PUBLISHER: QYResearch | PRODUCT CODE: 1862414
PUBLISHER: QYResearch | PRODUCT CODE: 1862414
The global market for CMP Polishing Materials was estimated to be worth US$ 3288 million in 2024 and is forecast to a readjusted size of US$ 5036 million by 2031 with a CAGR of 6.4% during the forecast period 2025-2031.
Chemical Mechanical Polishing (CMP) materials are critical materials used in semiconductor manufacturing to achieve wafer surface planarization. They include CMP slurry, polishing pads, and pad conditioners, which work through a combination of chemical reactions and mechanical abrasion to remove excess material and ensure precise layer stacking for advanced device architectures. Different CMP consumables are tailored to specific applications, such as metal layer polishing (copper, tungsten), dielectric layer planarization (SiO2, low-k), and the fabrication of advanced logic and memory devices. The global CMP consumables market is highly concentrated, dominated by a few multinational players with strong technological barriers and stringent customer qualification processes.
Looking forward, the CMP materials industry is expected to see steady growth, driven by demand from advanced process nodes (5nm and below), new requirements from 3D NAND and advanced packaging, and semiconductor capacity expansion fueled by artificial intelligence, high-performance computing, and electric vehicles. Key R&D trends include environmentally friendly and low-defect slurries, longer-lifetime polishing pads, and intelligent monitoring solutions for consumable usage. As semiconductor manufacturing evolves toward more complex architectures, both the market scale and technical sophistication of CMP consumables will increase, with the competitive landscape moving toward a balance between global leaders and emerging local suppliers.
This report aims to provide a comprehensive presentation of the global market for CMP Polishing Materials, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of CMP Polishing Materials by region & country, by Type, and by Wafer Size.
The CMP Polishing Materials market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding CMP Polishing Materials.
Market Segmentation
By Company
Segment by Type
Segment by Wafer Size
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of CMP Polishing Materials company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Wafer Size, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of CMP Polishing Materials in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of CMP Polishing Materials in country level. It provides sigmate data by Type, and by Wafer Size for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.