Global Wafer Bump Packaging Sales Market Report, Competitive Analysis and Regional Opportunities 2025-2031

TABLE OF CONTENTS

1 Market Overview

• 1.1 Wafer Bump Packaging Product Scope
• 1.2 Wafer Bump Packaging by Package Technology
  • 1.2.1 Global Wafer Bump Packaging Sales by Package Technology (2020 & 2024 & 2031)
  • 1.2.2 FC Bumping
  • 1.2.3 WLCSP
  • 1.2.4 uBump (2.5D/3D)
  • 1.2.5 Bump for DDIC
  • 1.2.6 Others
• 1.3 Wafer Bump Packaging by Application
  • 1.3.1 Global Wafer Bump Packaging Sales Comparison by Application (2020 & 2024 & 2031)
  • 1.3.2 Smartphone
  • 1.3.3 LCD TV
  • 1.3.4 Notebook
  • 1.3.5 Tablet
  • 1.3.6 Monitor
  • 1.3.7 Other
• 1.4 Global Wafer Bump Packaging Market Estimates and Forecasts (2020-2031)
  • 1.4.1 Global Wafer Bump Packaging Market Size in Value Growth Rate (2020-2031)
  • 1.4.2 Global Wafer Bump Packaging Market Size in Volume Growth Rate (2020-2031)
  • 1.4.3 Global Wafer Bump Packaging Price Trends (2020-2031)
• 1.5 Assumptions and Limitations

2 Market Size and Prospective by Region

• 2.1 Global Wafer Bump Packaging Market Size by Region: 2020 VS 2024 VS 2031
• 2.2 Global Wafer Bump Packaging Retrospective Market Scenario by Region (2020-2025)
  • 2.2.1 Global Wafer Bump Packaging Sales Market Share by Region (2020-2025)
  • 2.2.2 Global Wafer Bump Packaging Revenue Market Share by Region (2020-2025)
• 2.3 Global Wafer Bump Packaging Market Estimates and Forecasts by Region (2026-2031)
  • 2.3.1 Global Wafer Bump Packaging Sales Estimates and Forecasts by Region (2026-2031)
  • 2.3.2 Global Wafer Bump Packaging Revenue Forecast by Region (2026-2031)
• 2.4 Major Region and Emerging Market Analysis
  • 2.4.1 North America Wafer Bump Packaging Market Size and Prospective (2020-2031)
  • 2.4.2 Europe Wafer Bump Packaging Market Size and Prospective (2020-2031)
  • 2.4.3 China Wafer Bump Packaging Market Size and Prospective (2020-2031)
  • 2.4.4 Japan Wafer Bump Packaging Market Size and Prospective (2020-2031)
  • 2.4.5 South Korea Wafer Bump Packaging Market Size and Prospective (2020-2031)

3 Global Market Size by Package Technology

• 3.1 Global Wafer Bump Packaging Historic Market Review by Package Technology (2020-2025)
  • 3.1.1 Global Wafer Bump Packaging Sales by Package Technology (2020-2025)
  • 3.1.2 Global Wafer Bump Packaging Revenue by Package Technology (2020-2025)
  • 3.1.3 Global Wafer Bump Packaging Price by Package Technology (2020-2025)
• 3.2 Global Wafer Bump Packaging Market Estimates and Forecasts by Package Technology (2026-2031)
  • 3.2.1 Global Wafer Bump Packaging Sales Forecast by Package Technology (2026-2031)
  • 3.2.2 Global Wafer Bump Packaging Revenue Forecast by Package Technology (2026-2031)
  • 3.2.3 Global Wafer Bump Packaging Price Forecast by Package Technology (2026-2031)
• 3.3 Different Types Wafer Bump Packaging Representative Players

4 Global Market Size by Application

• 4.1 Global Wafer Bump Packaging Historic Market Review by Application (2020-2025)
  • 4.1.1 Global Wafer Bump Packaging Sales by Application (2020-2025)
  • 4.1.2 Global Wafer Bump Packaging Revenue by Application (2020-2025)
  • 4.1.3 Global Wafer Bump Packaging Price by Application (2020-2025)
• 4.2 Global Wafer Bump Packaging Market Estimates and Forecasts by Application (2026-2031)
  • 4.2.1 Global Wafer Bump Packaging Sales Forecast by Application (2026-2031)
  • 4.2.2 Global Wafer Bump Packaging Revenue Forecast by Application (2026-2031)
  • 4.2.3 Global Wafer Bump Packaging Price Forecast by Application (2026-2031)
• 4.3 New Sources of Growth in Wafer Bump Packaging Application

5 Competition Landscape by Players

• 5.1 Global Wafer Bump Packaging Sales by Players (2020-2025)
• 5.2 Global Top Wafer Bump Packaging Players by Revenue (2020-2025)
• 5.3 Global Wafer Bump Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bump Packaging as of 2024)
• 5.4 Global Wafer Bump Packaging Average Price by Company (2020-2025)
• 5.5 Global Key Manufacturers of Wafer Bump Packaging, Manufacturing Sites & Headquarters
• 5.6 Global Key Manufacturers of Wafer Bump Packaging, Product Type & Application
• 5.7 Global Key Manufacturers of Wafer Bump Packaging, Date of Enter into This Industry
• 5.8 Manufacturers Mergers & Acquisitions, Expansion Plans

