Body (Zone) Domain Controller and Chip Industry Research Report,2025

Description

Body (Zone) Domain Research: ZCU Installation Exceeds 2 Million Units, Evolving Towards a "Plug-and-Play" Modular Platform

The body (zone) domain covers BCM (Body Control Module), BDC (Body Domain Controller), and ZCU (Zone Controller). From the perspective of the control systems they manage, the functional integration is becoming increasingly high:

BCM controls body auxiliary electrical appliances such as doors, windows, lights, rearview mirrors, and wipers, and can generally directly drive actuators. The number of BCMs in a vehicle ranges from 1 to 2.

BDC drives lower-level modules, such as lighting modules, door modules, seat modules, thermal management modules, etc. Different manufacturers have different body control strategies, so the functional integration is not completely consistent. Some will integrate functions such as air conditioning thermal management, gateways, TPMS, etc., while others exist in the form of separate body domain controllers and gateways. The number of BDCs in a vehicle varies from 1 to 3.

ZCU is a zone controller divided according to physical location. In addition to body control functions, it can also integrate gateway, power distribution, and some chassis domain and powertrain domain functions across domains, replacing the original ECUs with a single MCU with strong computing power. According to the current plans of various OEMs, the number of ZCUs in a vehicle ranges from 2 to 4.

As a key role in the transformation of automotive electronic and electrical architecture (EEA), ZCU is leading the industry to a new stage of development. It integrates the functions of multiple originally scattered electronic control units (ECUs) and centrally manages and controls related systems according to the physical zones or functional domains of the vehicle.

According to ResearchInChina, in 2024, the market size of the body (zone) (including traditional BCM, BDC, and ZCU) domain in Chinese passenger car market will exceed 15.62 billion yuan. Among them, in 2024, the penetration rate of ZCU has reached 8.83%, with an installation of over 2 million units and a market size of 3.93 billion yuan. In the future, ZCU will become the largest market growth driver.

Under the trends of reducing costs and increasing efficiency of the entire vehicle and automotive intelligence, zone controllers have become an inevitable trend. The main development directions of zone controllers include:

Trend 1: MCU Less Technology

Hardware Integration: Replace scattered low-end MCUs with multi-core high-performance MCUs. The cost of a single multi-core MCU is 40% lower than that of multiple low-end MCUs. For example, the MCU Less intelligent drivers of Marelli/Texas Instruments/STMicroelectronics have completely migrated the headlight control software to the domain controller, supporting OTA updates of dynamic lighting scenes.

Power Consumption Reduction: Integrated design reduces redundant circuits, and energy consumption decreases by 20%.

Software Definition: Dynamically schedule atomic services by the central HPC through the SOA architecture, reducing the dependence on local MCUs and supporting OTA seamless upgrades.

Trend 2: Edge AI Computing

Edge Computing: The main control MCU of the zone controller is equipped with an AI acceleration core (such as ARM CMSIS-NN) to achieve localized image recognition and decision-making.

Trend 3: Smart Power Devices such as SmartFET

Functional Integration: Replace traditional MOSFETs, integrate overcurrent/overheat protection and current monitoring, and be used for power management of ZCU (such as LED lighting, motor control).

Scene Adaptation: Support three types of loads: inrush current (bulbs), flyback voltage (motors), and precise current detection (LEDs).

Trend 4: Real-time Performance and Safety Redundancy

Cross-domain scheduling requires microsecond-level response and supports AUTOSAR Adaptive/Classic dual stacks.

Multi-core MCUs need to meet ISO 26262 ASIL-D certification, and hardware redundancy design increases costs (such as lockstep core technology).

Trend 5: Plug & Play, ZCU Modularization

Through "hardware abstraction layer" of zone controller, "one set of software adapts to all vehicle models" is realized, and the zone controller becomes a "plug-and-play" module, shortening the vehicle model development cycle to 12 months.

Infineon and Flextronics (Flex) cooperate to plan to launch a modular zone controller platform, with a series of solutions such as optimized power distribution, gateway, and motor control.

Plug & Play, a general modular assemblable and pluggable zone optimization controller, including a central processing module and pluggable modules. The central processing module includes a central processing unit, a storage unit connected to the central processing unit, and several slots. Among them, each slot with hardware identification function can identify by reading the built-in information and encryption key of the chip of the pluggable module to prevent illegal installation and access.

Trend 6: Introduction of 10BASE-T1S

10M in-vehicle Ethernet can be applied to most vehicle functional systems such as power systems, chassis systems, body systems, audio systems, and ultrasonic radars. After the technology matures, it will replace the existing vehicle CAN bus system and promote the disappearance of some edge MCUs.

OEMs are gradually forming a vehicle E/E architecture design framework of central computing + zone, continuously reducing the number of ECU controllers, reducing the weight of wiring harnesses, increasing the number of SOA atomized packages, and shortening the OTA function development cycle.

Xiaomi Auto:

The second-generation Xiaomi YU7 model promotes "central computing + zone control", with a four-in-one domain controller (central computing platform ICP), integrating VCCD, ADD, DCD, and T-Box modules, and deeply integrating computing power and communication.

Three zone controls (Z-DCU, front, left, right) realize a 75% reduction in the number of controllers, a 40% reduction in wiring harness length, an 18% reduction in weight, a 57% reduction in space occupancy, an increase of 16km in battery life, OTA during driving through memory partitioning, upgrade time <30 minutes, and 100% service interface compatibility.

XPeng Motors:

The XEEA3.5 architecture promotes "central computing + zone control", and the cockpit-driving integrated computing center XCCP realizes the integration of C-DCU and XPU, including intelligent driving, cockpit, instrument, gateway, IMU, power amplifier, etc.

Two zone controllers (left and right) realize a 50% reduction in hardware quantity and a 30% reduction in wiring harness weight. Based on the SOME/IP protocol, more than 300 atomized services (such as door control, air conditioning adjustment) are encapsulated. SOA serviceization shortens the function development cycle to one month.

Innovation Direction of Body (Zone): 10BASE-T1S

10M in-vehicle Ethernet is 10Base-T1S, also known as the IEEE802.3cg standard. The standard was officially released in early 2020. It is the most important underlying standard for software-defined vehicles and Zone architecture. Its mission is to eliminate the old CAN/LIN bus and also eliminate edge MCUs.

After three or four years of development, the ecological environment of 10M in-vehicle Ethernet has finally matured, enabling the realization of true Zone architecture controllers and software-defined vehicles. The hardware ecological environment mainly includes the physical layer, MCUs, and Ethernet switches, and the software mainly includes small RTOS and virtual machines, as well as the maturity of 10M in-vehicle Ethernet testing and evaluation platforms and native cloud development platforms.

