PUBLISHER: Polaris Market Research | PRODUCT CODE: 1786814
PUBLISHER: Polaris Market Research | PRODUCT CODE: 1786814
U.S. Semiconductor Assembly and Packaging Equipment Market Size, Share, Trends, Industry Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End Use - Market Forecast, 2025-2034
The U.S. Semiconductor Assembly and Packaging Equipment market size is expected to reach USD 825.84 million by 2034, according to a new study by Polaris Market Research. The report "U.S. Semiconductor Assembly and Packaging Equipment Market Share, Size, Trends, Industry Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End Use; Market Forecast, 2025-2034" gives a detailed insight into current market dynamics and provides analysis on future market growth.
The surging demand for advanced packaging technologies is driving the U.S. semiconductor assembly and packaging equipment market, as it directly aligns with the industry's shift toward higher performance, miniaturized, and multifunctional devices. Emerging applications in artificial intelligence (AI), high-performance computing, and 5G require complex packaging formats such as 2.5D/3D integration, system-in-package (SiP), and fan-out wafer-level packaging (FOWLP). These innovations demand highly specialized equipment capable of handling increased interconnect densities, thermal management, and heterogeneous integration. The adoption of advanced packaging tools is becoming essential, fueling steady growth in equipment investments as U.S. manufacturers compete on performance and design innovation.
Government initiatives and localization efforts are playing a major role in driving the U.S. semiconductor assembly and packaging equipment market. Public policy is increasingly focused on incentivizing local manufacturing and reducing dependence on foreign supply chains, with growing focus on strengthening domestic semiconductor capabilities. These efforts are promoting capital investments in state-of-the-art assembly and packaging infrastructure across the U.S., including equipment procurement and facility modernization.
U.S. Semiconductor Assembly and Packaging Equipment Market Report Highlights
In terms of product, the bonding equipment segment led in revenue share in 2024, owing to its critical function in enabling semiconductor device miniaturization and enhanced performance capabilities.
Based on end use, the OSAT segment is projected to grow the fastest during the forecast period, fueled by the rise of fabless semiconductor companies and the shift toward outsourcing back-end processes.
In terms of packaging type, the wafer-level packaging (WLP) equipment segment held the largest revenue share in 2024, as its chip-scale integration approach offers improved electrical performance, space efficiency, and production cost advantages.
A few key market players include Aehr Test Systems; Applied Materials; Brewer Science; Cohu, Inc.; KLA Corporation; Kulicke & Soffa Industries (K&S); Onto Innovation; Plasma-Therm; Rudolph Technologies, Inc.; and Veeco Instruments Inc.
Polaris Market Research has segmented the U.S. semiconductor assembly and packaging equipment market report on the basis of product, packaging type, and end use:
By Product Outlook (Revenue, USD Million, 2020-2034)
Dicing Equipment
Scriber
Dicer
Wafer Mounting Equipment
Bonding Equipment
Die Bonder
Wire Bonder
Others
Packaging Equipment
Molding Equipment
Solder Plating Equipment
Deflasher
Others
Others
By Packaging Type Outlook (Revenue, USD Million, 2020-2034)
Flip Chip Packaging Equipment
Wafer Level Packaging (WLP) Equipment
Fan-Out Packaging Equipment
System-in-Package (SiP) Equipment
3D/2.5D Packaging Equipment
Others
By End Use Outlook (Revenue, USD Million, 2020-2034)
IDMs (Integrated Device Manufacturers)
OSAT (Outsourced Semiconductor Assembly and Test)
Table of Contents
1. Introduction
- 1.1. Report Description
- 1.1.1. Objectives of the Study