6 Region Analysis

• 6.1 North America Market: Players, Segments, Downstream and Major Customers
  • 6.1.1 North America Wafer Bump Packaging Sales by Company
    • 6.1.1.1 North America Wafer Bump Packaging Sales by Company (2020-2025)
    • 6.1.1.2 North America Wafer Bump Packaging Revenue by Company (2020-2025)
  • 6.1.2 North America Wafer Bump Packaging Sales Breakdown by Package Technology (2020-2025)
  • 6.1.3 North America Wafer Bump Packaging Sales Breakdown by Application (2020-2025)
  • 6.1.4 North America Wafer Bump Packaging Major Customer
  • 6.1.5 North America Market Trend and Opportunities
• 6.2 Europe Market: Players, Segments, Downstream and Major Customers
  • 6.2.1 Europe Wafer Bump Packaging Sales by Company
    • 6.2.1.1 Europe Wafer Bump Packaging Sales by Company (2020-2025)
    • 6.2.1.2 Europe Wafer Bump Packaging Revenue by Company (2020-2025)
  • 6.2.2 Europe Wafer Bump Packaging Sales Breakdown by Package Technology (2020-2025)
  • 6.2.3 Europe Wafer Bump Packaging Sales Breakdown by Application (2020-2025)
  • 6.2.4 Europe Wafer Bump Packaging Major Customer
  • 6.2.5 Europe Market Trend and Opportunities
• 6.3 China Market: Players, Segments, Downstream and Major Customers
  • 6.3.1 China Wafer Bump Packaging Sales by Company
    • 6.3.1.1 China Wafer Bump Packaging Sales by Company (2020-2025)
    • 6.3.1.2 China Wafer Bump Packaging Revenue by Company (2020-2025)
  • 6.3.2 China Wafer Bump Packaging Sales Breakdown by Package Technology (2020-2025)
  • 6.3.3 China Wafer Bump Packaging Sales Breakdown by Application (2020-2025)
  • 6.3.4 China Wafer Bump Packaging Major Customer
  • 6.3.5 China Market Trend and Opportunities
• 6.4 Japan Market: Players, Segments, Downstream and Major Customers
  • 6.4.1 Japan Wafer Bump Packaging Sales by Company
    • 6.4.1.1 Japan Wafer Bump Packaging Sales by Company (2020-2025)
    • 6.4.1.2 Japan Wafer Bump Packaging Revenue by Company (2020-2025)
  • 6.4.2 Japan Wafer Bump Packaging Sales Breakdown by Package Technology (2020-2025)
  • 6.4.3 Japan Wafer Bump Packaging Sales Breakdown by Application (2020-2025)
  • 6.4.4 Japan Wafer Bump Packaging Major Customer
  • 6.4.5 Japan Market Trend and Opportunities
• 6.5 South Korea Market: Players, Segments, Downstream and Major Customers
  • 6.5.1 South Korea Wafer Bump Packaging Sales by Company
    • 6.5.1.1 South Korea Wafer Bump Packaging Sales by Company (2020-2025)
    • 6.5.1.2 South Korea Wafer Bump Packaging Revenue by Company (2020-2025)
  • 6.5.2 South Korea Wafer Bump Packaging Sales Breakdown by Package Technology (2020-2025)
  • 6.5.3 South Korea Wafer Bump Packaging Sales Breakdown by Application (2020-2025)
  • 6.5.4 South Korea Wafer Bump Packaging Major Customer
  • 6.5.5 South Korea Market Trend and Opportunities