In terms of MCUs, mainstream MCU vendors include NXP, Infineon, Renesas, STMicroelectronics, Texas Instruments, and Microchip. NXP and Texas Instruments have the highest degree of support. The S32K5 released by NXP in March 2025 not only has a built-in 10Base-T1S physical layer but also a built-in Ethernet switch. GreenHills has developed an ASIL-D level RTOS, µ-veloSity, and a μ-Visor virtual machine for the S32K5, and Texas Instruments' AN263P4 is also the same.

In terms of the physical layer, there are currently TJA1410 just released by NXP, LAN8670/1/2 of Microchip, AD3300/01/04/05 and ADIN1100 of ADI, NCN26000 and T2500 of ON Semiconductor, DP83TD510E of Texas Instruments, and CT25203 of a small company Canova.

In terms of switches, mainstream switch manufacturers have fully supported 10Base-T1S since 2021, including Marvell, Realtek, and Broadcom.

ON Semiconductor's MCU-less solution: Directly connect the domain controller to the reconfigurable control processor RCP chip, and use 10M Ethernet to replace the traditional CAN bus, realizing a flat architecture of "domain controller - 10Base-T1S Ethernet - RCP chip - LED driver". This design first achieves significant optimization at the hardware level: eliminating components such as MCUs, reset circuits, and crystals of a single node. In the 10M in-vehicle Ethernet with a length of up to 25 meters (unshielded twisted pair), up to 8 to 40 nodes can be connected. With PoDL technology, power supply and communication are completed through two wires, reducing the wiring harness cost by more than 50%, and the system complexity is greatly reduced.

In terms of performance improvement, the 10Base-T1S Ethernet has a speed of 10Mbps, which far exceeds the transmission capabilities of high-speed CAN and CAN FD, laying a foundation for high-frequency data interaction. More importantly, the RCP chip integrates gPTP protocol parsing function, which can achieve clock synchronization with nanosecond-level precision, ensuring the coordinated control of the entire vehicle lighting system under complex working conditions.

BMW's MCU-less interior lighting solution: ADI will cooperate with BMW Group and take the lead in adopting ADI's 10BASE-T1S E2B (Ethernet-Edge Bus) technology in automotive industry. BMW Group will be among the first OEMs to apply ADI's E2B technology, which will be used in BMW's future intelligent cockpit ambient lighting systems.

From ADI's 10M in-vehicle Ethernet application cases, 10Base-T1S is mainly targeted at sensors and actuators. In the sensor field, it mainly includes ultrasonic sensors, radars, and MEMS microphones, including hands-free, E-Call, and voice recognition inputs for front and rear rows. In the power transmission field, it includes position, speed, pressure, temperature, acceleration, and Hall sensors. The actuator part includes lighting, such as front headlights, rear taillights, brake lights, turn signals, interior lighting, and rearview mirror LED displays. It also includes various speakers such as door speakers, subwoofers, low-speed reminder sounds for electric vehicles. It also includes various motors such as window motors, rearview mirror motors, wiper motors, and water pump motors.

In the future, body, seat, and lighting systems will be the first to adopt 10BASE-T1S, with BMW and emerging Chinese automakers taking the lead.

Innovation Direction of Body (Zone): Deep Integration of Chassis/Powertrain Functions

Currently, the mainstream zone controller chassis/powertrain function integration solution is central computing platform + zone controller (mainly body functions) + independent chassis/powertrain domain controller. Chassis and powertrain control are still handled by dedicated domain controllers, and the zone controller only provides local power distribution and data forwarding.

With the increasing degree of integration, chassis and powertrain functions will be split and integrated into the ZCU of physical zone nearby to achieve deep hardware integration. High-level chassis control is completed by the central computing unit or an independent chassis domain controller, and the ZCU is responsible for local execution and signal processing.

In terms of chassis/powertrain control, the core tasks of ZCU include:

Signal Acquisition: Real-time acquisition of sensor data such as wheel speed, steering angle, and suspension displacement.

Instruction Execution: Receive central instructions and drive actuators (such as CDC solenoid valves, air suspension motors).

Power Distribution Management: Dynamically allocate power supply to chassis actuators (such as brake pumps, steering motors) through e-Fuse intelligent fusing.

Tesla ZCU Integrated Chassis/Powertrain Design: Tesla Cybertruck divides the body into multiple physical zones such as the center, front left, front right, and rear. Each zone deploys a Zone Controller, which is responsible for the sensors, actuators, power distribution, and communication management in that zone (such as doors, lights, seats, environmental perception sensors, etc.).

The traditional control logic divided by functional domains (such as powertrain domain, body domain) is partially decoupled. The zone controller undertakes local I/O processing, while high-level decision-making (such as autonomous driving, energy distribution) is still centrally processed by the central computing unit (CCU/HW4.0), forming a hybrid architecture of central decision-making + zone execution.

GAC ZCU Integrated Chassis/Powertrain Design: GAC Hyper GT adopts Continental's cross-domain vehicle control high-performance computing unit Body HPC2.0 (Body HPC), which integrates body control (vehicle entry, door and window control, etc.) + gateway functions (such as access to internal/external lighting, management and diagnostic functions for wireless software updates) + cross-domain vehicle control (such as thermal management, torque management, damping control, adaptive air suspension, chassis tuning, internal combustion engine fuel consumption algorithms based on machine learning and edge computing, etc.).

In addition, the four zone controllers of GAC Hyper GT are responsible for integrating chassis actuators nearby according to physical locations, as well as the power supply of nearby controllers, sensor data acquisition, and control of simple actuators. For example, the rear zone controller integrates functions such as brake-by-wire (EMB), rear-wheel steering (RWS), and active suspension (CDC/air spring) control.

UAES USP 2.0 Platform Goes Deep into the Chassis/Powertrain Field: UAES USP 2.0 is a "central computing + zoning + SOA" solution based on cross-domain integration. Through a zonal architecture, it can integrate nearly 20 independent ECUs, with 951 basic functions, 126 atomic services, and 105 basic services. It can provide 1100+ vehicle APIs, 65 OTA APIs, and 55 AI operators. These APIs and operators can help developers easily implement cross-domain application scenarios of vehicles. Currently, the services that can be called have gone deep into the fields of body control, energy management, motion control, thermal management, etc.

