PUBLISHER: QYResearch | PRODUCT CODE: 1860052
PUBLISHER: QYResearch | PRODUCT CODE: 1860052
The global market for Dicing Blade was estimated to be worth US$ 701 million in 2024 and is forecast to a readjusted size of US$ 1255 million by 2031 with a CAGR of 7.6% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Dicing Blade cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
According to market research, annual global sales in terms of units for Dicing Blades are estimated to be 25-30 Million Pcs in 2024. Prices vary significantly depending on product specifications, with an overall price range of $25-30 per Piece.
A Dicing Blade is a tool used for precision cutting of thin materials such as semiconductor wafers, optical glass, LEDs, and integrated circuits. It is typically made from diamond particles, superhard metals, or ceramics, which provide high hardness and wear resistance. Dicing blades are essential for industries such as semiconductor, optics, and electronics.
The main types of dicing blades are:
Diamond Dicing Blade: Used for cutting hard materials like silicon wafers, gallium arsenide, sapphire, etc. The diamond particles provide precise cutting force, minimizing thermal impact during the cutting process and preventing damage to the material.
Ceramic Dicing Blade: Suitable for cutting softer materials, such as electronic packaging materials and optical components.
Resin Bonded Dicing Blade: Typically used for medium-hardness materials, it offers higher cutting efficiency and cost-effectiveness, commonly found in mass production environments.
Key characteristics of dicing blades include high precision, minimal heat impact, and stable cutting performance, making them ideal for high-precision cutting tasks.
Market Opportunities and Key Drivers:
Growth of the Semiconductor Industry: With the widespread adoption of 5G, AI, IoT, and other technologies, the demand for semiconductor products continues to increase, driving the need for dicing blades in wafer cutting.
Optics and LED Markets: As optical glass and LED display technologies evolve, the demand for precision cutting tools grows, particularly in high-precision processing.
Electric Vehicles and New Energy: The growing need for precise cutting in the production of batteries and electronic components further stimulates demand for dicing blades.
Market Risks:
Technological Barriers and Production Costs: The manufacturing process for materials like diamond requires high-level technology and expensive raw materials, which pose challenges to manufacturers' technical capabilities and financial resources.
Intense Competition: Although large manufacturers dominate the market, increasing demand has led to heightened price competition, potentially decreasing profit margins.
Raw Material Shortages: Fluctuations in the supply chain for high-performance materials like diamond may introduce uncertainty into production.
Market Concentration: The dicing blade market is relatively concentrated, with major companies like DISCO and Mitsubishi Heavy Industries leading the industry. These firms have advantages in technology development, product quality, and market share. However, as the market expands, smaller companies are also entering the market, intensifying competition.
Downstream Demand Trends:
Semiconductor Industry: With the miniaturization and performance enhancement of chips, there is a rising demand for dicing blades, particularly in integrated circuits, MEMS, and optical chips.
Optics and LED Industries: As demand for precise optical components increases in smartphones, automotive, and television devices, the demand for dicing blades will continue to grow.
Latest Technologies:
Laser-Assisted Cutting Technology: The application of laser technology helps reduce thermal effects during cutting, improving both precision and efficiency.
Diamond Coated Blades: The addition of a diamond coating to blades enhances durability and extends their service life.
Composite Material Blades: Using composite materials to combine the benefits of different materials, these blades improve cutting efficiency and quality.
This report aims to provide a comprehensive presentation of the global market for Dicing Blade, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Dicing Blade by region & country, by Type, and by Application.
The Dicing Blade market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Dicing Blade.
Market Segmentation
By Company
Segment by Type
Segment by Material
Segment by Diameter
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Dicing Blade manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Dicing Blade in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Dicing Blade in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.