Intelligent Vehicle Electronic and Electrical Architecture (EEA) and Technology Supply Chain Construction Strategy Research Report, 2025

Description

E/E Architecture Research: 24 OEMs Deploy Innovative Products from Platform Architectures to Technical Selling Points

According to statistics from ResearchInChina, 802,000 passenger cars with domain fusion architectures were sold in 2025H1, accounting for 7.6%, followed by 640,000 passenger cars with quasi-central + zonal architectures with a share of 6.1% and 299,000 passenger cars with central + zonal architectures with a share of 2.8%. The penetration rate of "quasi-central + zonal" architectures and "central + zonal" architectures will reach 25.2% and 17.5% by 2030 respectively.

With the trend of cross-domain integration and the evolution of central + zonal architectures, OEMs are launching new technologies and products in multiple dimensions, including new EEA, intelligent cockpits, autonomous driving, intelligent powertrain and electric drive, intelligent chassis, intelligent thermal management, and intelligent body electronics. This report will focus on new technologies.

Cockpit-driving central computing domain architecture: Multiple "central + zonal" computing architecture forms adapt to vehicle models with different positioning

4-in-1 domain controller of Xiaomi YU7

The Xiaomi YU7, Xiaomi's first luxury high-performance SUV, utilizes an EEA that integrates the four core modules of a traditional distributed architecture - vehicle domain control unit, cockpit domain control unit, autonomous driving domain control unit, and T-Box communication module - into a central computing platform through four-in-one integration technology. This integration is housed on a 3.6kg motherboard, resulting in a 57% reduction in size, 75% fewer parts, and 15-minute OTA updates. Sentry Mode reduces power consumption by 40%, leading to an additional 16km of range for the vehicle. The design uses Qualcomm's 4nm Snapdragon 8 Gen 3 cockpit chip and Nvidia's Thor autonomous driving chip, supporting millisecond-level signal processing and multi-tasking in parallel.

The entire four-in-one domain control module consists of two boards: one is a CDC board based on Qualcomm Snapdragon 8 Gen3, and the other is an ADAS board based on NVIDIA Thor. The two boards use the same water-cooling structure housing. Sensor Configuration: 1L1R11V12U - 1*LiDAR, 1*4D radar, 4*surround view camera, 7*ADAS camera (2*front, 1*rear, 4*side), 12*ultrasonic radar.

Xiaomi YU7's four-in-one controller integrating the vehicle, T-Box, cockpit and autonomous driving adopts a liquid cooling design and consists of three PCBs: the core board of Qualcomm Snapdragon 8 Gen 3 (actually a mobile phone board using SiP for the processor and LPDDR5 DRAM), a cockpit motherboard, and an autonomous driving PCB. The cockpit motherboard and the core board of Qualcomm Snapdragon 8 Gen 3 are parallel to each other on one side of the cockpit motherboard via a BTB connector.

For the video input and output, Xiaomi YU7 was originally designed to use five 8-megapixel cameras and four 4-megapixel cameras. Therefore, three MAX96792 deserialization chips were designed, each of which could correspond to two high-frame-rate 8-megapixel cameras. In actual mass production, in order to reduce costs, two 8-megapixel cameras were used instead, plus nine 3-megapixel cameras and a 3-megapixel/5-megapixel in-vehicle DMS camera. In this way, only one MAX96792 chip was needed, and the other two were not externally connected. One MAX96712 chip corresponds to the in-vehicle DMS camera, and three MAX96724 chips correspond to nine 3-megapixel (actually 4/5-megapixel) cameras. Both of two video outputs involves MAX96781 for serial processing.

NVIDIA's Thor-X autonomous driving chip supports up to 128GB of memory. The Thor-U has about one-third fewer CUDA cores and Tensor cores, with the number of CPU cores reducing from 14 to 12.

Single-SA8775P cockpit-driving integrated computing platform of ARCFOX aT5

In October 2025, the single-SA8775P cockpit-driving integrated computing platform solution was implemented on ARCFOX aT5. The SA8775P cockpit-driving integrated computing platform solution, developed in collaboration with Zhuoyu Technology, integrates the cockpit and the autonomous driving system into a single chip, enabling direct data interaction, reducing transmission latency, and optimizing power consumption.

Hardware and software systems:

The underlying layer runs the automotive-grade QNX real-time operating system, which is responsible for all control links of autonomous driving;

The upper layer runs the Android cockpit system through virtualization technology, providing functions such as voice interaction and audio-visual entertainment. The two systems operate independently. Previously, communication between the cockpit and the pilot relied on a "translator," but now they can speak face-to-face. The link is shorter, the bandwidth is higher, the latency is lower, and the interaction is more responsive.

The integrated domain controller consumes approximately 60W and employs two water-cooling pipelines, thus helping the chip in high computing power and extremely strong heat dissipation.

The cockpit-driving integration solution reduces the overall vehicle cost by about 30%, improves space utilization by simplifying wiring harness layout and hardware integration, and simplifies maintenance.

Functionality:

Autonomous driving: Based on the Qualcomm Snapdragon 8775, an end-to-end foundation model is implemented to realize functions such as city NOA, highway NOA, cross-layer HPA, and APA. Its key subsystems include:

Zhuoyu's "Inertial Navigation Binocular(TM)" System uses two 8-megapixel cameras and an IMU to directly output a "3D map with ultra-high pixel density," accurately reconstructing the surrounding environment with centimeter-level precision.

Zhuoyu's "High-Insight End-to-End Algorithm 2.0" encompasses perception, prediction, planning, and control in a model which is capable of handling advanced scenarios such as traffic light recognition, unprotected left turns, and lane changes in congestion.

Zhuoyu's Enhanced OCC Dynamic Obstacle Completion Module can detect and avoid various types of obstacles without an existing database, providing higher stability when handling urban intersections and complex traffic congestion scenarios.

￮Data training module sends back some driving data of production vehicles after each OTA update to the cloud for model retraining, resulting in 260 million video clips and 1.5 billion frames of raw images.

Cockpit multimodal foundation model can actively perceive all scenarios inside and outside the car, providing intelligent, convenient, emotional, and personalized proactive services. Leveraging the powerful performance of the Snapdragon 8775, it supports highly human-like "intelligent dialogue," creating a smarter "mobility companion" for users.

Intelligent Chassis Domain Architecture: Under the trend of cross-domain integration, AI intelligent chassis has become a key selling point for OEMs.

