PUBLISHER: QYResearch | PRODUCT CODE: 1867936
PUBLISHER: QYResearch | PRODUCT CODE: 1867936
The global market for Liquid Molding Compounds (LMC) was estimated to be worth US$ 7.3 million in 2024 and is forecast to a readjusted size of US$ 13.3 million by 2031 with a CAGR of 9.0% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Liquid Molding Compounds (LMC) cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Liquid Molding Compounds (LMC) are widely used in the semiconductor industry for the encapsulation of electronic components, particularly semiconductor devices such as integrated circuits (ICs), power semiconductors, and other microelectronics. LMCs serve as protective materials, ensuring that the sensitive internal circuitry of semiconductors is shielded from environmental factors such as moisture, chemicals, and physical stress. They also provide electrical insulation, thermal conductivity, and mechanical protection, which are critical for the long-term reliability and performance of semiconductor devices.
The Liquid Molding Compounds (LMC) market has been evolving as a critical component in semiconductor packaging, especially in advanced applications like 5G, automotive electronics, AI, and consumer electronics. LMC is used in encapsulating and protecting semiconductor devices during the packaging process, and its importance has surged with the increasing complexity and miniaturization of electronic components.
Demand Driven by Advanced Semiconductor Packaging:
High-performance packaging: With the rapid advancement in semiconductor technology, especially in areas like 5G and automotive electronics, LMC plays a crucial role in the protection and encapsulation of complex chips. System-in-Package (SiP) and 3D-IC packaging are growing, and LMC is essential for providing efficient, reliable, and high-performance protection in these advanced packaging techniques.
Miniaturization and integration: As semiconductor devices become smaller and more densely packed, LMC formulations are being adapted for thinner layers, higher precision, and more effective heat dissipation.
Technological Advancements in LMC:
Customization for specific applications: The trend is toward more specialized LMC formulations tailored for different semiconductor packages, such as flip-chip, ball grid array (BGA), and chip-on-wafer (COW). This ensures the performance characteristics (such as thermal conductivity, reliability, and moisture resistance) are optimized for the respective device.
Higher thermal conductivity: As power densities in devices increase, LMC with higher thermal conductivity is becoming more critical to efficiently dissipate heat from the chip, preventing thermal damage.
Low-stress formulations: To avoid damaging delicate semiconductor components, the focus has shifted toward developing low-stress LMCs that minimize mechanical stress during the curing process, especially important for advanced and stacked ICs.
This report aims to provide a comprehensive presentation of the global market for Liquid Molding Compounds (LMC), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Liquid Molding Compounds (LMC) by region & country, by Type, and by Application.
The Liquid Molding Compounds (LMC) market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Liquid Molding Compounds (LMC).
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Liquid Molding Compounds (LMC) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Liquid Molding Compounds (LMC) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Liquid Molding Compounds (LMC) in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.