Product Code: ZX003

1 Definition and Deployment of ZCUs

1.1 Definition and Deployment of Zonal Control Architectures
Definition and Classification of Automotive EEAs
Evolution of Automotive EEA
EEA Deployment and Trends in the Next Five Years
EEA Deployment and Trends in the Next Five Years (Appendix)
Development Path of Body Control Functions: BCM->BDC->ZCU
BCM vs BDC vs ZCU in Functions
Comparison among BCMs, BDCs and ZCUs in Hardware Architectures
1.2 ZCU Hardware Frameworks
ZCU Hardware Composition (1)
ZCU Hardware Composition (2)
ZCU Hardware Composition (3)
ZCU Hardware Composition (4)
ZCU Hardware Composition (5)
ZCU Hardware Composition (6)
ZCU Hardware Composition (7)
ZCU Hardware Composition (8)
ZCU Hardware Composition (9)
ZCU Hardware Composition (10)
ZCU Hardware Composition (11)
1.3 Definition and Deployment of BDCs
Main Integrated Functions of BDCs
Solutions of Integrating BDCs with Air Conditioning Systems
Functional Integration of BDCs of Tier 1 Suppliers
Feature 1 of BDC Hardware Platforms: Output Control
Feature 2 of BDC Hardware Platforms: Input Acquisition
BDC Load Driver IC Selection
BDC Hardware Design Based on SemiDrive G9X (1): Power and Reset Design
BDC Hardware Design Based on SemiDrive G9X (2): CAN/CANFD Interface Design, LIN Interface Design
BDC Hardware Design Based on SemiDrive G9X (3): 100Base-T1 Automotive Ethernet Interface Design
BDC Hardware Design Based on SemiDrive G9X (4): BDC PCB Design
BDC Hardware Design Based on SemiDrive G9X (5): Debugging and Verification of BDC

2 Shipments and Market Share of BDCs and ZCUs

2.1 ZCU Shipments and Market Share of Suppliers
ZCU Installations in Passenger Cars in China, 2024
OEM Market Share of Passenger Car ZCU Suppliers in China, 2024
ZCU Installations in Passenger Cars, 2023
ZCU Installations in Passenger Cars in China, 2023-2030E
2.2 ZCU Installations in OEM Models
ZCU Installations in OEM Models (1)
ZCU Installations in OEM Models (2)
ZCU Installations in OEM Models (3)
ZCU Installations in OEM Models (4)
ZCU Installations in OEM Models (5)
2.3 Comparison of OEMs' ZCU Solutions
ZCU Solution of Xpeng "XEEA3.5" Architecture
ZCU Solution of NIO "NT3.0" Architecture
ZCU Solution of Xiaomi EEA1.0 (SU7), EEA1.5 (YU7)
ZCU Solution of Leapmotor "LEAP3.5" Architecture
ZCU Solution of Voyah "Tianyuan" Architecture
ZCU Solution of FAW Hongqi "FEEA3.0" Architecture
ZCU Solution of IM Motors "Z-ONE Full-stack 3.0"
ZCU Solution of Changan Automobile "SDA" Architecture
ZCU Solution of GAC "X-soul" Architecture
ZCU Solution of Huawei Smart Selection "Jie"
2.4 Shipments and Supplier Market Share of Vehicle Body Domain
Content-per-car Value of BDCs
China Passenger Car Body Market Size Assumption Base, 2020-2030E
Market Size of China's Passenger Car Body Domain (Traditional BCM/BDC/ZCU), 2020-2030E
Pre-installed Market Share of BCM (including BDC) Suppliers for Chinese Independent Brand Passenger Cars, 2023-2024