The essence of AI intelligent chassis is to achieve "all-scenario management" of vehicle dynamics through the collaboration of "sensors, algorithms and actuators". Multimodal sensors (such as cameras, lidar, radar, accelerometers, suspension travel sensors, etc.) can collect real-time data on "vehicle status" (such as pitch angle, roll angle, wheel torque) and "road environment" (such as speed bumps, potholes, and slippery road surfaces). After processing, the data allows the system to predict changes in the vehicle's attitude in advance.

Under different road conditions, such as potholes, gravel roads, slippery roads, or even sudden road debris (stones, traffic cones), the height and damping adjustment of the suspension system can provide support, vibration absorption, and even protection as needed. The pre-emptive system is key to intelligent suspension adjustment. It must not only see far, but also see clearly and in detail.

The pre-scan system uses binocular or even trinocular cameras or lidar to scan the road ahead in real time. Some vendors also establish a cloud-based road condition data layer to comprehensively analyze real-time data and cloud data.

In July 2025, XPeng released the "Taiji AI Chassis". Through a three-in-one control architecture of intelligent perception, cloud-edge collaboration, and self-learning algorithms, it forms a highly collaborative closed loop in the perception-decision-execution link, achieving dynamic response to comfort and providing electric SUVs with an experience far superior to traditional chassis in complex urban environments.

Five core AI algorithms and software capabilities:

Intelligent speed bump recognition: It can identify speed bumps on the road in advance and automatically adjust the vehicle speed and chassis status.

Intelligent bumpy road section recognition: It achieves precise adjustment through lane-level bump perception and recording.

6D anti-motion sickness: Combining multi-dimensional sensor data, it adjusts the vehicle's posture in real time, effectively reducing the incidence of motion sickness.

Intelligent uneven pavement recognition: It accurately senses the unevenness of the pavement and adjusts chassis parameters in a timely manner based on cloud data updates.

Intelligent obstacle recognition: During driving, it promptly identifies obstacles ahead, provides early warnings, and takes corresponding chassis adjustment.

Perception and actuation capabilities:

It supports early detection up to 200 meters away and has lane-level bump perception and recording capabilities.

It supports 1000 scans per second and completes adjustment within 300 milliseconds.

The cloud-based turbulence layer is updated 24 hours a day, and new features can be iterated in as fast as 21 days.

XPeng G7's Taiji AI chassis can generate a 24-hour cloud-based bump map. The data can be used to provide alerts to other XPeng vehicle models, helping drivers make better driving decisions, whether manually or with ADAS.

In October 2025, Leapmotor's newly released flagship model, the D19, was equipped with LMC 2.0, which includes features such as a high-speed dual-wheel tire blowout stability system, Active Pre-emptive Lingbo Weibu Technology, one-button leveling for air suspension, three-motor compass turn, and tire blowout stability control.

The MK C2, which is the second-generation integrated (one-box) brake system from AUMOVIO (formerly Continental), is used.

Bosch offers the R-EPS parallel-axis system.

The dual-chamber closed air suspension solution supplied by KH Automotive Technologies adopts semi-active suspension with CDC.

The chassis domain controller adopts the self-developed LMC 2.0. By integrating braking, steering, drive, and suspension control, millisecond-level response can be achieved, enabling features such as dual-wheel tire blowout stability, Active Pre-emptive Lingbo Weibu Technology, one-button leveling, compass turn, zero-motion turn, anti-motion sickness mode, anti-slip on wet roads, high-speed cornering pre-stabilization, dynamic steering assist, and active anti-aiming. Therefor, the vehicle's chassis handling pleasure and ride comfort can be comprehensively enhanced.

Intelligent powertrain domain: development towards integrated intelligent control of drive, braking, steering, and suspension subsystems.

With the rapid development of autonomous driving, the requirements for powertrain domain latency in vehicles are becoming increasingly stringent. The powertrain domain will move from the current electrification of the drive system to the comprehensive electrification of the drive, steering, suspension, braking and other systems.

In the future, the power chassis domain will have a "cerebro" through the integrated intelligent control of various subsystems for drive, braking, steering, and suspension, enabling safer, more comfortable, and more agile handling of the vehicle in all scenarios.

As E/E architectures evolve towards centralization, systems such as braking, steering, and suspension are gradually decoupled into electronic control units (such as brake-by-wire and steer-by-wire), and multi-dimensional collaborative control is achieved through the central ECU.

Changan Automobile deeply integrates and coordinates drive, brake, steering, and suspension, providing unlimited possibilities for intelligent scenarios. It can make cars realize scene functions such as in-situ U-turns, automatic drifting, and racing games, and provide fast, accurate, and redundant actuation for autonomous driving scenarios.

Mercedes-Benz's "In-Drive" brake system for electric vehicles integrates the brakes into the electric motor drive units on both the left and right sides, eliminating traditional wheel-mounted brakes, further realizing the integration of drive and braking at the physical and system levels.

Product Code: YS048

1 Definition and Development Trends of EEAs

1.1 Current Deployment Status and Trends of E/E Architecture
Automotive EEA - Evolution
Five Evaluation Dimensions of Automotive E/E Architecture
Three Development Stages in E/E Evolution: Multi Box, One Box, One Chip (1)
Three Development Stages in E/E Evolution: Multi Box, One Box, One Chip (2)
CCU - Development Direction of Central + Zonal Architecture (1)
CCU - Development Direction of Central + Zonal Architecture (2)
CCU - Development Direction of Central + Zonal Architecture (3)
CCU - Development Direction of Central + Zonal Architecture (4)
Mainstream Vehicle Central/Quasi-Central + Zonal E/E Architecture Solutions in the Industry
In Central + Zonal Architecture, Communication Bandwidth Will Increase Significantly by Orders of Magnitude
Deployment Forms of Central/Quasi-Central + Zone Architecture (1):Cost-Effective and Highly Flexible
Deployment Forms of Central/Quasi-Central + Zone Architecture (2):High Performance, Multi-Computing Platform
Deployment Forms of Central/Quasi-Central + Zone Architecture (3):High Performance, Central Computing Platform
Deployment Forms of Central/Quasi-Central + Zone Architecture (4): One Chip, Introducing Chiplet
1.2 Penetration Rate of Different Types of E/E Architecture Deployment
Classification Method (1): China's Domestic Passenger Car E/E Architecture Penetration Rate, 2025-2030E
Classification Method (1): China's Domestic Passenger Car E/E Architecture Penetration Rate, 2025-2030E
Classification Method (2): by Functional Scenarios
Classification Method (2): Penetration Rate by Functional Scenarios, 2024-2030E