7 Company Profiles and Key Figures

• 7.1 ASE (SPIL)
  • 7.1.1 ASE (SPIL) Company Information
  • 7.1.2 ASE (SPIL) Business Overview
  • 7.1.3 ASE (SPIL) Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.1.4 ASE (SPIL) Wafer Bump Packaging Products Offered
  • 7.1.5 ASE (SPIL) Recent Development
• 7.2 Amkor Technology
  • 7.2.1 Amkor Technology Company Information
  • 7.2.2 Amkor Technology Business Overview
  • 7.2.3 Amkor Technology Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.2.4 Amkor Technology Wafer Bump Packaging Products Offered
  • 7.2.5 Amkor Technology Recent Development
• 7.3 TSMC
  • 7.3.1 TSMC Company Information
  • 7.3.2 TSMC Business Overview
  • 7.3.3 TSMC Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.3.4 TSMC Wafer Bump Packaging Products Offered
  • 7.3.5 TSMC Recent Development
• 7.4 JCET (STATS ChipPAC)
  • 7.4.1 JCET (STATS ChipPAC) Company Information
  • 7.4.2 JCET (STATS ChipPAC) Business Overview
  • 7.4.3 JCET (STATS ChipPAC) Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.4.4 JCET (STATS ChipPAC) Wafer Bump Packaging Products Offered
  • 7.4.5 JCET (STATS ChipPAC) Recent Development
• 7.5 Intel
  • 7.5.1 Intel Company Information
  • 7.5.2 Intel Business Overview
  • 7.5.3 Intel Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.5.4 Intel Wafer Bump Packaging Products Offered
  • 7.5.5 Intel Recent Development
• 7.6 Samsung
  • 7.6.1 Samsung Company Information
  • 7.6.2 Samsung Business Overview
  • 7.6.3 Samsung Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.6.4 Samsung Wafer Bump Packaging Products Offered
  • 7.6.5 Samsung Recent Development
• 7.7 SJSemi
  • 7.7.1 SJSemi Company Information
  • 7.7.2 SJSemi Business Overview
  • 7.7.3 SJSemi Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.7.4 SJSemi Wafer Bump Packaging Products Offered
  • 7.7.5 SJSemi Recent Development
• 7.8 ChipMOS TECHNOLOGIES
  • 7.8.1 ChipMOS TECHNOLOGIES Company Information
  • 7.8.2 ChipMOS TECHNOLOGIES Business Overview
  • 7.8.3 ChipMOS TECHNOLOGIES Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.8.4 ChipMOS TECHNOLOGIES Wafer Bump Packaging Products Offered
  • 7.8.5 ChipMOS TECHNOLOGIES Recent Development
• 7.9 Chipbond Technology Corporation
  • 7.9.1 Chipbond Technology Corporation Company Information
  • 7.9.2 Chipbond Technology Corporation Business Overview
  • 7.9.3 Chipbond Technology Corporation Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.9.4 Chipbond Technology Corporation Wafer Bump Packaging Products Offered
  • 7.9.5 Chipbond Technology Corporation Recent Development
• 7.10 Hefei Chipmore Technology
  • 7.10.1 Hefei Chipmore Technology Company Information
  • 7.10.2 Hefei Chipmore Technology Business Overview
  • 7.10.3 Hefei Chipmore Technology Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.10.4 Hefei Chipmore Technology Wafer Bump Packaging Products Offered
  • 7.10.5 Hefei Chipmore Technology Recent Development
• 7.11 Union Semiconductor (Hefei) Co., Ltd.
  • 7.11.1 Union Semiconductor (Hefei) Co., Ltd. Company Information
  • 7.11.2 Union Semiconductor (Hefei) Co., Ltd. Business Overview
  • 7.11.3 Union Semiconductor (Hefei) Co., Ltd. Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.11.4 Union Semiconductor (Hefei) Co., Ltd. Wafer Bump Packaging Products Offered
  • 7.11.5 Union Semiconductor (Hefei) Co., Ltd. Recent Development
• 7.12 HT-tech
  • 7.12.1 HT-tech Company Information
  • 7.12.2 HT-tech Business Overview
  • 7.12.3 HT-tech Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.12.4 HT-tech Wafer Bump Packaging Products Offered
  • 7.12.5 HT-tech Recent Development
• 7.13 Powertech Technology Inc. (PTI)
  • 7.13.1 Powertech Technology Inc. (PTI) Company Information
  • 7.13.2 Powertech Technology Inc. (PTI) Business Overview
  • 7.13.3 Powertech Technology Inc. (PTI) Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.13.4 Powertech Technology Inc. (PTI) Wafer Bump Packaging Products Offered
  • 7.13.5 Powertech Technology Inc. (PTI) Recent Development
• 7.14 Tongfu Microelectronics (TFME)
  • 7.14.1 Tongfu Microelectronics (TFME) Company Information
  • 7.14.2 Tongfu Microelectronics (TFME) Business Overview
  • 7.14.3 Tongfu Microelectronics (TFME) Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.14.4 Tongfu Microelectronics (TFME) Wafer Bump Packaging Products Offered
  • 7.14.5 Tongfu Microelectronics (TFME) Recent Development
• 7.15 Nepes
  • 7.15.1 Nepes Company Information
  • 7.15.2 Nepes Business Overview
  • 7.15.3 Nepes Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.15.4 Nepes Wafer Bump Packaging Products Offered
  • 7.15.5 Nepes Recent Development
• 7.16 LB Semicon Inc
  • 7.16.1 LB Semicon Inc Company Information
  • 7.16.2 LB Semicon Inc Business Overview
  • 7.16.3 LB Semicon Inc Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.16.4 LB Semicon Inc Wafer Bump Packaging Products Offered
  • 7.16.5 LB Semicon Inc Recent Development
• 7.17 SFA Semicon
  • 7.17.1 SFA Semicon Company Information
  • 7.17.2 SFA Semicon Business Overview
  • 7.17.3 SFA Semicon Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.17.4 SFA Semicon Wafer Bump Packaging Products Offered
  • 7.17.5 SFA Semicon Recent Development
• 7.18 International Micro Industries, Inc. (IMI)
  • 7.18.1 International Micro Industries, Inc. (IMI) Company Information
  • 7.18.2 International Micro Industries, Inc. (IMI) Business Overview
  • 7.18.3 International Micro Industries, Inc. (IMI) Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.18.4 International Micro Industries, Inc. (IMI) Wafer Bump Packaging Products Offered
  • 7.18.5 International Micro Industries, Inc. (IMI) Recent Development
• 7.19 Raytek Semiconductor
  • 7.19.1 Raytek Semiconductor Company Information
  • 7.19.2 Raytek Semiconductor Business Overview
  • 7.19.3 Raytek Semiconductor Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.19.4 Raytek Semiconductor Wafer Bump Packaging Products Offered
  • 7.19.5 Raytek Semiconductor Recent Development
• 7.20 Winstek Semiconductor
  • 7.20.1 Winstek Semiconductor Company Information
  • 7.20.2 Winstek Semiconductor Business Overview
  • 7.20.3 Winstek Semiconductor Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.20.4 Winstek Semiconductor Wafer Bump Packaging Products Offered
  • 7.20.5 Winstek Semiconductor Recent Development
• 7.21 Hana Micron
  • 7.21.1 Hana Micron Company Information
  • 7.21.2 Hana Micron Business Overview
  • 7.21.3 Hana Micron Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.21.4 Hana Micron Wafer Bump Packaging Products Offered
  • 7.21.5 Hana Micron Recent Development
• 7.22 Ningbo ChipEx Semiconductor Co., Ltd
  • 7.22.1 Ningbo ChipEx Semiconductor Co., Ltd Company Information
  • 7.22.2 Ningbo ChipEx Semiconductor Co., Ltd Business Overview
  • 7.22.3 Ningbo ChipEx Semiconductor Co., Ltd Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.22.4 Ningbo ChipEx Semiconductor Co., Ltd Wafer Bump Packaging Products Offered
  • 7.22.5 Ningbo ChipEx Semiconductor Co., Ltd Recent Development
• 7.23 UTAC
  • 7.23.1 UTAC Company Information
  • 7.23.2 UTAC Business Overview
  • 7.23.3 UTAC Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.23.4 UTAC Wafer Bump Packaging Products Offered
  • 7.23.5 UTAC Recent Development
• 7.24 Shenzhen TXD Technology
  • 7.24.1 Shenzhen TXD Technology Company Information
  • 7.24.2 Shenzhen TXD Technology Business Overview
  • 7.24.3 Shenzhen TXD Technology Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.24.4 Shenzhen TXD Technology Wafer Bump Packaging Products Offered
  • 7.24.5 Shenzhen TXD Technology Recent Development
• 7.25 Jiangsu CAS Microelectronics Integration
  • 7.25.1 Jiangsu CAS Microelectronics Integration Company Information
  • 7.25.2 Jiangsu CAS Microelectronics Integration Business Overview
  • 7.25.3 Jiangsu CAS Microelectronics Integration Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.25.4 Jiangsu CAS Microelectronics Integration Wafer Bump Packaging Products Offered
  • 7.25.5 Jiangsu CAS Microelectronics Integration Recent Development
• 7.26 Jiangsu Yidu Technology
  • 7.26.1 Jiangsu Yidu Technology Company Information
  • 7.26.2 Jiangsu Yidu Technology Business Overview
  • 7.26.3 Jiangsu Yidu Technology Wafer Bump Packaging Sales, Revenue and Gross Margin (2020-2025)
  • 7.26.4 Jiangsu Yidu Technology Wafer Bump Packaging Products Offered
  • 7.26.5 Jiangsu Yidu Technology Recent Development

