PUBLISHER: QYResearch | PRODUCT CODE: 1872059
PUBLISHER: QYResearch | PRODUCT CODE: 1872059
The global market for CMP Pads was estimated to be worth US$ 1138 million in 2024 and is forecast to a readjusted size of US$ 1810 million by 2031 with a CAGR of 6.8% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on CMP Pads cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Chemical mechanical polishing/planarization (CMP) is a process that removes materials by a combination of chemical and mechanical (or abrasive) actions to achieve highly smooth and planar material surfaces. Chemical-mechanical polishing (CMP) is often associated with chemical-mechanical planarization which is a polishing process assisted by chemical reactions to remove surface materials. CMP is a standard manufacturing process practiced at the semiconductor industry to fabricate integrated circuits and memory disks. When the purpose is to remove surface materials, it is referred to as chemical-mechanical polishing. However, when the purpose is to flatten a surface, it is referred to as chemical-mechanical planarization. CMP is considered to be a tribochemical process because of the synergy between friction and corrosion. CMP Pad (Chemical Mechanical Polishing Pad) is a product which increases semiconductor integration by smoothening the semiconductor wafer surface through physical and chemical polishing processes.
The silicon carbide (SiC) chemical mechanical planarization (CMP) pads market is evolving rapidly, driven by the booming demand for SiC power devices in electric vehicles (EVs), renewable energy, and 5G infrastructure. The global SiC CMP Pads market was valued at US$ 47.97 million in 2024 and is expected to reach US$ 204.18 million by 2031, growing at a CAGR of 17.15% during 2025-2031. The silicon carbide (SiC) chemical mechanical planarization (CMP) pad market is a critical enabler for next-generation power electronics, with distinct competitive dynamics and technological challenges.
At present, considering the cost and the influence of the size of silicon wafers on the performance and efficiency of integrated circuits, the increase in the size of wafers is an inevitable trend and a mainstream trend, in particular, 8-inch and 12-inch. Wafer may develop in the direction of 18 inches in the future. However, the larger the size, the more difficult it is to produce the corresponding CMP pad. When the downstream size becomes an inevitable trend, in order to occupy the market, it is necessary to be able to develop large-size pad, otherwise it will be eliminated by the market. With the expectation of the superior performance improvement of integrated circuits, the polishing performance of CMP pads has to be increased, so its performance in the future must be more stringent.
Several of the current market-oriented enterprises in China have not obtained foreign certifications, so there is no export for the time being. Because downstream companies are mainly concentrated in Japan, Taiwan, South Korea, Europe and the United States and other countries, in addition to Europe and South Korea, these countries have a relatively large market position of CMP polishing pads in several other regions. The electronics industry is mainly concentrated in the Asia-Pacific region, but the current political situation is not optimistic, especially in 2020, it may be the most serious year for China's political crisis in the past 30 years. Due to the current trade frictions and China's current international political factors, it may be the best time for domestic CMP pad manufacturers to occupy the market, and the country's policy investment will increase in the coming years. Therefore, Chinese companies will usher in opportunities for localization in the next few years. We predict that in order to occupy the market, Hubei Dinglong may actively lower the price of the product and madly occupy the market.
New investment requires large capital, and it is difficult for small-scale enterprises to enter the industry. CMP Pads has higher requirements on technology level and processing technology. At present, the market is occupied by American companies. The market is not only influenced by the price, but also influenced by the product performance. The leading companies own the advantages on better performance, more abundant product's types, better technical and impeccable after-sales service. Consequently, they take the majority of the market share of high-end market. Looking to the future years, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
For manufacturers that have already entered, they need to constantly raise the technical threshold to prevent more companies from entering; by reducing costs and reducing prices, they will quickly occupy the market, develop incremental customer markets, and establish market share advantages; create a brand image and lay an advantage for entering the consumer goods market. Only in this way can we have a larger market share of capital in the fierce competition.
Despite this interest, the CMP pad market poses several significant barriers to entry. First, the industry is highly specialized and requires deep technical expertise in materials science, surface chemistry, and wafer process integration. Second, stringent performance requirements - such as planarity, defectivity, and compatibility with specific slurries - mean that pad suppliers must go through extensive qualification processes with semiconductor fabs, which can take years. Additionally, the market is dominated by a few entrenched players with long-term relationships and proprietary technologies, making it difficult for newcomers to gain design-ins. High R&D costs, capital investment in precision manufacturing, and the need for global support infrastructure also pose substantial challenges.
This report aims to provide a comprehensive presentation of the global market for CMP Pads, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of CMP Pads by region & country, by Type, and by Application.
The CMP Pads market size, estimations, and forecasts are provided in terms of sales volume (K Pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding CMP Pads.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of CMP Pads manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of CMP Pads in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of CMP Pads in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.