PUBLISHER: QYResearch | PRODUCT CODE: 1857119
 
				PUBLISHER: QYResearch | PRODUCT CODE: 1857119
The global market for SiC Polishing Consumables was estimated to be worth US$ 134 million in 2024 and is forecast to a readjusted size of US$ 472 million by 2031 with a CAGR of 19.6% during the forecast period 2025-2031.
Silicon Carbide (SiC) is a wide band gap semiconductor that can operate at higher temperature, power level, and voltage. This enables improved energy efficiency in power devices, LED lighting, and telecommunications. Because of its unique properties, SiC is the material of choice for diverse applications such as Hybrid Electric vehicles, power electronic switches, and LED lighting technology.
This report studies the SiC Polishing Consumables, include the SiC CMP Slurry and SiC CMP Pad.
The global key players of SiC polishing consumables include DuPont, Entegris, Fujimi Corporation, Saint-Gobain, Fujibo and Shanghai Xinanna, etc. In 2024, the global top four players occupied for a share approximately 82% in terms of revenue.
The key players of SiC CMP slurry include Entegris, Fujimi Corporation, Saint-Gobain, and Shanghai Xinanna, etc. In 2024, the global top three players occupied for a share approximately 82.4% in terms of revenue.
The key players of SiC CMP pads include DuPont, Entegris, and Fujibo, etc. DuPont is domaing the global SiC CMP pads market, holds a share over 75%.
The market for silicon carbide (SiC) chemical mechanical polishing (CMP) consumables, including slurries and pads, is at a pivotal stage, reflecting the rapid growth of the SiC wafer industry itself. Currently, the market is highly concentrated, with a small number of key players dominating the supply chain. Entegris and Fujimi Corporation are the established leaders in SiC CMP slurries, leveraging their deep expertise in materials science to develop proprietary formulations that meet the stringent demands of SiC polishing. Similarly, DuPont and Fujibo hold a commanding position in the SiC CMP pads market. This limited number of suppliers, while ensuring high quality and performance, also presents a potential bottleneck for future capacity expansion. Most of the market activity today is focused on 6-inch SiC wafers, which have become the industry standard for power electronics and are critical for the automotive and energy sectors. However, there is a nascent but growing demand for 8-inch wafers, which promises economies of scale and is a key focus for leading SiC manufacturers like Wolfspeed and STMicroelectronics. The performance of these consumables directly impacts the final device yield and quality, making their development a critical path item for the entire SiC ecosystem.
Several powerful trends are acting as tailwinds for the SiC CMP consumables market. First and foremost is the accelerated adoption of SiC in electric vehicles (EVs). SiC power devices are crucial for EV inverters, on-board chargers, and DC-DC converters due to their superior efficiency, power density, and thermal conductivity compared to traditional silicon-based solutions. As EV production scales up globally, so does the demand for SiC wafers and, by extension, the consumables used to polish them. Second, the global push for renewable energy is a significant driver. SiC components are essential for solar inverters and wind turbine systems, where they help maximize energy conversion efficiency. The third factor is the transition from 6-inch to 8-inch wafers. This shift is driven by the semiconductor industry's constant quest for lower costs per die. As major SiC manufacturers invest heavily in 8-inch fabrication lines, the demand for high-performance CMP slurries and pads specifically optimized for these larger wafers will surge. This transition will require significant R&D investment from consumables suppliers to address new technical challenges related to polishing uniformity and defectivity on larger substrates.
Despite the robust growth drivers, the SiC CMP consumables industry faces significant challenges. The primary obstacle is the extreme hardness and chemical inertness of SiC, which makes polishing an inherently difficult and slow process. This necessitates the use of abrasive slurries and durable pads that are both effective and cost-effective. Developing new formulations that can achieve higher material removal rates (MRR) while minimizing surface defects remains a major technical hurdle. A second major challenge is the high cost and limited supply of raw materials, particularly the specialized abrasives and chemicals used in slurries. The concentrated nature of the market could also be a point of concern, as it could lead to potential supply chain vulnerabilities if a key supplier faces production issues. Furthermore, the lack of a standardized polishing process across different SiC device manufacturers adds complexity. Each manufacturer has its own proprietary recipes, requiring consumables suppliers to develop a wide range of products or work closely with individual customers on tailored solutions. This fragmentation can slow down the overall maturation of the industry and hinder the development of universal, high-yield polishing processes.
This report aims to provide a comprehensive presentation of the global market for SiC Polishing Consumables, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of SiC Polishing Consumables by region & country, by Type, and by Wafer Size.
The SiC Polishing Consumables market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Polishing Consumables.
Market Segmentation
By Company
Segment by Type
Segment by Wafer Size
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of SiC Polishing Consumables company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Wafer Size, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of SiC Polishing Consumables in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of SiC Polishing Consumables in country level. It provides sigmate data by Type, and by Wafer Size for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
 
                 
                 
                