8 Wafer Bump Packaging Manufacturing Cost Analysis

• 8.1 Wafer Bump Packaging Key Raw Materials Analysis
  • 8.1.1 Key Raw Materials
  • 8.1.2 Key Suppliers of Raw Materials
• 8.2 Proportion of Manufacturing Cost Structure
• 8.3 Manufacturing Process Analysis of Wafer Bump Packaging
• 8.4 Wafer Bump Packaging Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers

• 9.1 Marketing Channel
• 9.2 Wafer Bump Packaging Distributors List
• 9.3 Wafer Bump Packaging Customers

10 Wafer Bump Packaging Market Dynamics

• 10.1 Wafer Bump Packaging Industry Trends
• 10.2 Wafer Bump Packaging Market Drivers
• 10.3 Wafer Bump Packaging Market Challenges
• 10.4 Wafer Bump Packaging Market Restraints

11 Research Findings and Conclusion

12 Appendix

• 12.1 Research Methodology
  • 12.1.1 Methodology/Research Approach
    • 12.1.1.1 Research Programs/Design
    • 12.1.1.2 Market Size Estimation
    • 12.1.1.3 Market Breakdown and Data Triangulation
  • 12.1.2 Data Source
    • 12.1.2.1 Secondary Sources
    • 12.1.2.2 Primary Sources
• 12.2 Author Details
• 12.3 Disclaimer