2 Impact of EEA Upgrade and Evolution on the Supply Chain

Trend 1: One-Chip Cockpit-Driving Integrated Solution Emerges
One Box Solution
Typical One Box Solutions
One Chip Solution
Typical One Chip Solutions
ARCFOX T5 Globally Launches One-Chip Solution: Qualcomm SA8775P Cockpit-Driving Integrated Solution (1)
ARCFOX T5 Globally Launches One-Chip Solution: Qualcomm SA8775P Cockpit-Driving Integrated Solution (2)
ARCFOX T5 Globally Launches One-Chip Solution: Adopting the Qualcomm SA8775P Cockpit-driving Integrated Controller from Zhuoyu Technology
Challenge of One-Chip Cockpit-Driving Integration Solution 1: Resource Contention and Determinism in Heterogeneous Computing (1)
Challenge of One-Chip Cockpit-Driving Integration Solution 1: Resource Contention and Determinism in Heterogeneous Computing (2)
Challenge of One-Chip Cockpit-Driving Integration Solution 2: Cross-Domain Functional and Information Security Co-Governance (1)
Challenge of One-Chip Cockpit-Driving Integration Solution 2: Cross-Domain Functional and Information Security Co-Governance (2)
Challenge of One-Chip Cockpit-Driving Integration Solution 3: Real-Time Guarantee in Virtualization Scenarios
Challenge of One-Chip Cockpit-Driving Integration Solution 4: High-Speed Interconnection and Deterministic Communication Under Multi-Protocol/Multi-Rate (1)
Challenge of One-Chip Cockpit-Driving Integration Solution 4: High-Speed Interconnection and Deterministic Communication Under Multi-Protocol/Multi-Rate (2)
Trend 2: Popularization of PCIe Inter-Chip Communication Under the Trend of One-Box/One-Board
Central + Zonal Architecture: Inter-Chip Interconnection
Central + Zonal Architecture: Inter-Chip Interconnection -Communication between SoC and Storage
Central + Zonal Architecture: Inter-Chip Interconnection - NVIDIA NVLink C2C
Trend 3: 2.5G Ethernet to be Mass-Produced and Deployed, Adapting to L3 Intelligent Driving
2.5G Ethernet Ring Network will be Mass-produced and Landed in 2026~2027, Adapting to L3 Intelligent Driving Vehicles
Cost Comparison between 2.5G Ethernet and Gigabit Network
Sensor Upgrade for L3 Intelligent Driving Vehicles, Bringing Data Flood Demand
LiDAR: Industry's First 500+ Channel LiDAR Entered Mass Production and Was Installed in Vehicles (1)
LiDAR: Industry's First 500+ Channel LiDAR Entered Mass Production and Was Installed in Vehicles (2)
Trend 4: Vehicle Optical Communication Begins Vehicle Verification and May Become the Next Generation Backbone Network
Automotive Ethernet Fiber Optic Communication: Develop from Copper Cable to Fiber Optic Communication
Comparison of Technical Standards Between Optical Communication and Copper Cable Electrical Communication
Development Process of Automotive Ethernet Fiber Optic Communication Products
Maturity of Automotive Optical Communication Industry Chain (1)
Maturity of Automotive Optical Communication Industry Chain (2)
Development Process of Automotive Ethernet Fiber Communication Products: Suppliers and Products (1)
Development Process of Automotive Ethernet Fiber Communication Products: Suppliers and Products (2)
Development Process of Automotive Ethernet Fiber Optic Communication Products: ZF and KD Collaborate on Integrated Optical Transceiver (1)
Development Process of Automotive Ethernet Fiber Optic Communication Products: ZF and KD Collaborate on Integrated Optical Transceiver (2)
Development Process of Automotive Ethernet Fiber Optic Communication Products: Summary of OEM Layouts
Trend 5: Integration of Control and Communication Functions in Zone
In Central + Zonal Architecture, Control and Communication Functions Are Zone-Integrated
Trend 6: Competition Between High-Speed Video Transmission (10G+SerDes) and Ethernet Transmission
10G+ Ethernet Backbone & Ethernet Camera
Ethernet Camera VS Deserialization (1)
Ethernet Camera VS Deserialization (2)
BMW Plans to Deploy ASA-MLE in Production Models
Central + Zonal Architecture: High-Speed Video Transmission (10G+ SerDes) (1)
Various 10G+ Automotive SerDes Chips
SerDes Is Evolving towards Public Protocols and Proposes Compatibility with Automotive Ethernet: GMSL Led the Establishment of the OpenGMSL Association
SerDes Is Evolving towards Public Protocols and Proposes Compatibility with Automotive Ethernet: GMSL/LVDS Is Evolving towards Automotive Ethernet (1)
SerDes Is Evolving towards Public Protocols and Proposes Compatibility with Automotive Ethernet: GMSL/LVDS Is Evolving towards Automotive Ethernet (2)
Trend 7: Evolution of Central Gateway to Zonal Gateway
Central + Zonal Architecture: Zonal Gateway/Central Gateway
Central + Zonal Architecture: Central Gateway
Central + Zonal Architecture: Zonal Gateway
Trend 8: Rise of 10Base-T1S Will Adjust Traditional LIN and CAN Networks
The "Sore Points" of Automotive Networks and the Logic behind the Creation of 10Base-T1S
BMW Will Be the First to Introduce 10M Ethernet
10M Ethernet - Reducing Edge Node MCUs
10M Ethernet - Initially Used in Ambient Lighting Systems
10M Ethernet - Application Deployment Plan
Trend 9: Rise of Edge Wireless Communication, Rapid Development of UWB and NearLink
Central + Zonal Architecture: Edge-Side Wireless Communication
NearLink "Generational Evolution" Route
Predicted Commercialization Pace of NearLink for In-Vehicle Applications
NearLink's Competitors: Performance Comparison between Bluetooth, Wi-Fi, and NearLink
NearLink Digital Key Solution: Faraday Technology's NearLink Digital Key Equipped on AITO M9
UWB In-vehicle Application Scenarios
UWB Per-vehicle Usage
UWB Function Expansion: UWB Integrated Function Development by Some Suppliers
UWB Digital Key Layout of OEMs
Trend 10: Development of External Communication Network Towards "Integration of Vehicle, Road, Cloud and Network"
Central + Zonal Architecture: Vehicle-Cloud Interconnection

