PUBLISHER: QYResearch | PRODUCT CODE: 1862211
PUBLISHER: QYResearch | PRODUCT CODE: 1862211
The global market for Embedded Non-Volatile Memory (ENVM) was estimated to be worth US$ 13067 million in 2024 and is forecast to a readjusted size of US$ 34533 million by 2031 with a CAGR of 14.6% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Embedded Non-Volatile Memory (ENVM) cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Embedded non-volatile memory (eNVM) has become an important and essential IP that adds flexibility to electronic products and helps accelerate time-to-market. UMC (Incl. Fujitsu) offers state-of-the-art embedded non-volatile solutions to meet a variety of embedded system applications. High quality embedded non-volatile memories (eFuse, eOTP, eMTP, eE2 PROM and eFlash) can be used for trimming, redundancy, data encryption, ID, coding and programming. There are many types of eNVM available in the market, differentiated by their endurance. For example, eFlash, eE2 PROM and eMTP can be programmed multiple times, whereas eOTP and eFuse can only be programmed once. eE2 PROM has excellent endurance among these five solutions, but the trade-off is larger macro size within high density memory. To leverage density and cost, eFlash and eE2 PROM are recommended for those high density NVM applications such smart card, SIM card, MCU, etc. On the other hand, eMTP and eOTP can be recommended for medium density NVM applications such PMIC and display driver IC. For lower density eNVM requirements in general purpose applications, eFuse is suggested.
The market drivers for embedded non-volatile memory (eNVM) primarily stem from the growing demand for high-performance, low-power, and reliable storage solutions. Rapid advancements in IoT, smartphones, automotive electronics, and industrial automation are increasing requirements for storage capacity, speed, and durability, fueling widespread adoption of eNVM. In edge computing and smart devices, eNVM plays a critical role in enabling fast boot times, data persistence, and power-loss protection. The commercialization of advanced memory technologies such as 3D NAND, MRAM, and FRAM further accelerates market growth. Additionally, the rising dependence on real-time data processing in AI and big data analytics drives demand for high-density, low-latency memory. The trend towards slimmer, smarter consumer electronics with higher integration and energy efficiency also pushes innovation in eNVM technology. Overall, technological innovation, diverse application scenarios, and the increasing intelligence of end devices are key factors propelling the sustained growth of the embedded non-volatile memory market.
Global Embedded Non-Volatile Memory (ENVM) key players include TSMC, GlobalFoundries, UMC (Incl. Fujitsu), SMIC, Samsung, etc. Global top five manufacturers hold a share about 80%. Asia-Pacific is the largest market, with a share about 45%, followed by North America and Europe, both have a share about 50 percent. In terms of product, eFlash is the largest segment, with a share over 44%. And in terms of application, the largest application is Consumer Electronics, followed by Telecommunications, Automotive, etc.
This report aims to provide a comprehensive presentation of the global market for Embedded Non-Volatile Memory (ENVM), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Embedded Non-Volatile Memory (ENVM) by region & country, by Type, and by Application.
The Embedded Non-Volatile Memory (ENVM) market size, estimations, and forecasts are provided in terms of sales volume (M Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Embedded Non-Volatile Memory (ENVM).
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Embedded Non-Volatile Memory (ENVM) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Embedded Non-Volatile Memory (ENVM) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Embedded Non-Volatile Memory (ENVM) in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.