PUBLISHER: QYResearch | PRODUCT CODE: 1859952
PUBLISHER: QYResearch | PRODUCT CODE: 1859952
The global market for Liquid Photosensitive Solder Resist Ink for FPC was estimated to be worth US$ 29.64 million in 2024 and is forecast to a readjusted size of US$ 41.62 million by 2031 with a CAGR of 4.4% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Liquid Photosensitive Solder Resist Ink for FPC cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
In 2024, the production of liquid photosensitive solder mask ink for FPCs reached 450.8 tons, with an average selling price of US$65,616.68 per ton. Liquid photosensitive solder mask ink for FPCs is a solder mask material that can be sprayed or coated onto flexible circuit boards and cured by light. It maintains conductivity in unexposed areas, allows for subsequent processing in exposed areas, and forms a protective layer in exposed areas. The upstream components of FPC liquid photosensitive solder mask ink include resins, photoinitiators, and pigments. The global resin market is dominated by companies from Japan, South Korea, and the United States. Domestic companies have a certain share in the mid- and low-end markets, but high-end products still rely on imports. China is a major producer of photoinitiators, with production of most major photoinitiator products concentrated in China. There are many types of photoinitiators, with the most popular varieties being 907, TPO, 184, 1173, DETX, and ITX, which can be blended to meet specific needs. The pigment market is currently experiencing steady growth. China has become a major global producer and exporter of organic pigments, ranking among the top in both production and export volumes. Strengthened environmental regulations and technological innovation are driving sustainable market development, boosting the adoption of water-based systems, high-performance materials (such as synthetic mica), and environmentally friendly formulations. Taiyo Ink Mfg., a globally renowned electronic materials supplier, boasts extensive technical expertise and widespread market recognition in liquid photosensitive solder mask inks for FPCs. Its products are renowned for their high precision and reliability, particularly in high-end FPC applications. In recent years, Chinese domestic companies have made significant progress in this field. Companies like Guangxin Materials and Rongda Photosensitive have steadily narrowed the technological gap with international giants by increasing R&D investment and optimizing production processes. These companies have not only continuously improved product performance but also earned recognition in the domestic market through cost advantages and rapid responsiveness. For example, Guangxin Materials' FPC photosensitive ink series has been applied in rigid-flex boards, backlight panels, and other applications, steadily expanding its market share. With the rapid development of the domestic FPC industry, demand for domestically produced inks is also increasing, accelerating the process of domestic substitution, providing a broad market opportunity for domestic companies.
Development Trends of Liquid Photosensitive Solder Mask Inks for FPCs
Market Demand Continues to Grow
With the rapid development of consumer electronics, new energy vehicles, the Internet of Things, and other fields, the application scenarios of FPCs (flexible printed circuit boards) continue to expand, and the demand for liquid photosensitive solder mask inks continues to increase. For example, the lightweight and thin designs of smartphones and wearable devices, as well as the electronic upgrades of new energy vehicles, all rely on the high performance and reliability of FPCs, thereby driving the growth of the solder mask ink market.
Product Performance Upgrades
Improved Thermal Shock Resistance: For temperature-sensitive applications such as new energy vehicles and aerospace, the next generation of inks will utilize novel resin systems and thermally conductive fillers to enhance thermal stress buffering and ensure stable operation in extreme temperatures.
Fast Curing Speed: By optimizing the dual-curing mechanism of light and heat and microwave-assisted technology, curing time is shortened, production efficiency is improved, and energy consumption is reduced.
Enhanced Weather Resistance: The development of fluorine-silicon modified resins and nano-ceramic composite coating technologies improves the protective performance of inks in harsh environments such as outdoor and marine environments.
Accelerating Domestic Substitution
Chinese domestic companies are continuously improving their technological capabilities, gradually narrowing the gap with international giants. In sectors such as consumer electronics and new energy, the market share of domestically produced liquid photosensitive solder mask inks for FPCs is expected to further expand, particularly in the mid- and low-end markets, where they offer cost and supply chain advantages.
Driven by Technological Innovation
Companies will increase R&D investment in new resin materials, photoinitiators, and nanotechnology, driving product development towards high performance, high precision, and intelligent capabilities. For example, self-healing microcapsule technology will enhance ink durability.
Driven by Rigid-Flexible PCB Technology
Currently, with growing demand in emerging downstream sectors such as emerging electronics, automotive electronics, artificial intelligence, and cloud computing, rigid-flexible PCBs-a combination of rigid printed circuit boards (PCBs) and flexible printed circuit boards (FPCs)-are becoming an industry trend. They are widely used in products such as mobile phone cameras, laptops, laser printers, and medical, military, and aviation applications.
This report aims to provide a comprehensive presentation of the global market for Liquid Photosensitive Solder Resist Ink for FPC, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Liquid Photosensitive Solder Resist Ink for FPC by region & country, by Type, and by Application.
The Liquid Photosensitive Solder Resist Ink for FPC market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Liquid Photosensitive Solder Resist Ink for FPC.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Liquid Photosensitive Solder Resist Ink for FPC manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Liquid Photosensitive Solder Resist Ink for FPC in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Liquid Photosensitive Solder Resist Ink for FPC in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.