US, Europe, APAC Electronic Components Market Research Report Information by Category, by End-Use Vertical, and by Region Forecast till 2035

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US, Europe, APAC Electronic Components Market Research Report Information by Category (Active Electronic Components, Passive Electronic Components), by End-Use Vertical (Consumer Electronics, Automotive, Aerospace and Defence, Industrial, Medical, Telecommunications, Utilities, Robotics, Others), and by Region (US, Europe, APAC) Forecast till 2035

Industry Overview

The electronic components market is anticipated to attain USD 384,235.40 million and register a compound annual growth rate of 5.0% by the end of 2035. Electronic components are individual devices or parts that work together in circuits to manage, amplify, or control electrical signals. They can be active, like microchips and diodes, or passive, like resistors and capacitors. Found in nearly every modern device, they are the foundation of all electronic technology.

Across the US, Europe, and Asia-Pacific, the electronic components market is expanding at a steady pace, supported by the increasing use of IoT technology and connected devices. In Europe, smart infrastructure projects such as IoT-enabled street lighting are improving energy efficiency. In the U.S., connected healthcare and industrial IoT are expanding at a rapid pace, whereas APAC is reaping the advantages of rapid 5G deployment and massive smart city projects. The demand for parts such as sensors, processors, and wireless modules has not relented, as industrialization is going on. Technological improvements in chip design, for example, 5nm and 3nm processors, have been considerable, as they offer consumers electronics, autonomous vehicles, and industrial systems much higher processing power with much less energy.

Challenges persist, such as getting the needed quality of components at a price that is competitive and handling the obsolete parts problem, especially in sectors with long product lifecycles. Cost pressures from fluctuating raw material prices and OEM pricing demands further affect profitability.

Opportunities are emerging in industrial automation, renewable energy, and robotics. Automotive and healthcare robotics, solar and wind power systems, and Industry 4.0 technologies all rely heavily on advanced electronic components. With rising automation in factories, the use of AI-enabled systems, and the global push toward cleaner energy, component demand in these regions is set to grow. The market outlook remains positive as connected technologies become more integrated into everyday applications.

Industry Segmentations

Depending on the category, the electrical components market is segmented into active and passive electronic components.

The electrical components market is classified into consumer electronics, automotive, aerospace and defence, industrial, medical, telecommunications, utilities, robotics, and others.

Regional Analysis

The US market for electronic components is driven by the adoption of advanced wireless technologies, smart devices, and electric mobility. The installation of 5G networks has greatly increased the demand for high-speed connectivity chips and related hardware increase greatly. Growth in the area of EV has resulted in increased utilization of power electronics made especially for the purpose and thermal management systems. Several factors, such as the disruption of supplies and an import tariff, have led to a slowdown in the production of goods, while rapid innovation cycles are demanding constant upgrading. In order to remain competitive, firms are concentrating on domestic manufacturing and technology advancement.

One of the major demand drivers in Europe is the adoption of renewable energy and the recovery of the automotive industry. Projects of wind and solar energy depend greatly on the use of advanced inverters, control systems, and sensors. The automotive sector in Germany is pushing forward the development of connected and electric vehicles. Semiconductor supply is still somewhat dependent on imports, which is why local production capacity is needed. The region is benefiting from the support of cooperative R&D programs and the use of investing in automation in order to increase its market positioning.

Asia-Pacific's dominance is greatly supported by the region's strong consumer electronics and semiconductor manufacturing base. The likes of South Korea and Taiwan are at the forefront of advanced chip production, whereas China is still the go-to place for big assembly. Apart from that, the growth of IoT and industrial automation has been the main source of component demand in the area. Besides, the region is now moving towards green electronics, with a focus on efficiency and less impact on the environment. Supply chain diversification investments have been triggered by trade restrictions and pandemic-era shortages.

Key Players

Major players in the electronic components market are Texas Instruments Incorporated, Broadcom Inc., Infineon Technologies AG, NXP Semiconductors NV, Renesas Electronics Corp, STMicroelectronics N.V., Microchip Technology, Silicon Laboratories Inc., Panasonic Holdings Corporation, Nordic Semiconductor ASA, Nippon Chemi-con Corporation, Samsung Electro-Mechanics, Glen Magnetics, Inc., AGILE MAGNETICS, INC, Vishay Intertechnology Inc., TDK CORPORATION, KOA Corporation, EREMU, SA, Sagami Elec Co., Ltd, Murata Manufacturing Co., Ltd, Broadcom Inc., Infineon Technologies AG, STMicroelectronics N.V., Microchip Technology, NIPPON CHEMI-CON CORPORATION, Samsung Electro-Mechanics, AGILE MAGNETICS, INC, Vishay Intertechnology Inc., TDK CORPORATION, and Murata Manufacturing Co., Ltd.

