Automotive Microcontroller Unit (MCU) and Application Scenario Research Report, 2026

Description

Automotive MCU Research: Increased demand for redundant security drives ASIL D-compliant MCU shipments to exceed 100 million units

In a vehicle EEA, MCUs are widely distributed in various functional domains of automobiles, undertaking tasks such as functional safety monitoring, real-time control, sensor preprocessing, communication power supply management, and watchdog tasks. The functional safety level ranges from ASIL A to ASIL D according to different functional domains and tasks. Systems related to the autonomous driving domain and the chassis domain generally require ASIL D as they are directly related to driving safety. Moreover, due to the evolution of subsystem solutions, the number of MCUs and the tasks they undertake will vary. However, vehicle MCUs show tend to evolve from a distributed ECU architecture to a central + zone redundant multi-MCU architecture. Moreover, MCU performance is also constantly improving.

As the penetration rate of new energy vehicles continues to increase, China's automotive-grade MCU market is still showing an upward trend. It is estimated that 850-900 million MCUs were installed in passenger cars in China in 2025, with a market size of RMB26.91 billion. Moreover, the proportion of MCUs that meet ASIL D continues to grow. The shipments of ASIL D-compliant MCUs in China's passenger car market was estimated to be around 100 million units in 2025, and the figure will further increase to 180 million units in 2030.

The technological evolution of brake-by-wire systems has significantly raised the requirements for MCU redundancy, functional safety, and real-time performance.

Brake-by-wire is the core execution layer of the intelligent chassis. It replaces traditional hydraulic/mechanical connections with electronic signals to achieve millisecond-level response to and precise control over braking commands, providing a redundant safety cornerstone for autonomous driving. The technology path herein is evolving from EHB to dry EMB.

An EHB (Electro-Hydraulic Brake) system consists of a brake pedal module, a control unit and a hydraulic control module. It is currently the mainstream brake-by-wire solution on the market. Compared with the traditional braking system, the "brake-by-wire" of EHB is mainly reflected in the fact that the connection between the driver's pedal and the ECU of the braking system has been changed from a mechanical connection to an electrical signal connection, but the brake actuator still retains the hydraulic system. According to the integration level of the EHB system, it boasts two control strategies: "Two-box" and "One-box":

A Two-box EHB system generally consists of a motor, a mechanical reduction mechanism, a master cylinder, a sensor, and two independent ECUs. Therefore, it generally requires two MCUs, or two MCUs plus a redundant monitoring MCU. MCUs should meet ASIL-D, real-time closed-loop, millisecond-level redundancy and other requirements.

A One-box EHB system integrates iBooster and ESP in the form of the original Two-box, only requiring one ECU and one braking unit, with higher integration and reduced size and weight. Moreover, it can independently regulate wheel cylinder hydraulic pressure, thereby realizing vehicle stability control functions such as ABS, ESC and TCS. The system uses one MCU, fewer than the two-box solution, yet the performance requirements remain the same.

Electro-Mechanical Brake (EMB) further simplifies the braking structure on the basis of EHB. It cancels the original brake master cylinder and hydraulic pipeline of EHB and integrates the motor directly on the brake. The motor pushes the brake piston and allows the brake caliper to clamp the brake disc to achieve braking.

In order to meet ASIL-D, EMB architecture design is critical. Redundant backup design must be adopted for ECUs, power supplies, communication lines and other components. In terms of ECU layout, a small number of systems discard the controller integrated within the EMB actuator but integrate control functions into a centralized duplex module. More commonly, systems adopt four actuator ECUs. The typical MCU layout schemes are shown in the table below.

Current EMB requires approximately six MCUs. These MCUs do not target high TOPS; instead, priorities include a 200 MHz+ clock frequency, lockstep cores, ASIL-D compliance, microsecond-level FOC current loops, redundant multi-channel CAN-FD/FlexRay communication, high-resolution PWM/ADC, and 48V compatibility. Combined with dual power supplies, dual-winding motors and mechanical self-locking, they form a complete fail-operational system.