3 ZCU Deployment Solution of OEMs

3.1 Xiaomi Auto
(YU7) E/E Architecture
(SU7): Backbone Network Communication Architecture
(SU7): Cockpit and Intelligent Driving Domain
ZCUs of SU7: Location
(SU7): Zonal Controllers & Central Vehicle Controller
ZCUs of SU7: Functional Block Diagram
(SU7) Zonal Controller Disassembly (1): A-board of ZCU
(SU7) Zonal Controller Disassembly (2): Main Components of A-board
(SU7) Zonal Controller Disassembly (3): B-board of ZCU
(SU7) Zonal Controller Disassembly (4): Main Components of B-board
(SU7) Zonal Controller: Chip Summary
3.2 Xpeng
X-EEA 3.5: Automotive EEA
P7 + X-EEA 3.5 (1): BCAN
P7+ X-EEA 3.5 (2): CCAN
P7+ X-EEA 3.5 (3): ECAN
P7+ X-EEA 3.5 (4): ICAN
P7+ X-EEA 3.5 (5): TPCAN
X-EEA 3.5 Body Electronics Connection Diagram
X-EEA 3.5: Vehicle Communication Architecture (1)
X-EEA 3.5: Vehicle Communication Architecture (2)
ZCUs in X-EEA 3.5: Network Topology
ZCUs of X-EEA 3.5: Functional Integration
ZCUs of X-EEA 3.5: System Development Capability Construction
ZCU Hardware of X-EEA 3.5: ZCU Hardware Development
ZCU Hardware of X-EEA 3.5: ZCU Hardware Production
ZCU Hardware of X-EEA 3.5: ZCU Software Development
ZCU Software in X-EEA 3.5: SOA Layered Model (3)
ZCU Software in X-EEA 3.5: Vehicle Cross-domain Communication Middleware (4)
ZCU Development Trends of X-EEA 3.5: Hardware Development
Development Trends of ZCUs in X-EEA 3.5: Zone Control Software Development
3.3 NIO
EEA Evolution: Roadmap
NT 3.0: Digital Architecture Design (1)
NT 3.0: Digital Architecture Design (2)
NT 3.0: Digital Architecture Design (8)
NT 3.0: Digital Architecture Design (9)
NT 3.0: Backbone Network of Digital Architecture
NT 3.0: The Central + Zonal Architecture of ONVO L60 (1): Communication Architecture
NT 3.0: The Central + Zonal Architecture of ONVO L60 (2): Central Computing Cluster Design
NT 3.0: The Central + Zonal Architecture of ONVO L60 (3): Zone + Power Distribution Design
ZCUs of NT 3.0: AMP Micro-core Architecture
ZCUs in NT3.0: Adopt AMP Micro-core Architecture
3.4 Voyah
Central Integrated Architecture: Tianyuan Intelligent Architecture
Physical Topology of Tianyuan Architecture
Tianyuan Architecture: OIB (BCM+Power+Intelligent Driving+Intelligent Cockpit)
Tianyuan Architecture: ZCU (VIU) (Integrated Zonal Data Center + Intelligent Power Distribution + Intelligent Partition I/O Control)
Tianyuan Architecture: SOA Opens 300+ Interfaces and Supports Scenario Customization
Tianyuan Intelligent Architecture: Tianyuan Intelligent Driving System
3.5 FAW Hongqi
FEEA3.0: Three Platforms - Intelligent Control, Intelligent Sharing and Intelligent Driving
Jiuzhang Intelligent Platform: FAW.OS Core Features
Jiuzhang Intelligent Platform: Five-domain Integrated Chip "Hongqi No. 1"
HIS Car-cloud Integrated Architecture
FEEA3.0: Hongqi EH7 (1)
FEEA3.0: Hongqi EH7 (2)
FEEA3.0: Hongqi EH7 (6)
FEEA3.0: Hongqi EH7 (7)
FEEA3.0: Hongqi EH7 BCM Body Function Breakdown (1) -- Intelligent Vehicle Control Platform
FEEA3.0: Hongqi EH7 BCM Body Function Breakdown (2) -- Front Intelligent Zonal Control Unit (FZCU)
FEEA3.0: Hongqi EH7 BCM Body Function Breakdown (3) -- Middle Intelligent Zonal Control Unit (MZCU)
FEEA3.0: Hongqi EH7 BCM Body Function Breakdown (4) -- Rear Intelligent Zonal Control Unit (RZCU)
FEEA2.0 Architecture: Body Domain Control Module (BDCM)
3.6 Harmony Intelligent Mobility Alliance (HIMA)
Turing Longxing Platform Full-domain Integrated Architecture (1)
Turing Longxing Platform Full-domain Integrated Architecture (2)
Turing Longxing Platform Full-domain Integrated Architecture (3)
Turing Longxing Platform Full-domain Integrated Architecture (4)
Huawei: CC Ring Network Architecture
Huawei: Vehicle Communication Architecture
AITO M9: Vehicle E/E Architecture
Left Zone Controller (VIU1) of AITO M9: Body Functional Block Diagram and Network Architecture
Right Zone Controller (VIU2) of AITO M9: Body Functional Block Diagram and Network Architecture (1)
Right Zone Controller (VIU2) of AITO M9: Body Functional Block Diagram and Network Architecture (2)
Rear Zone Controller (VIU3) of AITO M9: Body Functional Block Diagram and Network Architecture (3)
3.7 Leapmotor
LEAP3.5 Architecture (1)
LEAP3.5 Architecture (2)
LEAP3.5: Central Computing Platform
LEAP3.5: ZCU
3.8 Li Auto
E/E Architecture Evolution: Roadmap
LEEA3.0: ZCU
LEEA3.0: CCU
Communication Architecture of LEEA3.0: PCIE Switch & TSN Switch (1)
Communication Architecture of LEEA3.0: PCIE Switch & TSN Switch (2)
LEEA3.0: Li Auto HaloOS Open Source (1)
LEEA3.0:Li Auto HaloOS Open Source (2)
LEEA2.0: XCU (Integration of Power, Chassis, and Body)
LEEA2.0: Left and Right I/O Body Domain Controller (VIU)
3.9 BYD
EEA Evolution: Roadmap
Xuanji Architecture: Backbone Communication Architecture
Xuanji Architecture: Front/Rear/Left/Right Body ZCU
e3.0 Evo Platform: Function Allocation of Left/Right/Rear BCM
e3.0 Evo Platform: Low-voltage Power Distribution Network of Left/Right/Rear BCM
e3.0 Evo Platform: Four Major Domains (Left/Right Body Domain, Intelligent Domain, Power Domain)
e3.0 Evo Platform: Integrated Left and Right Body Controllers
e3.0 Platform (Seal): BCM Installation Location
e3.0 Platform (Seal): BCM Power Distribution
e3.0 Platform (Seal): BCM Functional Integration
3.10 Chery
EEA5.0 Includes Five Major Architectures
EEA 5.0 Architecture Design Diagram
EEA 5.0 Architecture Features
EEA 5.0 Communication Architecture Design
EEA 5.0 SOA Architecture Design
3.11 Changan
EEA Evolution: Roadmap
Development Trend of BCM: BCM->BDC->VIU
SDA: Backbone Network Topology Design
SDA: Zone Controller Design Features
EPA Platform: Body Domain Controller (BDC) for Deepal SL03 and Avatr 11
3.12 GAC
EEA Evolution: Roadmap
X-Soul Architecture: The Central Computing Unit Is Controlled by the Body Domain
X-Soul Architecture: Central Computing Unit (BDC)
X-Soul Architecture: Central Computing Unit (Body Domain) MCU - NXP S32 Series
X-Soul Architecture: ZCU
X-Soul Architecture: ECU Function of ZCU in Hyptec GT (1)
X-Soul Architecture: ECU Function of ZCU in Hyptec GT (2)
X-Soul Architecture: ECU Function of ZCU in Hyptec GT (3)
3.13 Geely
EEA Evolution: Roadmap
GEEA3.0: Front/Left/Right ZCU
GEEA3.0: Vehicle GOS and SOA
ZEEKR EEA 3.0: Central Supercomputing Platform (Integrated with BCMs)
ZEEKR EEA 3.0: ZCU
ZEEKR EEA 3.0: Intelligent Power Distribution Design of ZCUs (1)
ZEEKR EEA 3.0: Intelligent Power Distribution Design of ZCUs (2)
ZEEKR EEA 2.0: BDCs
3.14 SAIC
EEA Evolution of SAIC IM
Z-One 3.0: 2 Central Computing Units + 4 ZCUs
Z-One Full Stack Solution 3.0: Brain, Cerebellum and ZCUs
Z-One 3.0: ZCU
Z-One 3.0: SOA (1)
Z-One 3.0: SOA (2)
Z-One Full Stack Solution 3.0: Installation Plan
Z-One 1.0: Block Diagram of BCM in IM LS6/LS7
3.15 Tesla
EEA Evolution: Roadmap
Cybertruck: EEA
Cybertruck: Vehicle Communication Architecture
Cybertruck: Body Control Zone Division
Cybertruck: ZCU Function Allocation
Tesla Model 3: EEA
Model 3: Vehicle Communication Architecture
Model 3: Zonal Power Distribution Architecture
Tesla Model 3: Body Control Zone Division
Tesla Model 3 Functions of Front Body Zone Controller
Tesla Model 3 Functions of Left/Right Body Zone Controller
Tesla Model 3 Summary of Technical Features of Body Zone Controller
Dismantling of Body Zone Controller in Tesla Model 3 (1): Installation Location
Dismantling of Body Zone Controller in Tesla Model 3 (2): Front Body Zone Controller
Body (Zone) Domain Controller Breakdown of Model 3 (3): Left ZCU
Body (Zone) Domain Controller Breakdown of Model 3 (4): Right ZCU
Future Direction of Tesla's Body Zone Controllers (1): Third-generation BCM for Model Y
Future Direction of Tesla's Body Zone Controllers (2): Fourth Generation BCM for Model S plaid
3.16 BMW
Evolution of Vehicle Body Electronics Domain Controller (1)
Evolution of Vehicle Body Electronics Domain Controller (2)
Next-generation EEA: BCM Functions and Gateway Are Integrated into ZCU1
Gen 1 BDC Breakdown
Gen 2 BDC Breakdown
Gen 3 BDC Breakdown
BCP Breakdown (1)
BCP Breakdown (5)
BCP Breakdown (6)
Thinking on the Control over Automotive Ambient Lights under Zonal Architecture (1)
Thinking on the Control over Automotive Ambient Lights under Zonal Architecture (2): E2B replaces Controller to Help Software Move up
Thinking on the Control over Automotive Ambient Lights under Zonal Architecture (3): Software Centralization through E2B
Thinking on the Control over Automotive Ambient Lights under Zonal Architecture (4)
3.17 Volkswagen
EEA Evolution: Roadmap
E3 1.1 Architecture: Functional Zones
Architecture of E3 1.1: ICAS1 Is Extended from BCM
Architecture of E3 1.1: Internal Partition of ICAS1 (1): Functions of μ Diagnostic Controllers
Architecture of E3 1.1: Internal Partition of ICAS1 (2): Functions of μ Performance Processors
Architecture of E3 1.1: Block Diagram of ICAS1 Body Control Connection
Architecture of E3 1.1: ICAS1 Body Control Network Architecture
Implementation Logic of ICAS1 Body Control Function (1): Keyless Entry System
Implementation Logic of ICAS1 Body Control Function (2): In-vehicle Accessory Systems
Architecture of E1 1.1: Lighting Control Logic (3)
E3 1.1 Architecture: Lighting Control Logic (2)
E3 1.1 Architecture: Lighting Control Logic (3)
E3 1.1 Architecture: Lighting Control Logic (4)
E3 1.2 Architecture: HCP4 Is Responsible for Body Control Functions
CEA: Joint Development of Zonal Control + Quasi-Central Computing Architecture with Xpeng