Product Code: MRFR/SEM/57645-CR

1 EXECUTIVE SUMMARY

2 MARKET INTRODUCTION

2.1 DEFINITION
2.2 SCOPE OF THE STUDY
2.3 RESEARCH OBJECTIVE
2.4 MARKET STRUCTURE

3 RESEARCH METHODOLOGY

3.1 OVERVIEW
3.2 DATA FLOW
- 3.2.1 DATA MINING PROCESS
3.3 PURCHASED DATABASE:
3.4 SECONDARY SOURCES:
- 3.4.1 SECONDARY RESEARCH DATA FLOW:
3.5 PRIMARY RESEARCH:
- 3.5.1 PRIMARY RESEARCH DATA FLOW:
- 3.5.2 PRIMARY RESEARCH: NUMBER OF INTERVIEWS CONDUCTED
3.6 APPROACHES FOR MARKET SIZE ESTIMATION:
- 3.6.1 CONSUMPTION & NET TRADE APPROACH
- 3.6.2 REVENUE ANALYSIS APPROACH
3.7 DATA FORECASTING
- 3.7.1 DATA FORECASTING TECHNIQUE
3.8 DATA MODELING
- 3.8.1 MICROECONOMIC FACTOR ANALYSIS:
- 3.8.2 DATA MODELING:
3.9 TEAMS AND ANALYST CONTRIBUTION

4 MARKET DYNAMICS

4.1 INTRODUCTION
4.2 DRIVERS
- 4.2.1 INCREASING DEVELOPMENT AND EXPANSION OF IOT DEVICES
- 4.2.2 TECHNOLOGICAL ADVANCEMENTS AND INNOVATION
- 4.2.3 GROWING DEMAND FOR CONNECTED DEVICES AND IOT SOLUTIONS
4.3 RESTRAINTS
- 4.3.1 MAINTAINING QUALITY WITH COST-EFFICIENCY AND OBSOLETE ELECTRONIC COMPONENTS
- 4.3.2 DECREASE IN THE PROFIT MARGINS OF MANUFACTURERS
4.4 OPPORTUNITY
- 4.4.1 GROWING DEMAND FOR ROBOTS ACROSS THE INDUSTRY
- 4.4.2 RISE OF RENEWABLE ENERGY SOLUTION
- 4.4.3 LARGE-SCALE ADOPTION OF INDUSTRIAL AUTOMATION SOLUTION
4.5 IMPACT ANALYSIS OF COVID - 19
- 4.5.1 IMPACT OF COVID-19 ON THE SEMICONDUCTOR INDUSTRY
- 4.5.2 ELECTRONIC COMPONENT SHORTAGE
- 4.5.3 IMPACT ON OVERALL ELECTRONICS INDUSTRY

5 MARKET FACTOR ANALYSIS

5.1 VALUE CHAIN ANALYSIS
- 5.1.1 DESIGN & DEVELOPMENT
- 5.1.2 COMPONENT SUPPLY
- 5.1.3 SYSTEM INTEGRATION
- 5.1.4 END USERS
5.2 PORTER'S FIVE FORCES MODEL
- 5.2.1 THREAT OF NEW ENTRANTS
- 5.2.2 BARGAINING POWER OF SUPPLIERS
- 5.2.3 BARGAINING POWER OF BUYERS
- 5.2.4 THREAT OF SUBSTITUTES
- 5.2.5 INTENSITY OF RIVALRY
5.3 MARKET SWOT ANALYSIS
5.4 MARKET PESTEL ANALYSIS