For example, SemiDrive announced mass production of the flagship intelligent MCU, E3650, in October 2025. It has been appointed by many leading OEMs, covering four major scenarios: vehicle zonal control, VMC, intelligent cockpit/autonomous driving domain control, and powertrain domain control.

Performance highlights: 4 pairs of 600MHz ARM Cortex-R52+ lock-step multi-core clusters, 16MB automotive-grade MRAM, virtualization. The computing power is nearly 40% higher than products of the same grade;

Security level: AEC-Q100 Grade 1 and ISO 26262 ASIL D, Xuanwu ultra-safe HSM, ISO 21434, Evita Full and above information security standards;

Communication capabilities: Fully self-developed SSDPE, multi-channel CAN FD concurrency with zero packet loss, suitable for high-frequency communication of chassis-by-wire multi-sensors and actuators;

Cross-domain integration: A single chip can realize safe isolation and coordinated scheduling of multi-system (body, chassis, and powertrain) services, adapting to the trend of ZCUs integrating chassis-by-wire functions.

Moreover, the automotive EEA continues to evolve towards a central computing platform. In addition to the "central cerebrum" composed of intelligent cockpit and autonomous driving, vehicle control tasks related to body, connectivity, powertrain, and chassis motion coordination are gradually converging upward from the current zone layer to form a "central intelligent control cerebellum". This requires a more powerful and robust safety computing foundation.

SemiDrive created the "AMU (Architecture Master Unit)", a super computing power foundation for the complex central cerebellum. AMU goes beyond traditional ordinary MCUs as an ultra-highly integrated, more powerful and secure real-time computing platform. On the basis of chips, it integrates SemiDrive's deep system optimization capabilities and leading software capabilities to deliver software and hardware collaborative solutions to OEMs. In April 2026, SemiDrive launched two AMU solutions for "central intelligent control cerebellum": Flagship AMU E3800 and Gemini AMU E3650-E.

E3800 integrates more than 10 cores on a single chip, boasts strong secure real-time computing power, introduces aerospace-grade advanced embedded storage, and performs 10 to 20 times better than that of traditional eflash. For the scenario requirements of the central cerebellum, E3800 features specially enhanced network communication capabilities. It is equipped with high-bandwidth Ethernet, an integrated multi-port switch, and multi-layer network acceleration engines. Through the innovation of the underlying layer architecture, E3800 allows the CPU and NPU to realize deep coupling and collaborative work in the pipeline, comprehensively improving the real-time intelligent processing capabilities of the central cerebellum.

Gemini AMU is a combination of two E3650 flagship chips connected on a common board. Using SemiDrive's "SemiLink" communication optimization technology, the latency in cross-chip communication is reduced to microseconds. When OEMs carry out actual high-level development, they can achieve the same minimalist development and smooth experience as with a single-chip solution. The core advantage of Gemini AMU is its excellent flexibility, which allows OEMs to flexibly expand computing power from 10 to 16 cores like building blocks. Especially today, the vehicle EEA is iterating rapidly and the requirements have not yet fully converged. Gemini AMU can help OEMs conduct incremental iteration and agile verification, enabling more relaxed development of new architectures and gaining time for vehicle intelligence.

The mainstream choice for the next generation of intelligent BMS domain controllers is evolving towards high-performance multi-core MCUs or MCU+MPU heterogeneous architectures.

The next-generation centralized domain control BMS architecture uses a high-performance domain control motherboard (possibly using a multi-core MCU), which directly takes over all functions of the original BMU and integrates some of the VCU's energy management functions and even fuses gateway functions.

High-performance multi-core MCU: For example, Infineon's TC4xx, which has multiple lock-step cores (for ASIL-D safety tasks) and performance cores, can not only meet the highest requirements of functional safety, but also provide considerable computing power for algorithms.

MCU+MPU heterogeneous architecture: This is a more forward-looking choice. The MCU (such as Cortex-R) specializes in handling high-real-time, high-security tasks (such as OVP, short-circuit protection). The MPU (such as Cortex-A) runs a rich operating system (such as Linux) and is responsible for complex algorithms, network communications, diagnostic services and HMI interfaces. This architecture takes into account real-time security and intelligent computing.

