PUBLISHER: QYResearch | PRODUCT CODE: 1866757
PUBLISHER: QYResearch | PRODUCT CODE: 1866757
The global market for Solder Paste Inspection (SPI) System was estimated to be worth US$ 323 million in 2024 and is forecast to a readjusted size of US$ 558 million by 2031 with a CAGR of 8.3% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Solder Paste Inspection (SPI) System cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Solder paste inspection (SPI) is a critical process in the electronics manufacturing industry, ensuring the quality and reliability of printed circuit boards (PCBs) before they proceed to the soldering stage. Solder paste inspection is a process used in the assembly of electronic circuit boards. It involves checking the solder paste deposits on PCBs for volume, area, height, and misalignment before the components are placed and reflow soldering is performed. This inspection is typically carried out using automated optical inspection (AOI) systems or 3D inspection technologies. Solder Paste Inspection is a pivotal step in the PCB Assembly Process, especially in industries where precision and reliability are non-negotiable. It not only enhances the quality of the final product but also serves as a cost-saving measure by reducing the need for rework. As electronics continue to evolve and miniaturize, the role of SPI in maintaining manufacturing standards becomes even more significant.
In 2024, global sales of solder paste inspection (SPI) system reached 7,220 units, with an average price of US$44,000 per unit.
The solder paste inspection (SPI) system market is in a stage of rapid development, driven by the increasing demand for high precision and high reliability in the electronics manufacturing industry. With the rise of emerging markets such as smartphones, automotive electronics, and IoT devices, manufacturers are paying more and more attention to the quality of solder paste printing, which has led to the continuous expansion of the application scope of SPI systems. Currently, many companies are adopting advanced inspection technologies such as 3D imaging and automated analysis to improve production efficiency and reduce defect rates. Looking to the future, with the continuous advancement of technology and the improvement of industry standards, SPI systems are expected to be used in a wider range of fields, and the market prospects are broad.
Global key players of Solder Paste Inspection (SPI) System include Koh Young, Test Research, Inc (TRI), Sinic-Tek Vision Technology, CKD Corporation, Nordson Corporation, etc. The top five players hold a share about 61%. Asia-Pacific is the world's largest market for Solder Paste Inspection (SPI) System and holds a share about 54%, followed by Americas and Europe, with share about 25% and 17%, separately. In terms of product type, In-line SPI is the largest segment, accounting for a share about 92%. In terms of application, Consumer Electronics is the largest field with a share about 29 percent.
This report aims to provide a comprehensive presentation of the global market for Solder Paste Inspection (SPI) System, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Solder Paste Inspection (SPI) System by region & country, by Type, and by Application.
The Solder Paste Inspection (SPI) System market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Paste Inspection (SPI) System.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Solder Paste Inspection (SPI) System manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Solder Paste Inspection (SPI) System in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Solder Paste Inspection (SPI) System in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.