6 ELECTRONIC COMPONENTS MARKET INSIGHTS

6.1 KEY ELECTRONIC COMPONENTS SUPPLY CHAINS ANALYZED
- 6.1.1 ACTIVE ELECTRONIC COMPONENTS
  - 6.1.1.1 MANUFACTURERS
  - 6.1.1.2 SUPPLY CHAIN DISTRIBUTORS
  - 6.1.1.3 SUPPLY CHAIN DISRUPTIONS/ CHALLENGES FACED
  - 6.1.1.4 KEY END USERS
- 6.1.2 PASSIVE ELECTRONIC COMPONENTS
  - 6.1.2.1 MANUFACTURERS
  - 6.1.2.2 SUPPLY CHAIN DISTRIBUTORS
  - 6.1.2.3 SUPPLY CHAIN DISRUPTIONS/ CHALLENGES FACED
  - 6.1.2.4 KEY END USERS
6.2 ELECTRONIC COMPONENTS EMERGING TECHNOLOGICAL TRENDS ANALYZED
- 6.2.1 ACTIVE ELECTRONIC COMPONENTS
  - 6.2.1.1 3D-PRINTED ELECTRONICS
    - 6.2.1.1.1 TREND ANALYSIS
    - 6.2.1.1.2 POTENTIAL MARKET IMPACT
  - 6.2.1.2 ADVANCED MATERIALS
    - 6.2.1.2.1.1 TREND ANALYSIS 78
    - 6.2.1.2.1.2 POTENTIAL MARKET IMPACT 78
  - 6.2.1.3 FLEXIBLE AND STRETCHABLE ELECTRONICS
    - 6.2.1.3.1.1 TREND ANALYSIS 78
    - 6.2.1.3.1.2 POTENTIAL MARKET IMPACT 79
  - 6.2.1.4 BIOCOMPATIBLE PRODUCTS
    - 6.2.1.4.1.1 TREND ANALYSIS 79
    - 6.2.1.4.1.2 POTENTIAL MARKET IMPACT 79
- 6.2.2 PASSIVE ELECTRONIC COMPONENTS
6.3 CURRENT AND FUTURE MARKET TRENDS ACROSS ELECTRONIC COMPONENTS
- 6.3.1 MINIATURIZATION AND HIGH INTEGRATION CAPABILITIES
- 6.3.2 ADVANCED MATERIALS FOR IMPROVED PERFORMANCE
- 6.3.3 ENERGY EFFICIENCY AND LOW-POWER DESIGNS
- 6.3.4 INTEGRATION OF PASSIVE AND ACTIVE FUNCTIONS
- 6.3.5 EMERGING POWER SOURCES FOR ELECTRONIC COMPONENTS AND DEVICES
- 6.3.6 IMPACT OF ARTIFICIAL INTELLIGENCE (AI) ON THE ELECTRONIC COMPONENTS INDUSTRY
- 6.3.7 ORGANIC ELECTRONICS
- 6.3.8 QUANTUM COMPUTING
- 6.3.9 EMBEDDED SYSTEMS
- 6.3.10 PRINTED ELECTRONICS
- 6.3.11 INTERNET OF THINGS (IOT)
- 6.3.12 WEARABLE DEVICES
6.4 KEY END USERS/ OEMS COMPANY PROFILES
- 6.4.1 EUROPE
- 6.4.2 ASIA-PACIFIC
- 6.4.3 US
6.5 REVENUE AND OPPORTUNITY POCKETS WITH SHORTER TIME-TO-MONEY
- 6.5.1 HIGH-GROWTH, LOW-BARRIER MARKET SEGMENTS
- 6.5.2 FAST-MOVING END-USE VERTICALS
- 6.5.3 STRATEGIC GAPS IN SUPPLY CHAINS
- 6.5.4 CUSTOMER PAIN POINTS AND EMERGING NEEDS
- 6.5.5 EMERGING TRENDS

7 ELECTRONIC COMPONENTS MARKET, BY CATEGORY

7.1 INTRODUCTION
7.2 ACTIVE ELECTRONIC COMPONENTS
7.3 PASSIVE ELECTRONIC COMPONENTS

8 ELECTRONIC COMPONENTS MARKET, BY END-USE VERTICAL

8.1 INTRODUCTION
8.2 CONSUMER ELECTRONICS
8.3 AUTOMOTIVE
8.4 AEROSPACE AND DEFENCE
8.5 INDUSTRIAL
8.6 MEDICAL
8.7 TELECOMMUNICATIONS
8.8 UTILITIES
8.9 ROBOTICS
8.10 OTHERS