4 ZCU Solutions and Supply Chain Analysis

4.1 Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers
Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (1)
Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (2)
Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (10)
4.2 Body (Zone) Domain Control Software and Function Integration Solutions
- 4.2.1 Body (Zone) Domain Integrates Chassis/Power Functions
Trends of ZCUs Integrating Chassis/Power/Body Functions
Cross-domain Function Allocation Principle of ZCUs
Physical Integration of ZCU Hardware
ZCU Software Integration
Chassis/Power/Body Function Integration Solutions of Tier1s' ZCUs (1)
Chassis/Power/Body Function Integration Solutions of Tier1s' ZCUs (2)
Chassis/Power/Body Function Integration Solutions of Tier1s' ZCUs: Continental's High-Performance Computing Unit - Body HPC 2
Chassis/Power/Body Function Integration Solutions of Tier1s' ZCUs: UAES USP Software Development Platform
OEM Solutions of ZCUs Integrating Chassis/Power/Body Functions (1)
OEM Solutions of ZCUs Integrating Chassis/Power/Body Functions (2)
OEM Solutions of ZCUs Integrating Chassis/Power/Body Functions (3)
OEM Solutions of ZCUs Integrating Chassis/Power/Body Functions (4)
Chassis/Power/Body Fusion Solution
Chassis/Power/Body Integration Solutions (1)
Chassis/Power/Body Integration Solutions (2)
Chassis/Power/Body Integration Solutions

4.2.2 Body (Zone) Integrated Gateway

Summary of Products Integrating Body (Zone) Domain Controllers with Gateways (1)
Summary of Products Integrating Body (Zone) Domain Controllers with Gateways (2)
Summary of Products Integrating Body (Zone) Domain Controllers with Gateways (3)
Cases of Integration between Body (Zone) Domain Controllers and Gateways (1): Infineon's Body Control Module with Integrated Gateway
Cases of Integration between Body (Zone) Domain Controllers and Gateways (2): Continental HPC Integrates Central Gateway with Body Domain Controller
Cases of Integration between Body (Zone) Domain Controllers and Gateways (3): OFILM's Fifth-generation BGM
Cases of Integration between Body (Zone) Domain Controllers and Gateways (4): Aptiv's PDC Integrates Zonal Communication Gateways
Cases of Integration between Body (Zone) Domain Controllers and Gateways (5): Jingwei Hirain's Physical ZCUs

4.2.3 Body (Zonal) Domain Integrates PEPS System Function

Digital Key Products
Digital Key: NXP NCF29A1

4.2.4 Body (Zonal) Domain Integrates Digital Key Function

Digital Key Chip Product Summary (1)
Digital Key Chip Product Summary (2)
Digital Key Chip Product Summary (3)
Digital Key Chip Product Summary (4)
Bluetooth Chip Products: TI CC2640

4.2.5 Body (Zonal) Domain Software Architecture SOA Deployment Solution

Zonal Control SOA Spftware Development Progress
OEMs' Zonal SOA Solutions (1): Xpeng (1)
OEMs' Zonal SOA Solutions (1): Xpeng's Left/Right ZCU SOA Evolution (2)
OEMs' Zonal SOA Solutions (1): Xpeng's Left/Right ZCU SOA Evolution (3)
OEMs' Zonal SOA Solutions (2): NIO's Zone Control Software SOA (1)
OEMs' Zonal SOA Solutions (2): NIO's Zone Control Software SOA (2)
OEMs' Zonal SOA Solutions (3): SAIC
OEM's Zonal SOA Solution(3): Z-ONE "Galaxy" SOA Full-stack Software/Hardware Solutions
OEMs' Zonal SOA Solutions (3): Features of Cloud-link-edge Integrated SOA Software Platform of Z-One "Galaxy" Full-stack 3.0

4.2.6 Body (Zonal) Domain Cybersecurity

ZCU Cybersecurity: Cybersecurity Requirements of Zonal Architecture
ZCU Cybersecurity: Cybersecurity Protection Solution under Zonal Architecture
ZCU Cybersecurity: Automotive Ethernet Communication Encryption Protection Technology
ZCU Cybersecurity: HSM Encryption and Decryption Application for ZCU Cybersecurity
ZCU Cybersecurity: Infineon Zonal Architecture Cybersecurity Solution