In 2026, Infineon launched the PSOC(TM) 4 HVPA-SPM 1.0, an advanced MCU designed for high-voltage Li-ion battery management in electric vehicles (xEVs). This MCU combines precision, safety, and programmability, while supporting zonal architectures and the transition to Software-Defined Vehicles (SDVs).

The PSOC 4 HVPA-SPM 1.0 offers a fully integrated design with key features that bring advanced intelligence, safety, and efficiency to BMS. It provides high-precision monitoring of current, voltage, and temperature, ensuring reliable battery performance and improving the accuracy of State-of-Charge (SoC) and State-of-Health (SoH). Fully compliant with ASIL D (ISO 26262) safety standards, the MCU ensures robust and reliable operation in critical high-voltage battery systems. Its built-in Arm(R) Cortex(R)-M0+ processor delivers advanced edge intelligence, enabling faster data processing and reducing the load on the central Electronic Control Unit (ECU). Moreover, the MCU supports zonal architectures and allows OEMs to customize the system for specific requirements, leading to shorter development cycles and faster time-to-market.

Under the zonal architecture, the MCU-less solution is being promoted in some scenarios

With improved domain controller performance and high-speed, stable long-range communication enabled by automotive Ethernet, the MCU-less solutions that remove local MCUs for lamps and transfer full control to ZCUs have attracted attention from vendors. In the development trend of software-defined vehicles, the MCU-less lighting control architecture integrates lighting algorithms into the vehicle's ZCUs, avoiding the lighting controller's computing power requirements for the MCU and meeting customer demand for cost, efficiency, and high integration.

Significant cost reduction: Local MCUs, crystal oscillators, some PMICs and other peripheral components inside lamps are eliminated, cutting BOM cost and hardware complexity;

The communication rate has been greatly improved: Ethernet replaces CAN-FD to increase communication bandwidth, reduce latency, and support more complex real-time headlight control and image data transmission;

The MCU-less solution reconstructs the system architecture and helps OEMs achieve functional differentiation: After the MCU-less solution is adopted, the control logic is completely restored to ZCUs. OEMs can independently define lighting logic and combine autonomous driving data to attain smarter lighting interaction, truly moving towards "software-defined lighting". Tier 1 suppliers focus more on drive design and interfaces, with clearer division of labor and faster response.

onsemi's MCU-less solution adopts a flattened architecture of "HPC - 10BASE-T1S Ethernet - RCP - LED driver". The HPC connects directly to the RCP, with 10 Mbps Ethernet replacing the traditional CAN bus. This solution significantly optimizes hardware: it eliminates components such as node MCUs, reset circuits and crystal oscillators, and can connect 8 to 40 nodes on a 25-meter unshielded twisted pair. It uses PoDL technology for power supply and communication through two wires at the same time, reducing the wiring harness cost by more than 50% and simplifying the system. In terms of performance, the 10Base-T1S Ethernet rate reaches 10 Mbps, far exceeding CAN/CAN FD. The RCP integrates the gPTP protocol to achieve nanosecond-level clock synchronization and ensure coordinated control of the entire vehicle lighting.

With TLD7002-16ES, Infineon has proposed an automotive lighting solution that uses the UART OVER CAN communication interface to reduce costs and improve EMC performance. TLD7002-16ES is an intelligent 16-channel LED driver with a 2 Mbit/s HSLI interface (CAN OVER UART). It can be used as a gateway to control other external LED drivers. By acting as a UART-over-CAN gateway, TLD7002-16ES can directly drives 16 LEDs, and then cascades external drivers, eliminating all MCUs, crystal oscillators, and reset circuits on the light board, while retaining PWM, diagnosis, current expansion, thermal balance, and nanosecond synchronization, thus realizing the MCU-less architecture of the automotive light ECU. This design reduces hardware complexity by 40% and wiring harnesses by 25%, promoting innovation in domain-centralized electrical design. Moreover, it can better meet the dynamic configuration requirements of software-defined vehicles (SDVs) for the lighting system. The single-chip integrated solution replaces traditional discrete design and reduces BOM cost by 30%.