- 1.1.2. Market Scope
- 1.1.3. Assumptions
- 1.2. Stakeholders
2. Executive Summary
- 2.1. Market Highlights
3. Research Methodology
- 3.1. Overview
- 3.1.1. Data Mining
- 3.2. Data Sources
- 3.2.1. Primary Sources
- 3.2.2. Secondary Sources
4. U.S. Semiconductor Assembly and Packaging Equipment Market Insights
- 4.1. U.S. Semiconductor Assembly and Packaging Equipment Market - Market Snapshot
- 4.2. U.S. Semiconductor Assembly and Packaging Equipment Market Dynamics
- 4.2.1. Drivers and Opportunities
- 4.2.1.1. Surging Demand for Advanced Packaging Technologies
- 4.2.1.2. Government Initiatives and Localization Efforts
- 4.2.2. Restraints and Challenges
- 4.2.2.1. High Capital Investment and Technological Complexity
- 4.2.3. Public opinion and privacy legal precedents
- 4.2.1. Drivers and Opportunities
- 4.3. Porter's Five Forces Analysis
- 4.3.1. Bargaining Power of Suppliers (Moderate)
- 4.3.2. Threats of New Entrants: (Low)
- 4.3.3. Bargaining Power of Buyers (Moderate)
- 4.3.4. Threat of Substitute (Moderate)
- 4.3.5. Rivalry among existing firms (High)
- 4.4. PESTEL Analysis
- 4.5. U.S. Semiconductor Assembly and Packaging Equipment Market Trends
- 4.6. Value Chain Analysis
5. U.S. Semiconductor Assembly and Packaging Equipment Market, By Product
- 5.1. Key Findings
- 5.2. Introduction
- 5.2.1. U.S. Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Million)
- 5.3. Dicing Equipment
- 5.3.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Dicing Equipment, by Region, 2020-2034 (USD Million)
- 5.3.2. Scriber
- 5.3.2.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Scriber, by Region, 2020-2034 (USD Million)
- 5.3.3. Dicer
- 5.3.3.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Dicer, by Region, 2020-2034 (USD Million)
- 5.3.4. Wafer Mounting Equipment
- 5.3.4.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Wafer Mounting Equipment, by Region, 2020-2034 (USD Million)
- 5.4. Bonding Equipment
- 5.4.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Bonding Equipment, by Region, 2020-2034 (USD Million)
- 5.4.2. Die Bonder
- 5.4.2.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Die Bonder, by Region, 2020-2034 (USD Million)
- 5.4.3. Wire Bonder
- 5.4.3.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Wire Bonder, by Region, 2020-2034 (USD Million)
- 5.4.4. Others
- 5.4.4.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Million)
- 5.5. Packaging Equipment
- 5.5.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Packaging Equipment, by Region, 2020-2034 (USD Million)
- 5.5.2. Molding Equipment
- 5.5.2.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Molding Equipment, by Region, 2020-2034 (USD Million)
- 5.5.3. Solder Plating Equipment
- 5.5.3.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Solder Plating Equipment, by Region, 2020-2034 (USD Million)
- 5.5.4. Deflasher
- 5.5.4.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Deflasher, by Region, 2020-2034 (USD Million)
- 5.5.5. Others
- 5.5.5.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Million)
- 5.6. Others
- 5.6.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Million)
6. U.S. Semiconductor Assembly and Packaging Equipment Market, by Packaging Type
- 6.1. Key Findings
- 6.2. Introduction
- 6.2.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Million)
- 6.3. Flip Chip Packaging Equipment
- 6.3.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Flip Chip Packaging Equipment, by Region, 2020-2034 (USD Million)
- 6.4. Wafer Level Packaging (WLP) Equipment
- 6.4.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Wafer Level Packaging (WLP) Equipment, by Region, 2020-2034 (USD Million)
- 6.5. Fan-Out Packaging Equipment
- 6.5.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Fan-Out Packaging Equipment, by Region, 2020-2034 (USD Million)
- 6.6. System-in-Package (SiP) Equipment
- 6.6.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by System-in-Package (SiP) Equipment, by Region, 2020-2034 (USD Million)