9 ELECTRONIC COMPONENTS MARKET, BY REGION

9.1 OVERVIEW
- 9.1.1 ELECTRONIC COMPONENTS MARKET, BY REGION, 2024 VS 2035 (USD MILLION)
- 9.1.2 ELECTRONIC COMPONENTS MARKET, BY REGION, 2019-2035 (USD MILLION)
9.2 US
9.3 EUROPE
- 9.3.1 EAST EUROPE
  - 9.3.1.1 BULGARIA
  - 9.3.1.2 HUNGARY
  - 9.3.1.3 POLAND
  - 9.3.1.4 ROMANIA
  - 9.3.1.5 RUSSIA
  - 9.3.1.6 SLOVAKIA
  - 9.3.1.7 CZECH REPUBLIC
  - 9.3.1.8 REST OF EAST EUROPE
- 9.3.2 WEST EUROPE
  - 9.3.2.1 BELGIUM
  - 9.3.2.2 FRANCE
  - 9.3.2.3 GERMANY
  - 9.3.2.4 NETHERLANDS
  - 9.3.2.5 AUSTRIA
  - 9.3.2.6 LUXEMBOURG
  - 9.3.2.7 REST OF WEST EUROPE
- 9.3.3 NORTHERN EUROPE
  - 9.3.3.1 FINLAND
  - 9.3.3.2 UK
  - 9.3.3.3 IRELAND
  - 9.3.3.4 NORWAY
  - 9.3.3.5 SWEDEN
  - 9.3.3.6 DENMARK
  - 9.3.3.7 REST OF NORTHERN EUROPE
- 9.3.4 SOUTHERN EUROPE
  - 9.3.4.1 SPAIN
  - 9.3.4.2 TURKEY
  - 9.3.4.3 PORTUGAL
  - 9.3.4.4 GREECE
  - 9.3.4.5 ITALY
  - 9.3.4.6 CROATIA
  - 9.3.4.7 REST OF SOUTHERN EUROPE
9.4 ASIA PACIFIC
- 9.4.1 CHINA
- 9.4.2 INDIA
- 9.4.3 JAPAN
- 9.4.4 SOUTH KOREA
- 9.4.5 MALAYSIA
- 9.4.6 TAIWAN
- 9.4.7 SINGAPORE
- 9.4.8 REST OF APAC

10 COMPETITIVE LANDSCAPE

10.1 INTRODUCTION
10.2 COMPETITOR DASHBOARD
10.3 ELECTRONIC COMPONENTS MANUFACTURERS SHARE ANALYSIS, 2024 (%)
- 10.3.1 ASIA-PACIFIC
- 10.3.2 EUROPE
- 10.3.3 US
10.4 ELECTRONIC COMPONENTS DISTRIBUTORS SHARE ANALYSIS, 2024 (%)
- 10.4.1 US
- 10.4.2 ASIA-PACIFIC
- 10.4.3 EUROPE
10.5 KEY START-UPS AND MID-SIZED ANALYZED

11 COMPANY PROFILES- ACTIVE ELECTRONIC COMPONENT MANUFACTURERS

11.1 TEXAS INSTRUMENTS INCORPORATED.
- 11.1.1 COMPANY OVERVIEW
- 11.1.2 FINANCIAL OVERVIEW
- 11.1.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
- 11.1.4 KEY DEVELOPMENTS
- 11.1.5 SWOT ANALYSIS
- 11.1.6 KEY STRATEGIES
11.2 BROADCOM INC
- 11.2.1 COMPANY OVERVIEW
- 11.2.2 FINANCIAL OVERVIEW
- 11.2.3 PRODUCTS OFFERED
- 11.2.4 KEY DEVELOPMENTSS
- 11.2.5 SWOT ANALYSIS
- 11.2.6 KEY STRATEGIES
11.3 INFINEON TECHNOLOGIES AG
- 11.3.1 COMPANY OVERVIEW
- 11.3.2 FINANCIAL OVERVIEW
- 11.3.3 PRODUCTS OFFERED
- 11.3.4 KEY DEVELOPMENTSS
- 11.3.5 SWOT ANALYSIS
- 11.3.6 KEY STRATEGIES
11.4 NXP SEMICONDUCTORS
- 11.4.1 COMPANY OVERVIEW
- 11.4.2 FINANCIAL OVERVIEW
- 11.4.3 PRODUCTS OFFERED
- 11.4.4 KEY DEVELOPMENTSS
- 11.4.5 SWOT ANALYSIS
- 11.4.6 KEY STRATEGIES
11.5 RENESAS ELECTRONICS CORPORATION
- 11.5.1 COMPANY OVERVIEW
- 11.5.2 FINANCIAL OVERVIEW
- 11.5.3 PRODUCTS OFFERED
- 11.5.4 KEY DEVELOPMENTS
- 11.5.5 SWOT ANALYSIS
- 11.5.6 KEY STRATEGIES
11.6 STMICROELECTRONICS NV
- 11.6.1 COMPANY OVERVIEW
- 11.6.2 FINANCIAL OVERVIEW
- 11.6.3 PRODUCTS OFFERED
- 11.6.4 KEY DEVELOPMENTSS
- 11.6.5 SWOT ANALYSIS
- 11.6.6 KEY STRATEGIES
11.7 MICROCHIP TECHNOLOGY INC.
- 11.7.1 COMPANY OVERVIEW
- 11.7.2 FINANCIAL OVERVIEW
- 11.7.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
- 11.7.4 KEY DEVELOPMENTS
- 11.7.5 SWOT ANALYSIS
- 11.7.6 KEY STRATEGIES
11.8 SILICON LABORATORIES
- 11.8.1 COMPANY OVERVIEW
- 11.8.2 FINANCIAL OVERVIEW
- 11.8.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
- 11.8.4 KEY DEVELOPMENTS
- 11.8.5 SWOT ANALYSIS
- 11.8.6 KEY STRATEGIES
11.9 PANASONIC INDUSTRIAL
- 11.9.1 COMPANY OVERVIEW
- 11.9.2 FINANCIAL OVERVIEW
- 11.9.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
- 11.9.4 KEY DEVELOPMENTS
- 11.9.5 SWOT ANALYSIS
- 11.9.6 KEY STRATEGIES
11.10 NORDIC SEMICONDUCTOR
- 11.10.1 COMPANY OVERVIEW
- 11.10.2 FINANCIAL OVERVIEW
- 11.10.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
- 11.10.4 KEY DEVELOPMENTS
- 11.10.5 SWOT ANALYSIS
- 11.10.6 KEY STRATEGIES