3 EEA Upgrade and Evolution Trends of Chinese OEMs

3.1 Xiaomi Auto
Evolution Trend of E/E Architecture: EEA1.0 - EEA2.0 - EEA3.0
Advanced EEA Evolution and Supply Chain Construction (1): Xiaomi Auto
Advanced EEA Evolution and Supply Chain Construction (2): Xiaomi Auto
Advanced EEA Evolution and Supply Chain Construction (3): Xiaomi Auto
Advanced EEA Evolution and Supply Chain Construction (4): Xiaomi Auto
Advanced EEA Evolution and Supply Chain Construction (5): Xiaomi Auto
Advanced EEA Evolution and Supply Chain Construction (6): Xiaomi Auto
Next-Generation EEA3.0: Pre-research Technology of Next-Generation Intelligent Chassis (1)
Next-Generation EEA3.0: Pre-research Technology of Next-Generation Intelligent Chassis (2)
Next-Generation EEA3.0: Pre-research Technology of Next-Generation Intelligent Chassis: 48V Chassis System (3)
EEA 2.0: YU7 Four-in-One Central Computing Platform
EEA 2.0: YU7 Four-in-One Central Computing Platform (1)
EEA 2.0: YU7 Four-in-One Domain Control Module (2) - PCB Board
EEA 2.0: YU7 Four-in-One Domain Control Module (3) - BOM Cost of Intelligent Driving Domain Controller
EEA 2.0: YU7 Four-in-One Domain Control Module (4) - Intelligent Driving Domain Controller Chip
EEA 2.0: YU7 Four-in-One Domain Control Module (5) - Sensors
EEA 2.0: YU7 Four-in-One Domain Control Module (6) - Ethernet Switch
EEA 2.0: YU7 Four-in-One Domain Control Module (7) - Cockpit Domain Controller Configuration
EEA 2.0: YU7 Four-in-One Domain Control Module (8) - Cockpit Domain Controller Chip
EEA 2.0: YU7 Four-in-One Domain Control Module (9) - BOM Cost
EEA 2.0: YU7 Intelligent Cockpit - Xiaomi HyperVision
EEA 2.0: YU7 Intelligent Cockpit - Super Xiao AI with Upgraded On-Device Large Model
EEA 2.0: YU7 Intelligent Cockpit - In-Depth Integration with Apple Ecosystem
EEA 2.0: YU7 Intelligent Cockpit - Linkage with Wearable Devices
EEA 2.0: YU7 Intelligent Driving - Hardware Configuration
EEA 2.0: YU7 Intelligent Chassis
EEA 1.0: SU7 - 3 Major Domains + 3 Zone Controllers
EEA 1.0: SU7 Vehicle Central Domain VCCD (1)
EEA 1.0: SU7 Vehicle Central Domain VCCD (2)
EEA1.0: Intelligent Driving Domain of SU7 (1)
EEA1.0: Intelligent Driving Domain of SU7 (2)
EEA1.0: Intelligent Cockpit Domain of SU7 (1)
EEA1.0: Intelligent Cockpit Domain of SU7 (2)
EEA1.0: Zone and Body Control in SU7 (1)
EEA1.0: Zone and Body Control in SU7 (2)
EEA1.0: Communication Domain of SU7
3.2 Leapmotor
E/E Architecture Evolution Trend: LEAP 1.0 - LEAP 4.0
Advanced EEA Evolution and Supply Chain Construction (1): Leapmotor
Advanced EEA Evolution and Supply Chain Construction (2): Leapmotor
Advanced EEA Evolution and Supply Chain Construction (3): Leapmotor
Advanced EEA Evolution and Supply Chain Construction (4): Leapmotor
Advanced EEA Evolution and Supply Chain Construction (5): Leapmotor
LEAP 4.0 (D Platform): Key Innovative Technologies
LEAP 4.0 (D Platform): Self-Developed System
LEAP 4.0 (D Platform): Core Suppliers
LEAP4.0 (D Platform)--Central Domain Controller: Equipped with Dual Qualcomm Snapdragon 8797 (1)
LEAP4.0 (D Platform)--Central Domain Controller: Equipped with Dual Qualcomm Snapdragon 8797 (2)
LEAP4.0 (D Platform)--Central Domain Controller: Equipped with Dual Qualcomm Snapdragon 8797 (3)
LEAP 4.0 (D Platform)--Chassis Domain: LMC2.0 Chassis Motion Fusion Control System Functions (1)
LEAP 4.0 (D Platform)--Chassis Domain: LMC2.0 Chassis Motion Fusion Control System Functions (2)
LEAP 4.0 (D Platform)--Chassis Domain: Brake System
LEAP 4.0 (D Platform)--Chassis Domain: Steering System
LEAP 4.0 (D Platform): Chassis Domain: Suspension System
LEAP 4.0 (D Platform)--Chassis Domain: Self-Developed Chassis Domain Control
LEAP 4.0 (D Platform)--Powertrain Domain: Multi-Motor 4WD and Dual-Vector E-Drive Technology
LEAP 4.0 (D Platform)--Powertrain Domain: ZF eRE+ Extended-Range System, Integrated Generator-Drive Unit
LEAP 4.0 (D Platform)--Cockpit Domain: Body Electronics
4.0 (D Platform)--Autonomous Driving Domain: More Than 40 VLA ADAS Functions
LEAP 3.5 & LEAP 3.0 Comparison
LEAP 3.5 Technical Architecture Analysis: Technical Architecture
LEAP 3.5 Technical Architecture Analysis: Technical Architecture
LEAP 3.5 Technical Architecture Analysis: High-Level Cockpit-Driving Integrated Central Domain Control Platform, Qualcomm 8295 + 8650
LEAP3.5 Technical Architecture Analysis: Intelligent Cockpit
LEAP 3.5 Technical Architecture Analysis: End-to-End High-Level AD
LEAP 3.5 Technical Architecture Analysis: Battery System, CTC 2.0 Plus Battery-Chassis Integration
LEAP 3.5 Technical Architecture Analysis: Battery System, 9-in-1 Super Integrated Battery Control Module
LEAP 3.5 Technical Architecture Analysis: 7-in-1 Oil-Cooled E-Drive Solution
LEAP 3.5 Technical Architecture Analysis: 7-in-1 Oil-Cooled E-Drive Solution
LEAP 3.5 Technical Architecture Analysis: Super Integrated Thermal Management Architecture
LEAP 3.5 Technical Architecture Analysis: LMC Integrated Motion Fusion Control Chassis System
3.3 ZEEKR
Advanced EEA Evolution and Supply Chain Construction: ZEEKR (1)