4.2.7 Body (Zonal) Domain Main Control MCU

MCU Classification
Requirement on MCU from Zonal Controller under Zonal Architecture
Summary of Body (Zone) Domain Controllers (MCUs) (1)
Summary of Body (Zone) Domain Controllers (MCUs) (2)
Summary of Body (Zone) Domain Controllers (MCUs) (3)
Summary of Body (Zone) Domain Controllers (MCUs) (4)
Summary of Body (Zone) Domain Controllers (MCUs) (5)
MCU Products for ZCUs (1): Infineon Aurix TC4x (1)
MCU Products for ZCUs (1): Infineon Aurix TC4x (2)
MCU Products for ZCUs (1): Infineon Aurix TC4x (6)
MCU Products for ZCUs (2): Multi-core MCU SemiDrive E3650
MCU Products for ZCUs (3): NXP S32G
Cases of MCU Application in ZCUs (1): Continental Builds ZCU and HPC based on Infineon Aurix TC4x
Cases of MCU Application in ZCUs (2): G-Pulse Electronics Builds ZCU based on Infineon Aurix TC4x
Cases of MCU Application in ZCUs (3): Body Domain Controller Solution Based on AutoChips MCU
Cases of MCU Application in ZCUs (4): Marelli Builds ZCU Based on Infineon TC4x
Cases of MCU Application in ZCUs (5): ST's BCM Solution Based on SPC5
Cases of MCU Application in ZCUs (6): TI's BCM Solution Based on DRA714 or DRA710
Cases of MCU Application in ZCUs (7): NXP's S32K3-based Body Domain Controller Solution (1)
Cases of MCU Application in ZCUs (7): NXP's S32K3-based Body Domain Controller Solution (2)
Cases of MCU Application in ZCUs (8): ZLG's S32K1-based Body Domain Controller Solution
Key Considerations of OEMs in Selecting MCUs for Zone Control Units (1)
Key Considerations of OEMs in Selecting MCUs for Zone Control Units (2)
Localization of MCUs for Body Control
MCU Less (no Independent Microcontroller) Technology (1)
MCU Less (no Independent Microcontroller) Technology (2)
4.3 Body (Zonal) Domain Communication Solution
- 4.3.1 Body (Zonal) Domain Communication Architecture
Comparison between In-vehicle Communication Bus Technologies
Communication Requirements in Zonal Architecture (1): Backbone Communication
Communication Requirements in Zonal Architecture (2): Local Low-Speed Applications
Communication Requirements in Zonal Architecture (3): High-speed Video Transmission
In-vehicle Communication Network Construction of ZCU under Zonal Architecture (1)
In-vehicle Communication Network Construction of ZCU under Zonal Architecture (2): Communication between ZCU and ECUs in the Zone
In-vehicle Communication Network Construction of ZCU under Zonal Architecture (3): Communication between ZCU and Sensors in the Zone
In-vehicle Communication Network Construction of ZCU under Zonal Architecture (4): Communication between ZCUs
In-vehicle Communication Network Construction of ZCU under Zonal Architecture (5): Automotive Ethernet Switching Chip
Network Communication Topology of ZCUs under Zonal Architecture (1)
Network Communication Topology of ZCUs under Zonal Architecture (2)
Network Communication Topology of ZCUs under Zonal Architecture (3)

4.3.2 Backbone Network-In-Vehicle High-Speed Ethernet (10G/2.5G/1G/100M)

Classification of In-Vehicle Ethernet
Automotive Ethernet Physical Layer Standards
Automotive Ethernet Data Link Layer Protocols
Automotive Ethernet Network Layer Protocols
Automotive Ethernet Application Layer Protocols
Summary of Automotive Ethernet Communication Chips
Automotive Ethernet Communication Chip: Automotive Ethernet Switch - Broadcom BCM8958X
Automotive Ethernet Communication Chip: Automotive Ethernet Switch - Marvell Q622x Series
Automotive Ethernet Communication Chip: Ethernet PHY Chip - Broadcom BCM8989X
Advantages of 2.5G Ethernet Ring Network
Cost Comparision between 2.5G Ethenet Ring Network and Gigabit Ethernet
2.5G Ethernet Ring Network Product Solution (1): G-Pulse's Zonal 2.5G Ring Network Architecture Design
2.5G Ethernet Ring Network Product Solution (2): ZQWL 2.5G/5G/10GBASE-T1 Ethernet Converter (1)
2.5G Ethernet Ring Network Product Solution (2): ZQWL 2.5G/5G/10GBASE-T1 Ethernet Converter (2)
2.5G Ethernet Ring Network Product Solution (3): Motorcomm2.5G Ethernet Chip YT8821 series

4.3.3 Low-speed Network-10BASE-T1S and CAN-XL Applications

Zonal Controller Communication Chip Summary
10BASE-T1S Automotive Ethernet
Application Scenarios of 10BASE-T1S Automotive Ethernet
Three Typical 10M Ethernet Physical Layer Configurations
Characteristic 1 of 10BASE-T1S Automotive Ethernet: Support Multi-point Topology to Simplify Zonal Architecture
Characteristic 2 of 10BASE-T1S Automotive Ethernet: PLCA Physical Layer Anti-collision
Characteristic 3 of 10BASE-T1S Automotive Ethernet:10BASE-T1S Implementation Will Eliminate the Need for Gateways in Conventional Networking Technologies
10BASE-T1S Application Solutions (1): Onsemi 10BASE-T1S Headlight Solution
10BASE-T1S Application Solutions (2): ADI MCU-less 10BASE-T1S Solution
10BASE-T1S Application Solutions (3): BMW's MCU-less Interior Lighting Solution
List of 10M Automotive Ethernet Chip Vendors and Products
10M Automotive Ethernet Chip Products (1): Microchip LAN867x Family
10M Automotive Ethernet Chip Products (2): Onsemi NCV7410 Ethernet Transceiver (1)
10M Automotive Ethernet Chip Products (2): Onsemi NCV7410 Ethernet Transceiver (2)
10M Automotive Ethernet Chip Products (3): Onsemi T30HM1TS2500 Ethernet Transceiver
CAN XL
Typical Application Scenarios of CAN XL: Radar
CAN XL Transceiver: Bosch NT156
Volvo Obtained CAN XL Patent
Parameter Comparison between CAN XL and 10Base-T1S

4.3.4 Low-speed Network-CAN/CAN-FD/LIN and Domestic Chip Applications

CAN/LIN Transceiver Application Scenarios in Vehicles
Automotive CAN/LIN SBC Chips
List and Product Selection of Foreign CAN/CAN FD/LIN Interface Chip Vendors (1)
List and Product Selection of Foreign CAN/CAN FD/LIN Interface Chip Vendors (2)
List and Product Selection of Chinese CAN/CAN FD/LIN Interface Chip Vendors (1)
List and Product Selection of Chinese CAN/CAN FD/LIN Interface Chip Vendors (2)
List and Product Selection of Chinese CAN/CAN FD/LIN Interface Chip Vendors (3)
CAN SBC Products (1): TI TCAN4550-Q1 (1)
CAN SBC Products (1): TI TCAN4550-Q1 (2)
CAN SBC Products (2): NXP FS23 Series
CAN transceiver Application Solution: Application of SIT1043Q Automotive CAN Transceiver in Gateway and BMS

