLAYERS
    • 12.3.1 NEXLOGIC TECHNOLOGIES INC.
    • 12.3.2 SPTS TECHNOLOGIES LTD.
    • 12.3.3 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    • 12.3.4 SAMTEC
    • 12.3.5 TELEDYNE DIGITAL IMAGING INC.
    • 12.3.6 OKMETIC
    • 12.3.7 AMS-OSRAM AG
    • 12.3.8 NEPES
    • 12.3.9 NHANCED SEMICONDUCTORS
    • 12.3.10 DUPONT
    • 12.3.11 ALLVIA INC.
    • 12.3.12 UNITED MICROELECTRONICS CORPORATION
    • 12.3.13 DAI NIPPON PRINTING CO., LTD.
    • 12.3.14 RENA TECHNOLOGIES GMBH
    • 12.3.15 MURATA MANUFACTURING CO., LTD
  • *Details on Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats might not be captured in case of unlisted companies.

13 APPENDIX

  • 13.1 INSIGHTS FROM INDUSTRY EXPERTS
  • 13.2 DISCUSSION GUIDE
  • 13.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 13.4 CUSTOMIZATION OPTIONS
  • 13.5 RELATED REPORTS
  • 13.6 AUTHOR DETAILS
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