List of Tables

Table 1. Global Wafer Bump Packaging Sales (US$ Million) Growth Rate by Package Technology (2020 & 2024 & 2031)

Table 2. Global Wafer Bump Packaging Sales (US$ Million) Comparison by Application (2020 & 2024 & 2031)

Table 3. Global Market Wafer Bump Packaging Market Size (US$ Million) by Region:2020 VS 2024 VS 2031

Table 4. Global Wafer Bump Packaging Sales (K Wafers) by Region (2020-2025)

Table 5. Global Wafer Bump Packaging Sales Market Share by Region (2020-2025)

Table 6. Global Wafer Bump Packaging Revenue (US$ Million) Market Share by Region (2020-2025)

Table 7. Global Wafer Bump Packaging Revenue Share by Region (2020-2025)

Table 8. Global Wafer Bump Packaging Sales (K Wafers) Forecast by Region (2026-2031)

Table 9. Global Wafer Bump Packaging Sales Market Share Forecast by Region (2026-2031)

Table 10. Global Wafer Bump Packaging Revenue (US$ Million) Forecast by Region (2026-2031)

Table 11. Global Wafer Bump Packaging Revenue Share Forecast by Region (2026-2031)

Table 12. Global Wafer Bump Packaging Sales by Package Technology (K Wafers) & (2020-2025)

Table 13. Global Wafer Bump Packaging Sales Share by Package Technology (2020-2025)

Table 14. Global Wafer Bump Packaging Revenue by Package Technology (US$ Million) & (2020-2025)

Table 15. Global Wafer Bump Packaging Price by Package Technology (US$/Wafer) & (2020-2025)

Table 16. Global Wafer Bump Packaging Sales by Package Technology (K Wafers) & (2026-2031)

Table 17. Global Wafer Bump Packaging Revenue by Package Technology (US$ Million) & (2026-2031)

Table 18. Global Wafer Bump Packaging Price by Package Technology (US$/Wafer) & (2026-2031)

Table 19. Representative Players of Each Type

Table 20. Global Wafer Bump Packaging Sales by Application (K Wafers) & (2020-2025)

Table 21. Global Wafer Bump Packaging Sales Share by Application (2020-2025)

Table 22. Global Wafer Bump Packaging Revenue by Application (US$ Million) & (2020-2025)

Table 23. Global Wafer Bump Packaging Price by Application (US$/Wafer) & (2020-2025)

Table 24. Global Wafer Bump Packaging Sales by Application (K Wafers) & (2026-2031)

Table 25. Global Wafer Bump Packaging Revenue Market Share by Application (US$ Million) & (2026-2031)

Table 26. Global Wafer Bump Packaging Price by Application (US$/Wafer) & (2026-2031)

Table 27. New Sources of Growth in Wafer Bump Packaging Application

Table 28. Global Wafer Bump Packaging Sales by Company (K Wafers) & (2020-2025)

Table 29. Global Wafer Bump Packaging Sales Share by Company (2020-2025)

Table 30. Global Wafer Bump Packaging Revenue by Company (US$ Million) & (2020-2025)

Table 31. Global Wafer Bump Packaging Revenue Share by Company (2020-2025)

Table 32. Global Wafer Bump Packaging by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bump Packaging as of 2024)

Table 33. Global Market Wafer Bump Packaging Average Price by Company (US$/Wafer) & (2020-2025)

Table 34. Global Key Manufacturers of Wafer Bump Packaging, Manufacturing Sites & Headquarters

Table 35. Global Key Manufacturers of Wafer Bump Packaging, Product Type & Application

Table 36. Global Key Manufacturers of Wafer Bump Packaging, Date of Enter into This Industry

Table 37. Manufacturers Mergers & Acquisitions, Expansion Plans

Table 38. North America Wafer Bump Packaging Sales by Company (2020-2025) & (K Wafers)

Table 39. North America Wafer Bump Packaging Sales Market Share by Company (2020-2025)

Table 40. North America Wafer Bump Packaging Revenue by Company (2020-2025) & (US$ Million)

Table 41. North America Wafer Bump Packaging Revenue Market Share by Company (2020-2025)

Table 42. North America Wafer Bump Packaging Sales by Package Technology (2020-2025) & (K Wafers)

Table 43. North America Wafer Bump Packaging Sales Market Share by Package Technology (2020-2025)

Table 44. North America Wafer Bump Packaging Sales by Application (2020-2025) & (K Wafers)

Table 45. North America Wafer Bump Packaging Sales Market Share by Application (2020-2025)

Table 46. Europe Wafer Bump Packaging Sales by Company (2020-2025) & (K Wafers)

Table 47. Europe Wafer Bump Packaging Sales Market Share by Company (2020-2025)

Table 48. Europe Wafer Bump Packaging Revenue by Company (2020-2025) & (US$ Million)

Table 49. Europe Wafer Bump Packaging Revenue Market Share by Company (2020-2025)

Table 50. Europe Wafer Bump Packaging Sales by Package Technology (2020-2025) & (K Wafers)