4.3.5 Signal Processing -Serializer/Deserialier (SerDes)

SERDES Chip
Application Requirements of SerDes Chips in Automotive Field
Bandwidth Requirements for Typical Application Scenarios of Automotive SerDes (1): Automotive Camera
Bandwidth Requirements for Typical Application Scenarios of Automotive SerDes (2): High-level ADAS
Bandwidth Requirements for Typical Application Scenarios of Automotive SerDes (3):Automotive Display Screen
Automotive SerDes Sensor Integration Solution (1): Rsemi Serializer Chip 2-in-1 Solution
Automotive SerDes Sensor Integration Solution (2): Rsemi 6-in-1 Deserializer Chip Solution
Automotive SerDes Sensor Integration Solution (3): Rsemi& Sony 'Intelligent Driving 5V Super Vision' Solution
Automotive SerDes Sensor Integration Solution (4): ICatch Technology's Multi-channel surround monitoring system solution based on Valens VA7000
Automotive SerDes Sensor Integration Solution (5): 8MP Camera Connection Solution Based on Valens VA7000
Automotive SerDes Display Integration Solution (1): Inova Automotive Display SerDes Solution Supports 4 Daisy-Chained Displays
Automotive SerDes Display Integration Solution (2): ROHM IAutomotive Multi-Display Solution (1)
Automotive SerDes Display Integration Solution (2): ROHM IAutomotive Multi-Display Solution (2)
Classification of Automotive SerDes Public Protocol
Automotive SerDes Public Protocol: MIPI A-PHY Protocol (1)
Automotive SerDes Public Protocol: MIPI A-PHY Protocol (2)
Automotive SerDes Public Protocol: MIPI A-PHY Product: Silergy MIPI A-PHY Automotive SerDes
Automotive SerDes Public Protocol: ASA 2.0 (1)
Automotive SerDes Public Protocol: ASA 2.0 (2)
Automotive SerDes Public Protocol: HSMT Protocol (1)
Automotive SerDes Public Protocol: HSMT Protocol (2)
Automotive SerDes Public Protocol: HSMT Protocol roduct Summary(1)
Automotive SerDes Public Protocol: HSMT Protocol roduct Summary(2)
Automotive SerDes Public Protocol: HSMT Product: Norelsys HSMT Standard Automotive SerDes(1)
Automotive SerDes Public Protocol:HSMT Product: Norelsys HSMT Standard Automotive SerDes (2)
Automotive SerDes Public Protocol: HSMT Product: Norelsys HSMT Standard Automotive SerDes--NS6238 (3)
Automotive SerDes Public Protocol: HSMT Product: VelinkTech's MIPI A-PHY and HSMT-standard Automoative SerDes
Automotive SerDes Public Protocol: HSMT Product: Novosense Microelectronics HSMT SerDes Solution
Classification of Automotive SerDes Private Protocol (1)
Classification of Automotive SerDes Private Protocol (2)
Automotive SerDes Private Protocol: TI FPD-Link
Automotive SerDes Private Protocol: Technical Features of FPD Link
Automotive SerDes Private Protocol: FPD-Link Mainstream Application Technology and Products: FPD-LINK III
Automotive SerDes Private Protocol: FPD-Link Product List
Automotive SerDes Private Protocol: ADI GMSL
Automotive SerDes Private Protocol: Application of GMSL in Automotive Products
Automotive SerDes Private Protocol: GMSL-SerDes Chip Products (1)
Automotive SerDes Private Protocol: GMSL-SerDes Chip Products (2)
Automotive SerDes Private Protocol: Inova APIX
Automotive SerDes Private Protocol: APIX-SerDes Chip Product List
Automotive SerDes Private Protocol: APIX3-SerDes Chip Products
Automotive SerDes Private Protocol: AIM DHL Protocol
Automotive SerDes Private Protocol: AHDL-SerDes Chip Product List
Summary of Various Types of 10G+ Automotive SerDes Chip Products
4.4 Body (Zone) Domain Power Supply Solution
- 4.4.1 E-fuse Low-voltage Intelligent Power Distribution Solution
ZCU Power Distribution and Intelligent Power Management
ZCU Power Distribution Solutions Based on Semiconductor Devices (1)
ZCU Power Distribution Solutions Based on Semiconductor Devices (2)
ZCU Power Distribution Solutions Based on Semiconductor Devices (3): High-current Power Distribution Solution: Driver Chip + MOSFET Discrete Solution
ZCUs: Technical Advantages of Intelligent Power Distribution Technology
Intelligent Power Distribution of ZCUs: e-Fuse
Design of Combining PNC with e-Fuse in ZCUs (1)
Design of Combining PNC with e-Fuse in ZCUs (2)
Design of Combining PNC with e-Fuse in ZCUs (3)
Design of Combining PNC with e-Fuse in ZCUs (4)
Intelligent Power Distribution Solutions: G-Pulse Electronics "1+1+N" Architecture Power Distribution Solution
Intelligent Power Distribution Solutions: ZCU Integrated Power Distribution of Jingwei Hirain
Intelligent Power Distribution Solutions: UAES ZCU (1)
Intelligent Power Distribution Solutions: UAES ZCU (2)
Intelligent Power Distribution Solutions: UAES ZCU (3)
Intelligent Power Distribution Solutions: Xiaomi Auto "Smart High-Side + eFuse"
Intelligent Power Distribution Solutions: Tesla Intelligent Power Distribution
Intelligent Power Distribution Solutions: Xpeng Front Cabin Fuse Box

4.4.2 Next-generation 48V Low-voltage Power Supply Network

12V Power Supply System in Current Stage: Power Supply Solutions of Main Automotive Controller Hardware (1)
12V Power Supply System in Current Stage: Power Supply Solutions of Main Automotive Controller Hardware (2)
12V Power Supply System in Current Stage: Power Supply Solutions of Main Automotive Controller Hardware (3)
12V Power Supply System in Current Stage: Power Supply Solutions of Main Automotive Controller Hardware (4)
12V Power Supply System in Current Stage: Power Supply Solutions of Main Automotive Controller Hardware (5)
12V Power Supply System in Current Stage: Power Supply Solutions of Main Automotive Controller Hardware (6)
Next Generation 48V Power Supply System: Tesla Designs the Transformer Module in ECU to Adapt to 48V Low-voltage Architecture
Next Generation 48V Power Supply System: Tesla Plans to Redesign All ECUs and Completely Cancel 12V Power Supply
Next Generation 48V Power Supply System: 48V Power Supply System Evolution Path
Next Generation 48V Power Supply System: 48V/12V Architecture Design (1)
Next Generation 48V Power Supply System: 48V/12V Architecture Design (2)
Next Generation 48V Power Supply System: Development Path of 48V Low-voltage Power Distribution
48V ZCU: Key Hub for Migration to 48V Electrical Architecture (1)
48V ZCU: Key Hub for Migration to 48V Electrical Architecture (2)
48V ZCU: ZCUs Simplify the Transition to 48V Electrical System Architectures
48V ZCU: Tesla Uses ZCUs with 48V E-fuse (1)
48V ZCU: Tesla Uses ZCUs with 48V E-fuse (2)
48V ZCU: Tesla Uses ZCUs with 48V E-fuse (3)
48V ZCU: Key Suppliers and Technical Applications (1)
48V ZCU: Key Suppliers and Technical Applications (2)