12 COMPANY PROFILES_ PASSIVE

12.1 MURATA MANUFACTURING CO. LTD.
- 12.1.1 COMPANY OVERVIEW
- 12.1.2 FINANCIAL OVERVIEW
- 12.1.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
- 12.1.4 KEY DEVELOPMENTS
- 12.1.5 SWOT ANALYSIS
- 12.1.6 KEY STRATEGIES
12.2 SAGAMI ELEC CO., LTD.
- 12.2.1 COMPANY OVERVIEW
- 12.2.2 FINANCIAL OVERVIEW
- 12.2.3 PRODUCTS OFFERED
- 12.2.4 KEY DEVELOPMENTS
- 12.2.5 SWOT ANALYSIS
- 12.2.6 KEY STRATEGIES:
12.3 EREMU, SA
- 12.3.1 COMPANY OVERVIEW
- 12.3.2 FINANCIAL OVERVIEW
- 12.3.3 PRODUCTS OFFERED
- 12.3.4 KEY DEVELOPMENTS
- 12.3.5 SWOT ANALYSIS
- 12.3.6 KEY STRATEGIES
12.4 KOA CORPORATION
- 12.4.1 COMPANY OVERVIEW
- 12.4.2 FINANCIAL OVERVIEW
- 12.4.3 PRODUCTS OFFERED
- 12.4.4 KEY DEVELOPMENTS
- 12.4.5 SWOT ANALYSIS
- 12.4.6 KEY STRATEGIES
12.5 TDK CORPORATION
- 12.5.1 COMPANY OVERVIEW
- 12.5.2 FINANCIAL OVERVIEW
- 12.5.3 PRODUCTS OFFERED
- 12.5.4 KEY DEVELOPMENTS
- 12.5.5 SWOT ANALYSIS
- 12.5.6 KEY STRATEGIES
12.6 VISHAY INTERTECHNOLOGY, INC
- 12.6.1 COMPANY OVERVIEW
- 12.6.2 FINANCIAL OVERVIEW
- 12.6.3 PRODUCTS OFFERED
- 12.6.4 KEY DEVELOPMENTS
- 12.6.5 SWOT ANALYSIS
- 12.6.6 KEY STRATEGIES
12.7 AGILE MAGNETICS, INC.
- 12.7.1 COMPANY OVERVIEW
- 12.7.2 FINANCIAL OVERVIEW
- 12.7.3 PRODUCTS OFFERED
- 12.7.4 KEY DEVELOPMENTS
- 12.7.5 SWOT ANALYSIS
- 12.7.6 KEY STRATEGIES
12.8 GLEN MAGNETICS
- 12.8.1 COMPANY OVERVIEW
- 12.8.2 FINANCIAL OVERVIEW
- 12.8.3 PRODUCTS OFFERED
- 12.8.4 KEY DEVELOPMENTS
- 12.8.5 SWOT ANALYSIS
- 12.8.6 KEY STRATEGIES
12.9 SAMSUNG ELECTRO-MECHANICS
- 12.9.1 COMPANY OVERVIEW
- 12.9.2 FINANCIAL OVERVIEW
- 12.9.3 PRODUCTS OFFERED
- 12.9.4 KEY DEVELOPMENTS
- 12.9.5 SWOT ANALYSIS
- 12.9.6 KEY STRATEGIES
12.10 NIPPON CHEMI-CON CORPORATION.
- 12.10.1 COMPANY OVERVIEW
- 12.10.2 FINANCIAL OVERVIEW
- 12.10.3 PRODUCTS OFFERED
- 12.10.4 KEY DEVELOPMENTS
- 12.10.5 SWOT ANALYSIS
- 12.10.6 KEY STRATEGIES