Table 51. Europe Wafer Bump Packaging Sales Market Share by Package Technology (2020-2025)

Table 52. Europe Wafer Bump Packaging Sales by Application (2020-2025) & (K Wafers)

Table 53. Europe Wafer Bump Packaging Sales Market Share by Application (2020-2025)

Table 54. China Wafer Bump Packaging Sales by Company (2020-2025) & (K Wafers)

Table 55. China Wafer Bump Packaging Sales Market Share by Company (2020-2025)

Table 56. China Wafer Bump Packaging Revenue by Company (2020-2025) & (US$ Million)

Table 57. China Wafer Bump Packaging Revenue Market Share by Company (2020-2025)

Table 58. China Wafer Bump Packaging Sales by Package Technology (2020-2025) & (K Wafers)

Table 59. China Wafer Bump Packaging Sales Market Share by Package Technology (2020-2025)

Table 60. China Wafer Bump Packaging Sales by Application (2020-2025) & (K Wafers)

Table 61. China Wafer Bump Packaging Sales Market Share by Application (2020-2025)

Table 62. Japan Wafer Bump Packaging Sales by Company (2020-2025) & (K Wafers)

Table 63. Japan Wafer Bump Packaging Sales Market Share by Company (2020-2025)

Table 64. Japan Wafer Bump Packaging Revenue by Company (2020-2025) & (US$ Million)

Table 65. Japan Wafer Bump Packaging Revenue Market Share by Company (2020-2025)

Table 66. Japan Wafer Bump Packaging Sales by Package Technology (2020-2025) & (K Wafers)

Table 67. Japan Wafer Bump Packaging Sales Market Share by Package Technology (2020-2025)

Table 68. Japan Wafer Bump Packaging Sales by Application (2020-2025) & (K Wafers)

Table 69. Japan Wafer Bump Packaging Sales Market Share by Application (2020-2025)

Table 70. South Korea Wafer Bump Packaging Sales by Company (2020-2025) & (K Wafers)

Table 71. South Korea Wafer Bump Packaging Sales Market Share by Company (2020-2025)

Table 72. South Korea Wafer Bump Packaging Revenue by Company (2020-2025) & (US$ Million)

Table 73. South Korea Wafer Bump Packaging Revenue Market Share by Company (2020-2025)

Table 74. South Korea Wafer Bump Packaging Sales by Package Technology (2020-2025) & (K Wafers)

Table 75. South Korea Wafer Bump Packaging Sales Market Share by Package Technology (2020-2025)

Table 76. South Korea Wafer Bump Packaging Sales by Application (2020-2025) & (K Wafers)

Table 77. South Korea Wafer Bump Packaging Sales Market Share by Application (2020-2025)

Table 78. ASE (SPIL) Company Information

Table 79. ASE (SPIL) Description and Business Overview

Table 80. ASE (SPIL) Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 81. ASE (SPIL) Wafer Bump Packaging Product

Table 82. ASE (SPIL) Recent Development

Table 83. Amkor Technology Company Information

Table 84. Amkor Technology Description and Business Overview

Table 85. Amkor Technology Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 86. Amkor Technology Wafer Bump Packaging Product

Table 87. Amkor Technology Recent Development

Table 88. TSMC Company Information

Table 89. TSMC Description and Business Overview

Table 90. TSMC Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 91. TSMC Wafer Bump Packaging Product

Table 92. TSMC Recent Development

Table 93. JCET (STATS ChipPAC) Company Information

Table 94. JCET (STATS ChipPAC) Description and Business Overview

Table 95. JCET (STATS ChipPAC) Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 96. JCET (STATS ChipPAC) Wafer Bump Packaging Product

Table 97. JCET (STATS ChipPAC) Recent Development

Table 98. Intel Company Information

Table 99. Intel Description and Business Overview

Table 100. Intel Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 101. Intel Wafer Bump Packaging Product

Table 102. Intel Recent Development

Table 103. Samsung Company Information

Table 104. Samsung Description and Business Overview

Table 105. Samsung Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 106. Samsung Wafer Bump Packaging Product

Table 107. Samsung Recent Development

Table 108. SJSemi Company Information

Table 109. SJSemi Description and Business Overview

Table 110. SJSemi Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 111. SJSemi Wafer Bump Packaging Product

Table 112. SJSemi Recent Development

Table 113. ChipMOS TECHNOLOGIES Company Information

Table 114. ChipMOS TECHNOLOGIES Description and Business Overview

Table 115. ChipMOS TECHNOLOGIES Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 116. ChipMOS TECHNOLOGIES Wafer Bump Packaging Product

Table 117. ChipMOS TECHNOLOGIES Recent Development

Table 118. Chipbond Technology Corporation Company Information

Table 119. Chipbond Technology Corporation Description and Business Overview

Table 120. Chipbond Technology Corporation Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 121. Chipbond Technology Corporation Wafer Bump Packaging Product

