Market Research Report
Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Cleaning Processes), Backend Equipment (Assembly & Packaging, Dicing, Bonding, Metrology), Fab Facility, & Geography - Global Forecast to 2023
|Published by||MarketsandMarkets||Product code||517578|
|Published||Content info||161 Pages
Delivery time: 1-2 business days
|Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Cleaning Processes), Backend Equipment (Assembly & Packaging, Dicing, Bonding, Metrology), Fab Facility, & Geography - Global Forecast to 2023|
|Published: June 13, 2017||Content info: 161 Pages||
"Semiconductor manufacturing equipment market to exhibit a high growth between 2017 and 2023"
The semiconductor manufacturing equipment market is projected to reach USD 62.56 billion by 2023 and is likely to grow at a CAGR of 6.86% between 2017 and 2023. The key factors driving the growth of the market include progress in research and development (R&D) facilities, increasing demand for electrical and hybrid vehicles, growing consumer electronic market, and increase in the number of foundries. However, the high cost and maintenance of the equipment and complexity of pattern and functional defects in manufacturing processes are inhibiting the growth of this market.
The semiconductor industry is driven to develop more innovative and advanced and miniature technologies because of the growing demand for new and more advanced electronic products with a smaller form factor, higher functionality, and high performance with a lower cost. The need for improved electrical performance has introduced 3D technology, which can replace the long interconnects used in 2D by short vertical interconnects.
The APAC region accounts for the largest share in the overall semiconductor manufacturing equipment market. The presence of local players such as Nikon (Japan) and Canon (Japan) are also contributing toward the growth of the market in the region. The semiconductor manufacturing equipment market in APAC held the largest share owing to low-cost labors in China, Taiwanese innovation and advancement in fabrication plants, and Japanese semiconductor equipment manufacturing capabilities, which are some of the cutting-edge advantages for the Asian semiconductor industry. Also, other factors such as increasing raw material suppliers, low labor cost, and increasing investment by global business giants are driving the market growth.
The major key players operating in the semiconductor manufacturing equipment market includes Applied Material, Lam Research, ASML, Tokyo Electronics, KLA-Tencor, Screen Semiconductor Solutions, Nikon, Hitachi, and ASML International.
In this report, various segments such as front-end, backend, dimensions, fab facility, and geography of the semiconductor manufacturing equipment market have been covered. It also discusses the key drivers, restraints, opportunities, and challenges pertaining to the market. The report gives a detailed view of the market across 3 main regions: North America, Europe, and APAC.
Top 25 companies analyzed for this study are -ASML Holdings N.V., Nikon, Canon, JEOL, Nuflare Technology, Ultratech, Rudolph Technology, EV Group, SCREEN Semiconductor Solutions Co., Ltd, Toshiba, TOKYO OHKA KOGYO CO., LTD, Adams Lithographing , AM Lithography Corporation, Vistec Electron Beam GmbH, Qoniac GmbH, S-Cubed, Inc., Inpria, Zeiss, Mapper Lithography, Raith GmbH, Gigaphoton Inc, Energetiq Technology, Inc, SuSS Microtech AG, NIL Technology
*Details on Overview, Strength of Product Portfolio, Business Strategy Excellence, Recent Developments, Key relationships might not be captured in case of unlisted companies.