PUBLISHER: QYResearch | PRODUCT CODE: 1820683
PUBLISHER: QYResearch | PRODUCT CODE: 1820683
A rotary union or swivel joint is a mechanism used to transfer fluid (under pressure or vacuum) from a stationary inlet to a rotating outlet, preserving and isolating the fluid connection. Also referred to as rotary joints, rotary couplings, fluid swivels or swivel joints; rotary unions are engineered to endure a large range of temperatures, pressures and speeds for a variety of conditions and environments. Rotary unions typically function by connecting to an input and securing onto another mechanism while allowing a moving connection to be preserved.
The global market for Rotary Unions for Semiconductor was estimated at US$ 77.47 million in the year 2024, is projected to reach a revised size of US$ 125.36 million by 2031, growing at a CAGR of 5.99% during the forecast period 2025-2031.
North America market for Rotary Unions for Semiconductor was valued at $ 40.94 million in 2024 and will reach $ 65.06 million by 2031, at a CAGR of 5.68% during the forecast period of 2025 through 2031.
Japan market for Rotary Unions for Semiconductor was valued at $ 15 million in 2024 and will reach $ 21.82 million by 2031, at a CAGR of 4.58% during the forecast period of 2025 through 2031.
Europe market for Rotary Unions for Semiconductor was valued at $ 9.53 million in 2024 and will reach $ 14.69 million by 2031, at a CAGR of 5.56% during the forecast period of 2025 through 2031.
China mainland market for Rotary Unions for Semiconductor was valued at $ 4.58 million in 2024 and will reach $ 11.9 million by 2031, at a CAGR of 12.48% during the forecast period of 2025 through 2031.
The global key manufacturers of Rotary Unions for Semiconductor include Deublin, Eagle Industry, DSTI (Dynamic Sealing Technologies, Inc), Moog GAT GmbH, Rotary Systems Inc and RIX Corporation, etc. In 2024, the global top five players have a share approximately 78.6% in terms of revenue. Currently the key players are mainly located in US, Japan, and Europe. There are few players in China, are developing the Rotary Unions for Semiconductor equipment, JiangSu Benecke Sealing Technology, SENRING Electronics, Tengxuan Technology, and CENO Electronics Technology, etc.
In terms of application, currently Multi Passage Rotary Unions are dominating this market, major segment products are 2 Passages, 3 Passages, 4 Passages, 5 Passages, 6 Passages, 8 Passages, etc.
And in terms of application, CMP machine is the largest application, holds share about 45.9%. The key end users are Applied Materials, Ebara Corporation, KC Tech, and Tianjin Huahaiqingke, etc. These players are mainly located in US, Japan, South Korea and China, etc.
At present, the rotary unions for semiconductor industry is in a stage of steady technological refinement. Global suppliers are focusing on extending product lifespans, reducing leakage, improving corrosion resistance, and enabling compatibility with aggressive chemistries. With the shift toward sub-5nm nodes and heterogeneous integration, demand for highly reliable and contamination-free rotary unions is increasing. Future trends include the integration of smart monitoring sensors for predictive maintenance, miniaturized and modular designs to fit advanced equipment layouts, and adoption of eco-friendly materials to align with sustainability goals. Furthermore, the expansion of fabs in Asia, particularly in China, Taiwan, and South Korea, is expected to drive significant market growth over the next decade.
Key growth drivers include the global semiconductor capacity expansion, the rising complexity of CMP and wet process tools, and the push toward Industry 4.0 and smart fabs, which require enhanced monitoring and predictive analytics for equipment components. Additionally, increasing demand from foundries and IDMs for reliable and long-life rotary unions provides strong market momentum. However, the industry faces several challenges: technical barriers in producing leak-free unions for ultra-pure chemicals, cost pressure from semiconductor OEMs, regional supply chain dependencies, and stringent certification requirements. Moreover, the rapid pace of technology scaling means suppliers must continuously invest in R&D to keep up with evolving equipment needs, which can strain smaller players.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Rotary Unions for Semiconductor, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Rotary Unions for Semiconductor.
The Rotary Unions for Semiconductor market size, estimations, and forecasts are provided in terms of sales volume (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Rotary Unions for Semiconductor market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Rotary Unions for Semiconductor market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
Market Segmentation
This report covers the Rotary Unions for Semiconductor segments by manufacturers, by Type, by Application, by region and country, and provides market size (value, volume and average price) and CAGR for the history and forecast period (2020-2024, 2025-2031), considering 2024 as the base year. It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market.
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Rotary Unions for Semiconductor manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Rotary Unions for Semiconductor in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.