Advanced EEA Evolution and Supply Chain Construction: ZEEKR (2)
Advanced EEA Evolution and Supply Chain Construction: ZEEKR (3)
Advanced EEA Evolution and Supply Chain Construction: ZEEKR (4)
EE 3.0: Central Computing Architecture: Architecture Design
EE 3.0: Central Supercomputing Platform Design
EE 3.0: Cross-domain Communication Design
EE 3.0: Software Function Deployment
EE 3.0: Zone Control Unit (ZCU)
EE 3.0: Zone Controller, Intelligent Power Distribution Design (1)
EE 3.0: Zone Controller, Intelligent Power Distribution Design (2)
EE 3.0: Power Domain (Hybrid Architecture): ZEEKR 9X's SEA-S E-hybrid-Dedicated Architecture Based on BEV Architecture
EE 3.0: Power Domain (Hybrid Architecture): Haohan Super Hybrid, the World's First Three-Motor Mega-Watt Hybrid Electric Drive System
EE 3.0: Power Domain (Hybrid Architecture): 6C Hybrid Battery + High-Power Range Extender Generator
EE 3.0: Power Domain (BEV Architecture): 900V + 6C Ultra-Fast Charging Battery
EE 3.0: Chassis Domain--Haohan AI Digital Chassis (1)
EE 3.0: Chassis Domain--Haohan AI Digital Chassis (2)
EE 3.0: Chassis Domain--Haohan AI Digital Chassis (3)
EE 3.0: Power + Chassis Cross-Domain: Technical Practice of Drive-Brake Longitudinal Control Integration (1)
EE 3.0: Power + Chassis Cross-Domain: Technical Practice of Drive-Brake Longitudinal Control Integration (2)
EE 3.0: Power + Chassis Cross-Domain: Development Direction of Multi-Motor Drive-Brake Integration Technology
EE 3.0: Intelligent Driving Domain: Haohan Intelligent Driving 2.0
EE 3.0: Intelligent Driving Domain: Scenario Cognition Foundation Model + Interactive Planning and Control Foundation Model
EE 3.0: Intelligent Driving Domain: One-Model End-to-End Plus Architecture
EE 3.0: Intelligent Driving Domain: G-pilot Intelligent Driving System (1)
EE 3.0: Intelligent Driving Domain: G-pilot Intelligent Driving System (2)
EE 3.0: Intelligent Driving Domain: G-pilot H9 (1)
EE 3.0: Intelligent Driving Domain: G-pilot H9 (2)
EE 3.0: Intelligent Driving Domain: G-pilot H7 (1)
EE 3.0: Intelligent Driving Domain: G-pilot H7 (2)
EE 3.0: Driving Domain: PCMU (Driving Domain Controller) (1)
EE 3.0: Driving Domain: PCMU (Driving Domain Controller) (2)
EE 3.0: Driving Domain: PCMU (Driving Domain Controller) (3)
EE 3.0: Driving Domain: PCMU (Driving Domain Controller) (4)
3.4 NIO & ONVO
Advanced EEA Evolution and Supply Chain Construction (1): NIO & ONVO
Advanced EEA Evolution and Supply Chain Construction (2): NIO & ONVO
Advanced EEA Evolution and Supply Chain Construction (3): NIO & ONVO
Advanced EEA Evolution and Supply Chain Construction (4): NIO & ONVO
Advanced EEA Evolution and Supply Chain Construction (5): NIO & ONVO
Advanced EEA Evolution and Supply Chain Construction (6): NIO & ONVO
Advanced EEA Evolution and Supply Chain Construction (7): NIO & ONVO
NIO NT3.0--Digital Architecture Design: Overall Framework (1)
NIO NT3.0--Digital Architecture Design: Overall Framework (2)
NIO NT3.0-- Digital Architecture Design: Brain (Central Computer) + Cerebellum (ZCU)
NIO NT3.0--Digital Architecture Design: Next-Generation ADAM (NT3.0)
NIO NT3.0-- Digital Architecture Design: ZCU with Asymmetric Multiprocessing (AMP) (1)
NIO NT3.0--Digital Architecture Design: ZCU with Asymmetric Multiprocessing (AMP) (2)
NIO NT3.0-- Digital Architecture Design: Communication Neural Network
NIO NT3.0--Digital Architecture Design: Dual Redundant Low-Voltage Power Supply
NIO NT3.0--Digital Architecture Design: Power Distribution Redundancy Improves Reliability by 10 Times Compared to ASIL B, Approaching ASIL D
NIO NT3.0--Digital Architecture Design: Perception and Algorithm
NIO NT3.0--Digital Architecture Design: SkyOS
NT3.0--Digital Architecture Design: 48V Low-Voltage Power Supply Network Architecture
NIO NT3.0--Chassis Domain: Shenxing Intelligent Chassis
NIO NT3.0--Chassis Domain: NIO SkyRide Chassis System
NIO NT3.0--Chassis Domain: Sky Ride Chassis System
NIO NT3.0--Chassis Domain: Sky Ride Active Suspension
NIO NT3.0--Chassis Domain: SkyRide Chassis System
NIO NT3.0-- Intelligent Driving Domain: Equipped with Self-developed SoC "Shenge NX9031"
NIO NT3.0-- Autonomous Driving Domain: Self-developed SoC "Shenji NX9031"
NIO NT3.0--Thermal Management Domain: Integrated Thermal Management Module (ITM)
NIO NT3.0--Thermal Management Domain: Integrated Thermal Management Module (ITM)
NIO NT3.0 (High Cost Performance Version): Central + Zonal Architecture of ONVO Series
NIO NT3.0 (High Cost Performance Version): Central Computing Cluster with Four-Domain Integration of ONVO Series
NIO NT3.0 (High Cost Performance Version): Central + Zonal + Power Distribution Design of ONVO Series
NIO NT3.0 (High Cost Performance Version): 100% Smart Fuses of ONVO Series
NIO NT3.0 (High Cost Performance Version): 49-in-1 Full-Stack Self-Developed Thermal Management Integrated Module of ONVO Series
NIO NT3.0 (High Cost Performance Version): Central Cloud Hybrid Edge Cloud Technology of ONVO Series
NIO NT2.0: ADAM (Central Computing Platform)
NIO NT2.0: Central Computing Platform (ADAM)