Product Code: ZQY003

1 Overview and Market of Automotive Microcontroller Unit (MCU)

1.1 Definition and Technology Trends of Automotive MCU
Definition
Structure
Classification
Application
1.2 MCU Market Size and Pattern
Global Automotive MCU Market Size, 2023-2030E
Automotive-Grade MCU Price
Automotive-Grade MCU BOM Cost Structure
Automotive MCU Demand Structure (by Application)
China's Passenger Car MCU Market Size, 2022-2030E (1)
China's Passenger Car MCU Market Size, 2022-2030E (2)
China's Passenger Car Autonomous Driving Domain: MCU Market Demand by Scenario, 2022-2030E (1)
China's Passenger Car Autonomous Driving Domain: MCU Market Demand by Scenario, 2022-2030E (2)
China's Passenger Car Autonomous Driving Domain: MCU Market Demand by Scenario, 2022-2030E (3)
China's Passenger Car Intelligent Cockpit Domain: MCU Market Demand by Scenario, 2022-2030E (1)
China's Passenger Car Intelligent Cockpit Domain: MCU Market Demand by Scenario, 2022-2030E (2)
China's Passenger Car Intelligent Cockpit Domain: MCU Market Demand by Scenario, 2022-2030E (3)
China's Passenger Car Chassis Domain: MCU Market Demand by Scenario, 2022-2030E (1)
China's Passenger Car Chassis Domain: MCU Market Demand by Scenario, 2022-2030E (2)
China's Passenger Car Chassis Domain: MCU Market Demand by Scenario, 2022-2030E (5)
China's Passenger Car Powertrain Domain: MCU Market Demand by Scenario, 2022-2030E (1)
China's Passenger Car Powertrain Domain: MCU Market Demand by Scenario, 2022-2030E (2)
China's Passenger Car Powertrain Domain: MCU Market Demand by Scenario, 2022-2030E (3)
China's Passenger Car Thermal Management System: MCU Market Demand by Scenario, 2022-2030E
China's Passenger Car Body/Zone: MCU Market Demand by Scenario, 2022-2030E (1)
China's Passenger Car Body/Zone: MCU Market Demand by Scenario, 2022-2030E (2)
1.3 Automotive-Grade MCU Players and Product Layout
Automotive-Grade MCU Players (1): Traditional Automotive Chip Suppliers (1)
Automotive-Grade MCU Players (1): Traditional Automotive Chip Suppliers (2)
Automotive-Grade MCU Players (1): Traditional Automotive Chip Suppliers (3)
Automotive-Grade MCU Players (1): Traditional Automotive Chip Suppliers (4)
Automotive-Grade MCU Players (2): OEMs
Automotive-Grade MCU Product Line Layout of Major OEMs
Automotive-Grade MCU Product Line Layout of Major Suppliers (1)
Automotive-Grade MCU Product Line Layout of Major Suppliers (2)
Automotive-Grade MCU Product Line Layout of Major Suppliers (3)
Benchmarking of Chinese and Foreign Automotive-Grade MCUs (1)
Benchmarking of Chinese and Foreign Automotive-Grade MCUs (2)
Domestic Substitution of MCUs from Mainstream Foreign Suppliers
1.4 Automotive MCU Technology Trends
Automotive MCU Technology Trend 1
Automotive MCU Technology Trend 2
Automotive MCU Technology Trend 6
Automotive MCU Technology Trend 7