- 6.7. 3D/2.5D Packaging Equipment
- 6.7.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by 3D/2.5D Packaging Equipment, by Region, 2020-2034 (USD Million)
- 6.8. Others
- 6.8.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Million)
7. U.S. Semiconductor Assembly and Packaging Equipment Market, by End Use
- 7.1. Key Findings
- 7.2. Introduction
- 7.2.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Million)
- 7.3. IDMs (Integrated Device Manufacturers)
- 7.3.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by IDMs (Integrated Device Manufacturers), by Region, 2020-2034 (USD Million)
- 7.4. OSAT (Outsourced Semiconductor Assembly and Test)
- 7.4.1. U.S. Semiconductor Assembly and Packaging Equipment Market, by OSAT (Outsourced Semiconductor Assembly and Test), by Region, 2020-2034 (USD Million)
8. U.S. Semiconductor Assembly and Packaging Equipment Market, by Geography
- 8.1. Key Findings
- 8.2. Introduction
- 8.2.1. U.S. Semiconductor Assembly and Packaging Equipment Market - US
- 8.2.1.1. US: U.S. Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Million)
- 8.2.1.2. US: U.S. Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Million)
- 8.2.1.3. US: U.S. Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Million)
- 8.2.1. U.S. Semiconductor Assembly and Packaging Equipment Market - US
9. Competitive Landscape
- 9.1. Expansion and Acquisition Analysis
- 9.1.1. Expansion
- 9.1.2. Acquisitions
- 9.2. Partnerships/Collaborations/Agreements/Exhibitions
10. Company Profiles
- 10.1. Aehr Test Systems
- 10.1.1. Company Overview
- 10.1.2. Financial Performance
- 10.1.3. Product Benchmarking
- 10.1.4. Recent Development
- 10.2. Applied Materials
- 10.2.1. Company Overview
- 10.2.2. Financial Performance
- 10.2.3. Product Benchmarking
- 10.2.4. Recent Development
- 10.3. Brewer Science
- 10.3.1. Company Overview
- 10.3.2. Financial Performance
- 10.3.3. Product Benchmarking
- 10.3.4. Recent Development
- 10.4. Cohu, Inc.
- 10.4.1. Company Overview
- 10.4.2. Financial Performance
- 10.4.3. Product Benchmarking
- 10.4.4. Recent Development
- 10.5. KLA Corporation
- 10.5.1. Company Overview
- 10.5.2. Financial Performance
- 10.5.3. Product Benchmarking
- 10.5.4. Recent Development
- 10.6. Kulicke & Soffa Industries (K&S)
- 10.6.1. Company Overview
- 10.6.2. Financial Performance
- 10.6.3. Product Benchmarking
- 10.6.4. Recent Development
- 10.7. Onto Innovation
- 10.7.1. Company Overview
- 10.7.2. Financial Performance
- 10.7.3. Product Benchmarking
- 10.7.4. Recent Development
- 10.8. Plasma-Therm
- 10.8.1. Company Overview
- 10.8.2. Financial Performance
- 10.8.3. Product Benchmarking
- 10.8.4. Recent Development
- 10.9. Rudolph Technologies, Inc.
- 10.9.1. Company Overview
- 10.9.2. Financial Performance
- 10.9.3. Product Benchmarking
- 10.9.4. Recent Development
- 10.10. Veeco Instruments Inc.
- 10.10.1. Company Overview
- 10.10.2. Financial Performance
- 10.10.3. Product Benchmarking
- 10.10.4. Recent Development
List of Tables:
- Table 1 U.S. Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Million)
- Table 2 U.S. Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Million)
- Table 3 U.S. Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Million)
List of Figures:
- Figure 1. U.S. Semiconductor Assembly and Packaging Equipment Market, 2020-2034 (USD Million)
- Figure 2. Integrated Ecosystem
- Figure 3. Research Methodology: Top-Down & Bottom-Up Price
- Figure 4. Porter's Five Forces
- Figure 5. Market By Product
- Figure 6. U.S. Semiconductor Assembly and Packaging Equipment Market, By Product, 2024 & 2034 (USD Million)
- Figure 7. Market by Packaging Type
- Figure 8. U.S. Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2024 & 2034 (USD Million)
- Figure 9. Market by End Use
- Figure 10. U.S. Semiconductor Assembly and Packaging Equipment Market, by End Use, 2024 & 2034 (USD Million)