NIO NT2.0: Intelligent Chassis Controller (ICC) (1)
NIO NT2.0: Intelligent Chassis Controller (ICC) (2)
NIO NT 2.0: Topology of 2024 ES8 (1)
NIO NT 2.0: Topology of 2024 ES8 (2)
NIO EE 3.0: Driving Domain: Power-Chassis Domain Integration Solution Chooses High Level Solution for EIC Function Integration
3.5 XPeng Motors
Advanced EEA Evolution and Supply Chain Construction (1): XPeng Motors
Advanced EEA Evolution and Supply Chain Construction (2): XPeng Motors
Advanced EEA Evolution and Supply Chain Construction (3): XPeng Motors
Advanced EEA Evolution and Supply Chain Construction (4): XPeng Motors
Advanced EEA Evolution and Supply Chain Construction (5): XPeng Motors
Advanced EEA Evolution and Supply Chain Construction (6): XPeng Motors
Advanced EEA Evolution and Supply Chain Construction (7): XPeng Motors
Next-Gen E/E Architecture Plan: AI Supercomputing Architecture (1)
Next-Gen E/E Architecture Plan: AI Supercomputing Architecture (2)
XEEA4.0: Turing AI Chip (1)
XEEA4.0: Turing AI Chip (2)
XEEA4.0: Turing AI Chip (3)
XEEA4.0: Turing AI Chip (4)
XEEA4.0: World Foundation Model
XEEA4.0: Vehicle-End-to-End Deterministic OS
XEEA4.0: Vehicle Cross-Domain Communication Middleware
XEEA4.0: Canghai Base Platform
XEEA4.0: Tai Chi AI Chassis
XEEA4.0: AI Tianji System
XEEA4.0: 800V High-Voltage E-Drive System Technology Development (XPeng Kunpeng Super Electric System)
XEEA4.0: Xbrain Ultimate Architecture
XEEA3.0: Topology - 3 Computing Groups + Left and Right ZCUs
XEEA3.0: P7+ Vehicle Network Architecture (1)
XEEA3.0: P7+ Vehicle Network Architecture (2)
XEEA3.0: P7+ Vehicle Network Architecture (3)
XEEA3.0: P7+ Vehicle Network Architecture (4)
XEEA3.0: P7+ Vehicle Network Architecture (5)
XEEA3.0: P7+ Vehicle Network Architecture (6)
XEEA3.0: P7+ Vehicle Network Architecture (7)
XEEA3.0: P7+ Vehicle Network Architecture (8)
3.6 Harmony Intelligent Mobility Alliance (HIMA)
EEA Evolution: from Star Network to Ethernet Ring Network
C-C Ring Network Architecture: Advantages (1)
C-C Ring Network Architecture: Advantages (2)
C-C Ring Network Architecture: Advantages (3)
C-C Ring Network Architecture: Cooperation Model
Advanced EEA Evolution and Supply Chain Construction (1): HIMA
Advanced EEA Evolution and Supply Chain Construction (2): HIMA
Advanced EEA Evolution and Supply Chain Construction (3): HIMA
Advanced EEA Evolution and Supply Chain Construction (4): HIMA
Advanced EEA Evolution and Supply Chain Construction (5): HIMA
Advanced EEA Evolution and Supply Chain Construction (6): HIMA
Advanced EEA Evolution and Supply Chain Construction (7): HIMA
C-C Ring Network Architecture: From Passive Intelligence to Active Intelligence
C-C Ring Network Architecture: Huawei Intelligent Digital Base iDVP2.0
C-C Ring Network Architecture--Smart Digital Base: iDVP 2.0
C-C Ring Network Architecture-- Chassis Domain: Touring Dragon Platform (1)
C-C Ring Network Architecture-- Chassis Domain: Touring Dragon Platform (2)
C-C Ring Network Architecture-- Chassis Domain: Touring Dragon Platform (3)
C-C Ring Network Architecture-- Chassis Domain: Digital Chassis Engine (XMC)
C-C Ring Network Architecture--Vehicle Control Domain: Self-Developed Vehicle Control Module
C-C Ring Network Architecture-- Powertrain Domain: HUAWEI DriveONE Shifts from Power Domain to Motion Domain
C-C Ring Network Architecture-- Powertrain Domain: Huawei DriveONE Motion Domain Fusion Solution(1)
C-C Ring Network Architecture-- Powertrain Domain: Huawei DriveONE Motion Domain Fusion Solution (2)
C-C Ring Network Architecture-- Powertrain Domain: Huawei DriveONE Motion Domain Fusion Solution (3)
C-C Ring Network Architecture-- Powertrain Domain: Huawei DriveONE Motion Domain Proximal Closed-Loop Solution iTRACK
C-C Ring Network Architecture--Powertrain Domain: Huawei DriveONE Moves from Single Component Management of Range per kWh to Integrated Vehicle Efficiency Management
C-C Ring Network Architecture--Vehicle body Domain: Huawei Intelligent Vehicle Lighting System 2.0
C-C Ring Network Architecture--Cockpit Domain: Core Capabilities of Future Intelligent Cockpit
C-C Ring Network Architecture--Cockpit Domain: HarmonyOS 5.0
C-C Ring Network Architecture--ADS 4.0, World Action Route
C-C Ring Network Architecture--ADS 4.0, Huawei Cloud Pangu Models
C-C Ring Network Architecture: Giant Whale Battery 2.0
C-C Ring Network Architecture: Zone: Vehicle Interface Unit (VIU)
Luxeed S7 EEA Design: Autonomous Driving Domain (1)
Luxeed S7 EEA Design: Autonomous Driving Domain (2)
Luxeed S7 EEA Design: Autonomous Driving Domain (3)
Luxeed S7 EEA Design: Intelligent Cockpit Domain (1)
Luxeed S7 EEA Design: Intelligent Cockpit Domain (2)
Luxeed S7 EEA Design: Intelligent Cockpit Domain (3)
Luxeed S7 EEA Design: Chassis Domain (1)
Luxeed S7 EEA Design: Chassis Domain (2)
Luxeed S7 EEA Design: Electric Drive System
Luxeed S7 EEA Design: High and Low Voltage System
Luxeed S7 EEA Design: Power Distribution Design
AITO M9 EEA Topology Diagram
AITO M9 EEA Topology Diagram: Vehicle Domain Controller (VDC)
AITO M9 EEA Topology Diagram: Autonomous Driving Domain Controller (MDC)