2 MCU in Cockpit Domain

2.1 Central + Zone
Central + Zonal Architecture's Demand for MCU
MCU Development Trends of Central + Zonal Architecture
Penetration Rate of Central + Zonal Architecture in Chinese Passenger Cars
Market Competition of MCU Vendors in Central + Zonal Architecture (Estimated)
MCU Competition in Central + Zonal Architecture: Summary of Vendors and Solutions (1)
MCU Competition in Central + Zonal Architecture: Summary of Vendors and Solutions (2)
2.2 Autonomous Driving Domain Controller
High-Level Autonomous Driving's Demand for MCU
MCU Installation in Autonomous Driving Domain
Market Competition of MCU Vendors in Autonomous Driving Domain (Estimated)
Existing Application Structure of MCU in Autonomous Driving Domain: SOC+MCU
MCU Application Structure Trends in Autonomous Driving Domain
MCU Application Trends in Autonomous Driving Domain (1)
MCU Application Trends in Autonomous Driving Domain (2)
MCU Application Trends in Autonomous Driving Domain (3)
MCU for Autonomous Driving Domain: Summary of Vendors and Solutions (1)
MCU for Autonomous Driving Domain: Summary of Vendors and Solutions (2)
MCU for Autonomous Driving Domain: Summary of Vendors and Solutions (3)
2.3 Cockpit Domain Controller
MCU Application in Cockpit Domain: SOC+MCU
Intelligent Cockpit Function Evolution Roadmap
MCU Installation in Intelligent Cockpit Domain
Market Competition of MCU Vendors in Intelligent Cockpit Domain (Estimated)
MCU for Cockpit Domain: Summary of Vendors and Solutions (1)
MCU for Cockpit Domain: Summary of Vendors and Solutions (2)
2.4 LiDAR
LiDAR: Functional Evolution Roadmap
MCU Installation in LiDAR
Automotive LiDAR Control Strategy Solution 1: Control Module Integrated into LiDAR
Automotive LiDAR Control Strategy Solution 2: LiDAR's Main Computing Power Is Shifted upward to the Domain Controller
MCU for LiDAR: Summary of Vendors and Solutions
MCU Solutions for LiDAR (1)
MCU Solutions for LiDAR (2)
2.5 Ultrasonic Radar
Ultrasonic Radar: Functional Evolution Roadmap
MCU Installation in Ultrasonic Radar
Parking Technology Evolution: APA/RPA/HPA/AVP (1)
Parking Technology Evolution: APA/RPA/HPA/AVP (2)
AK2 Ultrasonic Radar: Structural Composition
MCU Solutions for Ultrasonic Radar (1)
MCU Solutions for Ultrasonic Radar (2)
MCU Solutions for Ultrasonic Radar (3)
2.6 HUD
HUD: Functional Evolution Roadmap
HUD: Evolution of MCU Control Strategy Involved
MCU Installation in HUD
AR-HUD Control Strategy Solution 1: Independent HUD Control Module
AR-HUD Control Strategy Solution 2: AR Engine Integrated into Cockpit Domain Controller
AR-HUD: Role of MCU
MCU for AR-HUD: Summary of Vendors and Solutions
MCU for AR-HUD: Comparison of Advantages and Disadvantages of Mainstream Vendors
MCU Solutions for AR-HUD (1)
MCU Solutions for AR-HUD (5)
MCU Solutions for AR-HUD (6)
2.7 Development Trends of Next-Generation Cockpit-Driving Domain AI Vehicle Agent and MCU Demand
Cockpit-Driving Domain Is Developing towards AI Vehicle Agent
Cockpit-Driving AI Agent Application Case: Huawei WEWA 2.0
Cockpit-Driving AI Agent Application Case: XPeng's Second-Generation VLA
Development Trends of Next-Generation Cockpit-Driving Domain AI Vehicle Agent and MCU Demand

