PUBLISHER: QYResearch | PRODUCT CODE: 1860072
PUBLISHER: QYResearch | PRODUCT CODE: 1860072
The global market for High End PCB was estimated to be worth US$ 68347 million in 2024 and is forecast to a readjusted size of US$ 95780 million by 2031 with a CAGR of 4.9% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on High End PCB cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Printed circuit boards (PCBs), also known as electronic circuit boards, are essential components found in various electronic devices that support our daily lives. The role of a printed circuit board is to serve as a foundation for mounting components and to establish electrical connections between them, allowing the transmission of electrical signals.
To draw an analogy, a printed circuit board functions as the skeletal and nervous system of the human body, playing a crucial role as the core device in electrical products.
Printed circuit boards play a vital role in various applications, bridging our lives and shaping the future.
This report studies the High End PCBs, include Multi-layer PCB, HDI PCB, IC Substrate, and FPC.
The major global manufacturers of High End PCB include Unimicron, DSBJ (Dongshan Precision), Zhen Ding Technology, Kinwong, Shennan Circuit, Tripod Technology, Suntak Technology, Shenzhen Fastprint Circuit Tech, and Gul Technologies Group, etc. In 2024, the world's top 20 manufacturers accounted for approximately 54.12 % of the revenue.
The high-end PCB industry value chain begins upstream with raw materials such as copper foils, laminates (including high-speed/low-loss materials), and specialty resins, provided by companies like Shengyi, Isola, and Panasonic. Midstream, PCB fabricators process materials into advanced multilayer and HDI structures through photolithography, drilling, plating, and surface treatments. Downstream, high-end PCBs are integrated into electronic systems by OEMs in telecommunications, automotive, aerospace, and semiconductor sectors. Leading players include Ibiden, Unimicron, Compeq, Zhen Ding Tech, TTM Technologies, Shennan Circuits, and AT&S. Currently, the market is experiencing strong growth driven by 5G deployment, cloud computing, electric vehicles, and semiconductor miniaturization trends. Future development will emphasize finer lines (<5 μm), higher frequency materials, substrate-like PCB (SLP) for mobile devices, and closer integration with IC substrates for advanced packaging. The global high-end PCB sector is expected to expand steadily over the next 5-7 years, supported by demand from AI computing, EV electronics, and next-generation communication infrastructure.
This report aims to provide a comprehensive presentation of the global market for High End PCB, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of High End PCB by region & country, by Type, and by Application.
The High End PCB market size, estimations, and forecasts are provided in terms of sales volume (K Sq.m) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High End PCB.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of High End PCB manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of High End PCB in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of High End PCB in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.