AITO M9 EEA Topology Diagram: Cockpit Domain & Chassis Domain
AITO M9 EEA Topology Diagram: Left ZCU (VIU1)
AITO M9 EEA Topology Diagram: Right ZCU (VIU2)
AITO M9 EEA Topology Diagram: Rear ZCU (VIU3)
AITO M9 EEA Topology Diagram: Electric Drive & High Voltage System
AITO M9 EEA Topology Diagram: VCU and Power Management Strategy
3.7 Li Auto
Advanced EEA Evolution and Supply Chain Construction (1): Li Auto
Advanced EEA Evolution and Supply Chain Construction (2): Li Auto
Advanced EEA Evolution and Supply Chain Construction (3): Li Auto
Advanced EEA Evolution and Supply Chain Construction (4): Li Auto
Advanced EEA Evolution and Supply Chain Construction (5): Li Auto
Advanced EEA Evolution and Supply Chain Construction (6): Li Auto
EEA Evolution Roadmap
LEEA2.5-- Autonomous Driving Domain: VLA Large Model + Voice-controlled Vehicle (1)
LEEA2.5-- Autonomous Driving Domain: VLA Large Model + Voice-controlled Vehicle (2)
LEEA2.5-- Autonomous Driving Domain - AD4.0 and ATL All-Weather LiDAR
LEEA2.5-- Cockpit Domain: Self-developed Mind GPT Large Model
LEEA2.5-- Cockpit Domain: Lixiang Tongxue Voice Assistant (Self-Developed + Multi-Supplier Underlying Support)
LEEA2.5-- Cockpit Domain: Infotainment
LEEA2.5-- Chassis Domain: Next-Generation Dual-Chamber Dual-Valve Magic Carpet Air Suspension
LEEA2.5-- Central Controller Domain: Li Auto's Intelligent Vehicle Control Architecture
LEEA2.5-- Security Architecture: Data Security Deployment
Next-generation Architecture LEEA 3.0: Central Computing Platform + 4 ZCUs
Next-generation Architecture LEEA 3.0: CCU (1)
Next-generation Architecture LEEA 3.0: CCU (2)
Next-generation Architecture LEEA 3.0: ZCU
Next-generation Architecture LEEA 3.0: PCIE Switch & TSN Switch Communication Architecture (1)
Next-generation Architecture LEEA 3.0: PCIE Switch & TSN Switch Communication Architecture (2)
Next-generation Architecture LEEA 3.0: Self-Developed Central Computing SoC - Schumacher M100 (1)
Next-generation Architecture LEEA 3.0: Self-Developed Central Computing SoC - Schumacher M100 (2)
Next-generation Architecture LEEA 3.0: SOA and Basic Software: HaloOS (1)
Next-generation Architecture LEEA 3.0: SOA and Basic Software: HaloOS (2)
Next-generation Architecture LEEA 3.0: SOA and Basic Software: HaloOS (3)
Next-generation Architecture LEEA 3.0: SOA and Basic Software: Halo OS (4)
Next-generation Architecture LEEA 3.0: HaloOS - Overall Architecture
Next-generation Architecture LEEA 3.0: Halo OS: VBS Communication Middleware
Next-generation Architecture LEEA 3.0: Halo OS: VBS Communication Middleware:Supports Unified Deployment Across Domains
Next-generation Architecture LEEA 3.0: Halo OS: VBS Communication Middleware: Multi-Transport Protocol Adaptation (1)
Next-generation Architecture LEEA 3.0: HaloOS - VBS Communication Middleware: Multi-Transport Protocol Adaptation (2)
Next-generation Architecture LEEA 3.0: HaloOS - VBS-Pro Communication Bus: Necessity of Independent R&D
Next-generation Architecture LEEA 3.0: HaloOS - VBS-Pro Communication Bus: Functional Features (1)
Next-generation Architecture LEEA 3.0: HaloOS - VBS-Pro Communication Bus: Functional Features (2)
Next-generation Architecture LEEA 3.0: HaloOS - VBS-Pro Communication Bus: Communication Performance
Next-generation Architecture LEEA 3.0: HaloOS - Intelligent Vehicle Control OS (VCOS)
Next-generation Architecture LEEA 3.0: Halo OS: Intelligent Driving OS
Next-generation Architecture LEEA 3.0: Halo OS: Open-Source Plan
Next-generation Architecture LEEA 3.0: Li Auto Cooperated with Hinge Tech to Develop Optical Communication Test Bench
Next-generation Architecture LEEA 3.0: Hinge Tech's In-vehicle Optical Fiber Network Communication Architecture
Next-generation Architecture LEEA 3.0: A Configuration Solution for Hinge Tech's High-Speed Fiber Optic TSN Centralized Architecture
Next-generation Architecture LEEA 3.0: Physical Picture of Hinge Tech builds EEA Optical Communication Architecture Based on Optical Modules
Next-generation Architecture LEEA 3.0: Hinge Tech's Optoelectronic Hybrid Central Gateway
3.8 Voyah
Voyah EEA Overall Roadmap
Advanced EEA Evolution and Supply Chain Construction (1)
Advanced EEA Evolution and Supply Chain Construction (2)
Advanced EEA Evolution and Supply Chain Construction (3)
Advanced EEA Evolution and Supply Chain Construction (4)
Advanced EEA Evolution and Supply Chain Construction (5)
Centralized EEA - Tianyuan Architecture
Voyah Tianyuan Architecture-Computing platform: Central Controller OIB(Integrating BCM+ Power + Intelligent Driving + Intelligent Cockpit)
Voyah Tianyuan Architecture-Computing platform: Cockpit-Driving Integrated solution based on Black Sesame Chip
VoyahTianyuan Architecture: ZCU (VIU) (Integrated Zonal Data Center + Intelligent Power Distribution + Intelligent Partition I/O Control)
Voyah Tianyuan Architecture-Tianyuan OS(Central Computing Architecture and Cross-domain Integration)
Tianyuan Architecture--Cockpit Domain: AI Cockpit Deployment Based on Qualcomm 8295: "Tianyuan" Architecture Iteration, Integrating Domain Control and Zonal Access Mechanism