13 COMPANY PROFILES_ ELECTROMECHANICAL ELECTRONIC COMPONENT

13.1 BROADCOM INC
- 13.1.1 COMPANY OVERVIEW
- 13.1.2 FINANCIAL OVERVIEW
- 13.1.3 PRODUCTS OFFERED
- 13.1.4 KEY DEVELOPMENTSS
- 13.1.5 SWOT ANALYSIS
- 13.1.6 KEY STRATEGIES
13.2 INFINEON TECHNOLOGIES AG
- 13.2.1 COMPANY OVERVIEW
- 13.2.2 FINANCIAL OVERVIEW
- 13.2.3 PRODUCTS OFFERED
- 13.2.4 KEY DEVELOPMENTSS
- 13.2.5 SWOT ANALYSIS
- 13.2.6 KEY STRATEGIES
13.3 STMICROELECTRONICS NV
- 13.3.1 COMPANY OVERVIEW
- 13.3.2 FINANCIAL OVERVIEW
- 13.3.3 PRODUCTS OFFERED
- 13.3.4 KEY DEVELOPMENTSS
- 13.3.5 SWOT ANALYSIS
- 13.3.6 KEY STRATEGIES
13.4 MICROCHIP TECHNOLOGY INC.
- 13.4.1 COMPANY OVERVIEW
- 13.4.2 FINANCIAL OVERVIEW
- 13.4.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
- 13.4.4 KEY DEVELOPMENTS
- 13.4.5 SWOT ANALYSIS
- 13.4.6 KEY STRATEGIES
13.5 SAMSUNG ELECTRO-MECHANICS
- 13.5.1 COMPANY OVERVIEW
- 13.5.2 FINANCIAL OVERVIEW
- 13.5.3 PRODUCTS OFFERED
- 13.5.4 KEY DEVELOPMENTS
- 13.5.5 SWOT ANALYSIS
- 13.5.6 KEY STRATEGIES
13.6 NIPPON CHEMI-CON CORPORATION.
- 13.6.1 COMPANY OVERVIEW
- 13.6.2 FINANCIAL OVERVIEW
- 13.6.3 PRODUCTS OFFERED
- 13.6.4 KEY DEVELOPMENTS
- 13.6.5 SWOT ANALYSIS
- 13.6.6 KEY STRATEGIES
13.7 TDK CORPORATION
- 13.7.1 COMPANY OVERVIEW
- 13.7.2 FINANCIAL OVERVIEW
- 13.7.3 PRODUCTS OFFERED
- 13.7.4 KEY DEVELOPMENTS
- 13.7.5 SWOT ANALYSIS
- 13.7.6 KEY STRATEGIES
13.8 VISHAY INTERTECHNOLOGY, INC
- 13.8.1 COMPANY OVERVIEW
- 13.8.2 FINANCIAL OVERVIEW
- 13.8.3 PRODUCTS OFFERED
- 13.8.4 KEY DEVELOPMENTS
- 13.8.5 SWOT ANALYSIS
- 13.8.6 KEY STRATEGIES
13.9 AGILE MAGNETICS, INC.
- 13.9.1 COMPANY OVERVIEW
- 13.9.2 FINANCIAL OVERVIEW
- 13.9.3 PRODUCTS OFFERED
- 13.9.4 KEY DEVELOPMENTS
- 13.9.5 SWOT ANALYSIS
- 13.9.6 KEY STRATEGIES
13.10 MURATA MANUFACTURING CO. LTD.
- 13.10.1 COMPANY OVERVIEW
- 13.10.2 FINANCIAL OVERVIEW
- 13.10.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED
- 13.10.4 KEY DEVELOPMENTS
- 13.10.5 SWOT ANALYSIS
- 13.10.6 KEY STRATEGIES
13.11 DATA CITATIONS