Table 122. Chipbond Technology Corporation Recent Development

Table 123. Hefei Chipmore Technology Company Information

Table 124. Hefei Chipmore Technology Description and Business Overview

Table 125. Hefei Chipmore Technology Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 126. Hefei Chipmore Technology Wafer Bump Packaging Product

Table 127. Hefei Chipmore Technology Recent Development

Table 128. Union Semiconductor (Hefei) Co., Ltd. Company Information

Table 129. Union Semiconductor (Hefei) Co., Ltd. Description and Business Overview

Table 130. Union Semiconductor (Hefei) Co., Ltd. Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 131. Union Semiconductor (Hefei) Co., Ltd. Wafer Bump Packaging Product

Table 132. Union Semiconductor (Hefei) Co., Ltd. Recent Development

Table 133. HT-tech Company Information

Table 134. HT-tech Description and Business Overview

Table 135. HT-tech Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 136. HT-tech Wafer Bump Packaging Product

Table 137. HT-tech Recent Development

Table 138. Powertech Technology Inc. (PTI) Company Information

Table 139. Powertech Technology Inc. (PTI) Description and Business Overview

Table 140. Powertech Technology Inc. (PTI) Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 141. Powertech Technology Inc. (PTI) Wafer Bump Packaging Product

Table 142. Powertech Technology Inc. (PTI) Recent Development

Table 143. Tongfu Microelectronics (TFME) Company Information

Table 144. Tongfu Microelectronics (TFME) Description and Business Overview

Table 145. Tongfu Microelectronics (TFME) Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 146. Tongfu Microelectronics (TFME) Wafer Bump Packaging Product

Table 147. Tongfu Microelectronics (TFME) Recent Development

Table 148. Nepes Company Information

Table 149. Nepes Description and Business Overview

Table 150. Nepes Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 151. Nepes Wafer Bump Packaging Product

Table 152. Nepes Recent Development

Table 153. LB Semicon Inc Company Information

Table 154. LB Semicon Inc Description and Business Overview

Table 155. LB Semicon Inc Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 156. LB Semicon Inc Wafer Bump Packaging Product

Table 157. LB Semicon Inc Recent Development

Table 158. SFA Semicon Company Information

Table 159. SFA Semicon Description and Business Overview

Table 160. SFA Semicon Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 161. SFA Semicon Wafer Bump Packaging Product

Table 162. SFA Semicon Recent Development

Table 163. International Micro Industries, Inc. (IMI) Company Information

Table 164. International Micro Industries, Inc. (IMI) Description and Business Overview

Table 165. International Micro Industries, Inc. (IMI) Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 166. International Micro Industries, Inc. (IMI) Wafer Bump Packaging Product

Table 167. International Micro Industries, Inc. (IMI) Recent Development

Table 168. Raytek Semiconductor Company Information

Table 169. Raytek Semiconductor Description and Business Overview

Table 170. Raytek Semiconductor Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 171. Raytek Semiconductor Wafer Bump Packaging Product

Table 172. Raytek Semiconductor Recent Development

Table 173. Winstek Semiconductor Company Information

Table 174. Winstek Semiconductor Description and Business Overview

Table 175. Winstek Semiconductor Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 176. Winstek Semiconductor Wafer Bump Packaging Product

Table 177. Winstek Semiconductor Recent Development

Table 178. Hana Micron Company Information

Table 179. Hana Micron Description and Business Overview

Table 180. Hana Micron Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 181. Hana Micron Wafer Bump Packaging Product

Table 182. Hana Micron Recent Development

Table 183. Ningbo ChipEx Semiconductor Co., Ltd Company Information

Table 184. Ningbo ChipEx Semiconductor Co., Ltd Description and Business Overview

Table 185. Ningbo ChipEx Semiconductor Co., Ltd Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 186. Ningbo ChipEx Semiconductor Co., Ltd Wafer Bump Packaging Product

Table 187. Ningbo ChipEx Semiconductor Co., Ltd Recent Development

Table 188. UTAC Company Information

Table 189. UTAC Description and Business Overview

Table 190. UTAC Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 191. UTAC Wafer Bump Packaging Product

Table 192. UTAC Recent Development

Table 193. Shenzhen TXD Technology Company Information

Table 194. Shenzhen TXD Technology Description and Business Overview

Table 195. Shenzhen TXD Technology Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 196. Shenzhen TXD Technology Wafer Bump Packaging Product

Table 197. Shenzhen TXD Technology Recent Development

Table 198. Jiangsu CAS Microelectronics Integration Company Information

Table 199. Jiangsu CAS Microelectronics Integration Description and Business Overview

Table 200. Jiangsu CAS Microelectronics Integration Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 201. Jiangsu CAS Microelectronics Integration Wafer Bump Packaging Product

Table 202. Jiangsu CAS Microelectronics Integration Recent Development

Table 203. Jiangsu Yidu Technology Company Information

Table 204. Jiangsu Yidu Technology Description and Business Overview

Table 205. Jiangsu Yidu Technology Wafer Bump Packaging Sales (K Wafers), Revenue (US$ Million), Price (US$/Wafer) and Gross Margin (2020-2025)