Qingyun Tianyuan Architecture-- Power + Chassis Qingyun L3 Intelligent Safe Driving Platform
Qingyun Tianyuan Architecture-- Power + Chassis Qingyun L3 Intelligent Safe Driving Platform
Qingyun Tianyuan Architecture--Power + Chassis: Qingyun L3 Intelligent Safe Driving Platform
Qingyun Tianyuan Architecture--Power + Chassis: Full Active Suspension
Qingyun Tianyuan Architecture--Power + Chassis: Steer-by-Wire
Qingyun Tianyuan Architecture--Power + Chassis: Super Intelligent Chassis
Qingyun Tianyuan Architecture--Power + Chassis: Lanhai Power Pure Electric System (BEV)
Qingyun Tianyuan Architecture--Power + Chassis: Lanhai Intelligent Hybrid Technology
Qingyun Tianyuan Architecture--Power + Chassis: Axial Flux Motor, All-Wheel Independent Drive Control
Qingyun Tianyuan Architecture--Intelligent Driving Domain: Kunpeng L3 Intelligent Safe Driving System
Qingyun Tianyuan Architecture--Intelligent Driving Domain: Kunpeng L3 Intelligent Safe Driving System
Next-generation EEA: Dongfeng Has Completed The First Phase of Research on In-vehicle Optical Communication
3.9 Avatr
Advanced EEA Evolution and Supply Chain Construction (1): Avatr
Advanced EEA Evolution and Supply Chain Construction (2): Avatr
Advanced EEA Evolution and Supply Chain Construction (3): Avatr
Central + Zonal EEA (1)
Central + Zonal EEA (2)
Central + Zonal EEA (3)
Central + Zonal EEA-- Chassis Domain: Taihang Intelligent Control Chassis (1)
Central + Zonal EEA-- Chassis Domain: Taihang Intelligent Control Chassis (2)
Central + Zonal EEA-- Chassis Domain: Magic Carpet Chassis Adjustment (Perception + Chassis Integration)
Central + Zonal EEA-- Chassis Domain: High-Speed Tire Blowout Stability, Master Drift
Central + Zonal EEA-- Intelligent Driving Domain: Huawei Four-Lidar System + Huawei Qiankun Intelligent Driving ADS 4
Central + Zonal EEA-- Intelligent Driving Domain: Full-Dimensional Collision Avoidance System CAS 4.0
Central + Zonal EEA--Cockpit Domain: HarmonySpace 5
EEA Design of Avatr 11: Vehicle Topology Diagram
EEA Design of Avatr 11: Intelligent Cockpit Domain Topology Diagram (1)
EEA Design of Avatr 11: Intelligent Driving Domain Topology Diagram (2)
3.10 ARCFOX
Advanced EEA Evolution and Supply Chain Construction (1) : ARCFOX
Advanced EEA Evolution and Supply Chain Construction (2) : ARCFOX
Advanced EEA Evolution and Supply Chain Construction (3) : ARCFOX
Advanced EEA Evolution and Supply Chain Construction (4) : ARCFOX
BAIC EEA Evolution Roadmap
BAIC's Technology R&D System: Cockpit-Driving Intelligent Agent Platform Layout Evolution
BAIC's Technology R&D System: Technical Framework
BAIC's Technology R&D System: Intelligent Connected Basic Software Platform
BAIC's Technology R&D System: Embodied Intelligent Agent Scenario-Based Exploration
BAIC's Technology R&D System: Exploration of All-Weather and All-Terrain Technology Applications
BAIC ARCFOX BEEA3.0--Cockpit-Driving Integrated AI Platform: ARCFOX T5 Equipped with Qualcomm SA8775P Cockpit-Driving Integrated Solution
BAIC ARCFOX BEEA3.0--Cockpit-Driving Integrated AI Platform: ARCFOX T5 Equipped with Qualcomm SA8775P Cockpit-Driving Integrated Solution
BAIC ARCFOX BEEA3.0--Cockpit-Driving Integrated AI Platform: System Framework
BAIC ARCFOX BEEA3.0--Cockpit-Driving Integrated AI Platform: Supply Chain Layout
BAIC ARCFOX BEEA3.0--Cockpit-Driving Integrated AI Platform: Ecology and Data Sharing
BAIC ARCFOXBEEA3.0--Intelligent Driving Domain: BAIC Yuanjing Intelligent Driving Assisted System
BAIC ARCFOX BEEA3.0--Vehicle Control Domain: Central Integrated Architecture VDC+VIU, Integration of Gateway, Body Domain, Power Domain and OTA Domains
BAIC ARCFOXBEEA3.0--Cockpit Domain: Multi-Model Integration
BAIC ARCFOXBEEA3.0--Power Domain: New Generation Hybrid Domain Controller HDCU 3.0
BAIC ARCFOXBEEA3.0--Power Domain: Hybrid Scenario-Based Model
BAIC ARCFOXBEEA3.0--Power Domain: BAIC Shenqing Extended-Range Power
3.11 Chang'an
Advanced EEA Evolution and Supply Chain Construction (1): Changan Automobile
Advanced EEA Evolution and Supply Chain Construction (2): Changan Automobile
Advanced EEA Evolution and Supply Chain Construction (3): Changan Automobile
Advanced EEA Evolution and Supply Chain Construction (4): Changan Automobile
Beidou Tianshu 2.0 Plan
Digital Intelligent Foundation and Platform
SDA: Six-layer Architecture Design, Layered Decoupling (1)
SDA: Six-layer Architecture Design, Layered Decoupling (2)
SDA: Six-layer Architecture Design, L1 Mechanical Layer
SDA: Six-layer Architecture Design, L2 Energy Layer
SDA: Six-layer Architecture Design, L3 layer, Central + Ring Network Architecture Design (1)
SDA: Six-layer Architecture Design, L3 Layer, Central + Ring Network Architecture Design (2)
SDA: Six-layer Architecture Design, L3 Layer, Features of ZCU Design
SDA: Six-layer Architecture Design, L3 Layer, dual 16-domain integrated left-right zone control (left and right zone controllers)
SDA: Six-layer Architecture Design, L4 Layer, Tianshu OS
SDA: Six-l