3 MCU in Powertrain and Chassis Domains

3.1 Powertrain Domain Controller
Evolution of MCU Computing Power Requirements in Powertrain and Chassis Domains
MCU Localization Process in Powertrain and Chassis Domains
Powertrain and Chassis Domains: Evolution of MCU Technology in Chassis Domain
Powertrain and Chassis Domains: Evolution of MCU Technology in Powertrain Domain
MCU Installation in Powertrain and Chassis Domains
Market Competition of MCU Vendors in Powertrain and Chassis Domains (Estimated)
MCU Market Landscape in Powertrain Domain: All-In-One New Energy Vehicle MCU Market Competition Pattern
MCU for Powertrain Domain: Summary of Vendors and Solutions (1)
MCU for Powertrain Domain: Summary of Vendors and Solutions (2)
MCU for Powertrain Domain: Summary of Vendors and Solutions (5)
MCU for Powertrain Domain: Summary of Vendors and Solutions (6)
MCU Solutions for Powertrain Domain (1)
MCU Solutions for Powertrain Domain (2)
MCU Solutions for Powertrain Domain (6)
MCU Solutions for Powertrain Domain (7)
3.2 Steering System (EPS/SBW, etc.)
Steering System: Evolution of MCU Technology Involved
MCU Installation in Steering System
Summary of Automotive Steering System Technology Development Trends: RWS, EPS, SWB
EPS: Structural Composition and Working Principle
EPS Control Strategy Solution 1: EPS Dedicated Controller
EPS Control Strategy Solution 2: Dual-MCU Redundant Control (1)
EPS Control Strategy Solution 2: Dual-MCU Redundant Control (2)
MCU for EPS (1)
MCU for EPS (2)
MCU Solutions for EPS (1)
MCU Solutions for EPS (2)
MCU Solutions for EPS (3)
MCU Solutions for EPS (4)
SBW: Structural Composition and Working Principle
SBW Control Strategy Solution 1: Redundancy Control (1)
SBW Control Strategy Solution 1: Redundancy Control (2)
SBW Control Strategy Solution 2: Communication Link
MCU for SBW: Summary of Vendors and Solutions (1)
MCU for SBW: Summary of Vendors and Solutions (2)
3.3 Braking System (EHB/EMB, etc.)
Brake-by-Wire: Evolution of MCU Technology Involved
MCU Installation in Brake-by-Wire
EHB: Structural Composition and Working Principle
EHB Control Strategy Solution 1: Two-Box
EHB Control Strategy Solution 2: One-Box
MCU for EHB: Summary of Vendors and Solutions (1)
MCU for EHB: Summary of Vendors and Solutions (2)
MCU Solutions for EHB (1)
MCU Solutions for EHB (4)
MCU Solutions for EHB (5)
EMB: Structural Composition and Working Principle
EMB Architecture
EMB Control Strategy Solution 1: Upper-Level Algorithm Runs on the Central Controller, While Motor Control is implemented in the Wheel-Side Controller
EMB Control Strategy Solution 2: Centralized Braking Control
MCU for EMB: Summary of Vendors and Solutions (1)
MCU for EMB: Summary of Vendors and Solutions (2)
MCU Solutions for EMB (1)
MCU Solutions for EMB (2)
3.4 Suspension System (Semi-Active/Fully Active)
Suspension-by-Wire: Evolution of MCU Technology Involved
MCU Installation in Suspension System
Semi-Active Suspension - Air Suspension: Working Principle
Semi-Active Suspension (Air Suspension + CDC): System Composition
Semi-Active Suspension Control Strategy Solution 1: The Control Algorithm Is Integrated in an Independent Suspension Controller
Semi-Active Suspension Control Strategy Solution 2: The Control Algorithm Is Integrated in the Chassis Domain Controller
Semi-Active Suspension Control Strategy Solution 3: The Control Algorithm Is Integrated in the VMC Domain
MCU for Semi-Active Suspension: Summary of Vendors and Solutions (1)
MCU for Semi-Active Suspension: Summary of Vendors and Solutions (2)
MCU Solutions for Semi-Active Suspension (1)
MCU Solutions for Semi-Active Suspension (2)
MCU Solutions for Semi-Active Suspension (3)
MCU Solutions for Semi-Active Suspension (4)
Fully Active Suspension: Structural Composition and Working Principle
Fully Active Suspension Control Strategy Solution: Active Suspension Controller
MCU for Fully Active Suspension: Summary of Vendors and Solutions (1)
MCU for Fully Active Suspension: Summary of Vendors and Solutions (2)
MCU Solutions for Fully Active Suspension
3.5 BMS (Battery Management System)
BMS: Evolution of MCU Technology Involved
MCU Installation in BMS
BMS Architecture for Centralized Domain Control
MCU for BMS: Summary of Vendors and Solutions
MCU Solutions for BMS (1)
MCU Solutions for BMS (2)
3.6 Development Trends of Next-Generation Intelligent Chassis and MCU Demand
Technology Background of Intelligent Chassis Development Trends
Current Intelligent Chassis Solutions
Development Trends of Next-Generation Intelligent Chassis (1)
Development Trends of Next-Generation Intelligent Chassis (2)
Development Trends of Next-Generation Intelligent Chassis and MCU Demand