Table 206. Jiangsu Yidu Technology Wafer Bump Packaging Product

Table 207. Jiangsu Yidu Technology Recent Development

Table 208. Production Base and Market Concentration Rate of Raw Material

Table 209. Key Suppliers of Raw Materials

Table 210. Wafer Bump Packaging Distributors List

Table 211. Wafer Bump Packaging Customers List

Table 212. Wafer Bump Packaging Market Trends

Table 213. Wafer Bump Packaging Market Drivers

Table 214. Wafer Bump Packaging Market Challenges

Table 215. Wafer Bump Packaging Market Restraints

Table 216. Research Programs/Design for This Report

Table 217. Key Data Information from Secondary Sources

Table 218. Key Data Information from Primary Sources

List of Figures

Figure 1. Wafer Bump Packaging Product Picture

Figure 2. Global Wafer Bump Packaging Sales (US$ Million) by Package Technology (2020 & 2024 & 2031)

Figure 3. Global Wafer Bump Packaging Sales Market Share by Package Technology in 2024 & 2031

Figure 4. FC Bumping Product Picture

Figure 5. WLCSP Product Picture

Figure 6. uBump (2.5D/3D) Product Picture

Figure 7. Bump for DDIC Product Picture

Figure 8. Others Product Picture

Figure 9. Global Wafer Bump Packaging Sales (US$ Million) by Application (2020 & 2024 & 2031)

Figure 10. Global Wafer Bump Packaging Sales Market Share by Application in 2024 & 2031

Figure 11. Smartphone Examples

Figure 12. LCD TV Examples

Figure 13. Notebook Examples

Figure 14. Tablet Examples

Figure 15. Monitor Examples

Figure 16. Other Examples

Figure 17. Global Wafer Bump Packaging Sales, (US$ Million), 2020 VS 2024 VS 2031

Figure 18. Global Wafer Bump Packaging Sales Growth Rate (2020-2031) & (US$ Million)

Figure 19. Global Wafer Bump Packaging Sales (K Wafers) Growth Rate (2020-2031)

Figure 20. Global Wafer Bump Packaging Price Trends Growth Rate (2020-2031) & (US$/Wafer)

Figure 21. Wafer Bump Packaging Report Years Considered

Figure 22. Global Market Wafer Bump Packaging Market Size (US$ Million) by Region:2020 VS 2024 VS 2031

Figure 23. Global Wafer Bump Packaging Revenue Market Share by Region: 2020 VS 2024

Figure 24. North America Wafer Bump Packaging Revenue (US$ Million) Growth Rate (2020-2031)

Figure 25. North America Wafer Bump Packaging Sales (K Wafers) Growth Rate (2020-2031)

Figure 26. Europe Wafer Bump Packaging Revenue (US$ Million) Growth Rate (2020-2031)

Figure 27. Europe Wafer Bump Packaging Sales (K Wafers) Growth Rate (2020-2031)

Figure 28. China Wafer Bump Packaging Revenue (US$ Million) Growth Rate (2020-2031)

Figure 29. China Wafer Bump Packaging Sales (K Wafers) Growth Rate (2020-2031)

Figure 30. Japan Wafer Bump Packaging Revenue (US$ Million) Growth Rate (2020-2031)

Figure 31. Japan Wafer Bump Packaging Sales (K Wafers) Growth Rate (2020-2031)

Figure 32. South Korea Wafer Bump Packaging Revenue (US$ Million) Growth Rate (2020-2031)

Figure 33. South Korea Wafer Bump Packaging Sales (K Wafers) Growth Rate (2020-2031)

Figure 34. Global Wafer Bump Packaging Revenue Share by Package Technology (2020-2025)

Figure 35. Global Wafer Bump Packaging Sales Share by Package Technology (2026-2031)

Figure 36. Global Wafer Bump Packaging Revenue Share by Package Technology (2026-2031)

Figure 37. Global Wafer Bump Packaging Revenue Share by Application (2020-2025)

Figure 38. Global Wafer Bump Packaging Revenue Growth Rate by Application in 2020 & 2024

Figure 39. Global Wafer Bump Packaging Sales Share by Application (2026-2031)

Figure 40. Global Wafer Bump Packaging Revenue Share by Application (2026-2031)

Figure 41. Global Wafer Bump Packaging Sales Share by Company (2024)

Figure 42. Global Wafer Bump Packaging Revenue Share by Company (2024)

Figure 43. Global 5 Largest Wafer Bump Packaging Players Market Share by Revenue in Wafer Bump Packaging: 2020 & 2024

Figure 44. Wafer Bump Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 45. Manufacturing Cost Structure of Wafer Bump Packaging

Figure 46. Manufacturing Process Analysis of Wafer Bump Packaging

Figure 47. Wafer Bump Packaging Industrial Chain

Figure 48. Channels of Distribution (Direct Vs Distribution)

Figure 49. Distributors Profiles

Figure 50. Bottom-up and Top-down Approaches for This Report

Figure 51. Data Triangulation

Figure 52. Key Executives Interviewed