4.4.3 High/Low Side Driver Chip - HSD Chip

Summary of HSD Chip Products (1)
Summary of HSD Chip Products (2)
Summary of HSD Chip Products (3)
HSD Chips Replace Relays and Fuses in BDCs
Application Cases of Body Domain Controller HSD Chips (1): ST High-side Switch Solutions
Application Cases of Body Domain Controller HSD Chips (2): ST's BCM/BDU Solution
How to Use HSDs to Drive Headlights? (1): As EEA Evolves, Load Type of Car Lights Changes
How to Use HSDs to Drive Headlights? (2): Car Lights that Need to Be Driven
How to Use HSDs to Drive Headlights? (3): Characteristics and Driving Requirements of Car Lights Loads
How to Use HSDs to Drive Headlights? (4): Smart High-side Switches Should Be Short-circuit Tolerant
Onsemi SmartFET: Onsemi NCV84xxx
Onsemi SmartFET: Application in ZCUs
Onsemi SmartFET: Control and Driving Modes in ZCUs
Onsemi SmartFET: Three Applications of High-side SmartFETs
E-FUSE Product: Onsemi NIV3071 E-Fuse (1)
E-FUSE Product: Onsemi NIV3071 E-Fuse (2)
Summary of BCM MOSFETs (1)
Summary of BCM MOSFETs (2)

4.4.4 High/Low Side Driver Chip - LSD Chip

Low Side Driver Chip (1)
Low Side Driver Chip (2)
Low Side Driver Chip Product (1): STMicroelectronics' L9800 Chip (1)
Low Side Driver Chip Product (1): STMicroelectronics' L9800 Chip (2)
Low Side Driver Chip Product (2): KKChips HELS120/HELS120D Chip

4.4.5 Micro Motor Driver Chip

Multi-channel Pre-driver Chip
Multi-channel Pre-driver Chip Product (1): Novosense NSD3608-Q1
Multi-channel Pre-driver Chip Product (2): TI DRV8718-Q1
Bipolar Stepper Motor Driver Chip
Bipolar Stepper Motor Driver Chip Product (1): Novosense NSD8381-Q1
Bipolar Stepper Motor Driver Chip Product (2): TI DRV8889
Half-bridge Driver Chip (1)
Half-bridge Driver Chip (2)
Half-bridge Driver Chip Product (1): Sillumin Semiconductor SiLM94112/SiLM94108 (1)
Half-bridge Driver Chip Product (1): Sillumin Semiconductor SiLM94112/SiLM94108 (2)
Half-bridge Driver Chip Product (2): KKChips HE99MD9008 (1)
Half-bridge Driver Chip Product (2): KKChips HE99MD9008 (2)
H-bridge Driver Chip (1)
H-bridge Driver Chip (2)
H-bridge Driver Chip Product (1): Chipanalog CA-DV8706xF-Q1
H-bridge Driver Chip Product (2): Infineon BTM90xx Full-bridge Chip (1)
H-bridge Driver Chip Product (2): Infineon BTM90xx Full-bridge Chip (2)
4.5 Intelligent Power Distribution Box Market and Solutions
Summary of Intelligent Power Distribution Boxes Integrated with BCM Functions
Solutions of Intelligent Power Distribution Boxes Integrated with BCM Functions (1): Aptiv's Intelligent Power Distribution Box Solution
Solutions of Intelligent Power Distribution Boxes Integrated with BCM Functions (2): Changan Automobile's Intelligent Power Distribution Box Solution
Solutions of Intelligent Power Distribution Boxes Integrated with BCM Functions (3): Intelligent Power Distribution Box Solution of Tesla Model 3
Integration of Intelligent Power Distribution Boxes and Some BCM Functions
Intelligent Power Distribution Box Cost Analysis after Mass Production

5 Research on Chinese ZCU Solution Players

5.1 Huawei
BCMs: Products and Features
VIU: Integrated Gateway
VIU: Left/Right VIU
5.2 Joyson Electronics
ZCUs: Products and Features
nCCU (central computing unit)
nZone
5.3 H&T
BCMs: Products and Features
Right ZCU
5.4 Jingwei Hirain
Product Layout
BCMs: Products and Features
Physical ZCUs (1)
Physical ZCUs (2)
Body Domain Control Unit (BDCU)
Commercial Vehicle Body Domain Controller
5.5 Steelmate
Product Layout
ZCUs: Products and Features
ZCU&VIU
Body Domain Controller (BDC)
iBCM/BCM
5.6 ATECH
ZCUs: Products and Features
VCC: Integration of Three Domains (Body + Cockpit + ADAS)
Left and Right IO Core VIUs
Body Domain Controller (BDC)
5.7 G-Pulse
BCMs: Products and Features
ZCUs
Architectural Design of Four Domains
5.8 FMT
Product Layout
BCMs: Products and Features
Central Control Unit (CCU)
5.9 Desay S
Multi-domain Fusion Solution Architecture Base - EEA 4.0 (Vehicle-Road-Cloud Integrated Architecture)
Desay SV and SemiDrive Jointly Develop ZCUs

6 Research on Feorign ZCU Solution Players

6.1 Renesas
BCMs: Products and Features
Advanced Automotive Domain Controller (AADC)
Automotive MCU Roadmap
R-Car Generation 5 Family Roadmap
MCU (1): RH850/U2A
MCU (2): RH850/U2C
MCU (3): Performance Parameter Comparison among RH850/U2A, RH850/U2B and RH850/U2C
MCU (4): Performance Parameter Comparison among RH850/U2A, RH850/U2B and RH850/U2C
Renesas supports ThunderSoft's Lightweight ZCU Virtualization Platform
6.2 Aptiv
Product Layout
ZCUs: Products and Features
Central Vehicle Controller (CVC)
Power Data Center (PDC)
Configuration Scheme of ZCU PDC
6.3 Marelli
BCMs: Products and Features
ProZone
ZCUs
6.4 Continental Group
ZCUs: Products and Features
ZCUs
High Performance Computing Unit for Cross-domain VEHICLE CONTROL: Body HPC 2
Body High Performance Computing Unit: Body HPC
"Software Functions and Products" for Body Domain and Actuators
6.5 UAES
Product Layout
ZCUs: Products and Features
ZECU (1): Main Function Configuration
ZECU (2): Hardware Support
ZECU (3): Power Supply Design
ZECU (4): Intelligent Power Distribution Application
Vehicle Computing Platform (VCP)
Body Domain Controller: BDU8.1
UAES Software Platform (USP) (1)
UAES Software Platform (USP) (2): USP2.0 Developer Platform (1)
UAES Software Platform (USP) (3): USP2.0 Developer Platform (2)
USP (4): USP 2.5