4 MCU in Body Domain

4.1 ZCU
Main Concerns of OEMs about ZCU MCU Selection (1)
Main Concerns of OEMs about ZCU MCU Selection (2)
Evolution of Zonal Control Technology: From "Control Box" to "Edge Router"
MCU Installation in ZCU MCU
MCU for ZCU: Summary of Vendors and Solutions (1)
MCU for ZCU: Summary of Vendors and Solutions (2)
MCU for ZCU: Summary of Vendors and Solutions (3)
MCU for ZCU: Summary of Vendors and Solutions (4)
ZCU MCU Cases (1)
ZCU MCU Cases (2)
ZCU MCU Cases (3)
ZCU MCU Cases (4)
4.2 Body Domain Controller
Impact of Transition from Body Control to Body Domain on MCU
Major MCU Players in Body Domain
MCU Installation in Body Domain Controller
Market Competition of MCU Vendors in Body Domain
MCU for Body Domain: Summary of Vendors and Solutions (1)
MCU for Body Domain: Summary of Vendors and Solutions (2)
MCU for Body Domain: Summary of Vendors and Solutions (6)
MCU Solutions for Body Domain (1)
MCU Solutions for Body Domain (2)
MCU Solutions for Body Domain (5)
MCU Solutions for Body Domain (6)
4.3 Smart Door
Smart Door: Evolution of MCU Technology Involved
MCU Installation in Smart Door
Smart Door: Structural Components (1)
Smart Door: Structural Components (2)
Door Control Strategy Solution 1
Door Control Strategy Solution 2
Door Control Strategy Solution 3
MCU for Smart Door: Summary of Vendors and Solutions (1)
MCU for Smart Door: Summary of Vendors and Solutions (2)
MCU Solutions for Smart Door (1)
MCU Solutions for Smart Door (2)
MCU Solutions for Smart Door (3)
4.4 Intelligent Lighting
Intelligent Lighting: Evolution of MCU Technology Involved
MCU Installation in Intelligent Lighting
Intelligent Lighting Control Strategy Solution 1: LDM
Intelligent Lighting Control Strategy Solution 2: MCU-less Solution (Zonal Architecture)
Intelligent Lighting Control Strategy Solution 2: MCU-less Case - Infineon
Intelligent Lighting Control Strategy Solution 2: MCU-less Case - TI
Intelligent Lighting Control Strategy Solution 2: MCU-less Case - onsemi
MCU for Intelligent Lighting: Summary of Vendors and Solutions (1)
MCU for Intelligent Lighting: Summary of Vendors and Solutions (2)
MCU Solutions for Intelligent Lighting (1)
MCU Solutions for Intelligent Lighting (5)
MCU Solutions for Intelligent Lighting (6)
4.5 Intelligent Seating
Intelligent Seating: Evolution of MCU Technology Involved
MCU Installation in Intelligent Seating
Intelligent Seating: Structural Composition and Working Principle
Intelligent Seating System Control Strategy Solution 1: Independent Seating Control Module
Intelligent Seating System Control Strategy Solution 2: Integrated Seating Domain Control
Intelligent Seating: MCU Deployment Methods
MCU for Intelligent Seating: Summary of Vendors and Solutions (1)
MCU for Intelligent Seating: Summary of Vendors and Solutions (2)
MCU Solutions for Intelligent Seating (1)
MCU Solutions for Intelligent Seating (2)
MCU Solutions for Intelligent Seating (3)
MCU Solutions for Intelligent Seating (7)
MCU Solutions for Intelligent Seating (8)
4.6 Intelligent Windshield Wiper
Smart Wiper: Evolution of MCU Technology Involved
Conventional Intelligent Windshield Wiper System Architecture
Future Intelligent Windshield Wiper System Architecture
MCU for Smart Wiper: Summary of Vendors and Solutions
MCU Solutions for Smart Wiper (1)
MCU Solutions for Smart Wiper (4)
MCU Solutions for Smart Wiper (5)
4.7 Electrically Adjustable Steering Wheel
Electrically Adjustable Steering Wheel: Evolution of MCU Technology Involved
Electrically Adjustable Steering Wheel: Structural Composition
Electrically Adjustable Steering Wheel Control Strategy Solution 1: Integrated into Cockpit Domain Controller (1)
Electrically Adjustable Steering Wheel Control Strategy Solution 1: Integrated into Cockpit Domain Controller (2)
Electrically Adjustable Steering Wheel Control Strategy Solution 2: Integrated into Seating Control Module
Electrically Adjustable Steering Wheel Control Strategy Solution 3: Independent Steering Wheel Controller
MCU for Electrically Adjustable Steering Wheel: Summary of Vendors and Solutions
MCU Solutions for Electrically Adjustable Steering Wheels (1)
MCU Solutions for Electrically Adjustable Steering Wheels (2)
4.8 Development Trends of Next-Generation 48V Body Architecture and MCU Demand
48V Low-Voltage PDN Architecture VS 12V Low-Voltage PDN Architecture in Body Domain
Application Advantages of 48V Low-Voltage Power Distribution Architecture (1): Higher Power Output
Application Advantages of 48V Low-Voltage Power Distribution Architecture (2): Lower Power Loss
Application Advantages of 48V Low-Voltage Power Distribution Architecture (3): Lower Wiring Harness Cost
Application Advantages of 48V Low-Voltage Power Distribution Architecture (4): Better Adapted to "Zone + Central" Architecture, Enabling Zonal Power Distribution
48V Low-voltage Body Domain PDN Architecture Brings New Parts Opportunities
48V Low-Voltage Body Domain PDN Architecture Solutions (1)
48V Low-Voltage Body Domain PDN Architecture Solutions (2)
MCU Demand of Next-Generation 48V Body Architecture

5 Chinese Automotive MCU Vendors

5.1 SemiDrive
Automotive-Grade MCU Layout
Automotive-Grade MCU E3 Series Shipments
Automotive-Grade MCU Product Line
Automotive-Grade MCU Product Line (1)
Automotive-Grade MCU Product Line (2)
Automotive-Grade MCU Product Line (3)
Automotive-Grade MCU Product: "Central Intelligent Control Cerebellum" AMU Solution - Flagship AMU E3800
Automotive-Grade MCU Product: "Central Intelligent Control Cerebellum" AMU Solution - Gemini AMU E3650-E
Automotive-Grade MCU Product: E3610 Chip Solution for New-Generation IO-Type ZCU Design
Automotive-Grade MCU Product: E3650 One-Stop Solution for Cross-Domain Integration (1)
Automotive-Grade MCU Product: E3650 One-Stop Solution for Cross-Domain Integration (2)
Automotive-Grade MCU Product: E3650 One-Stop Solution for Cross-Domain Integration (3)
Automotive-Grade MCU Product: E3650 One-Stop Solution for Cross-Domain Integration (4)
Automotive-Grade MCU Application Scenario (Zone): E3650 Adapts to New-Generation E/E Architecture
Automotive-Grade MCU Application Scenario (Zone): E3650 Centered on "Reconstructing Zone Control with Single Chip"
Automotive-Grade MCU Application Scenario (Zone): E3650 Enables Systematic Cost Reduction & Efficient Iteration
Automotive-Grade MCU Application Scenario (Powertrain & Chassis): Product Line for New Energy Powertrain Systems
Automotive-Grade MCU Application Scenario (Powertrain & Chassis): E3620P Delivers Main Control MCU Performance Innovation
Automotive-Grade MCU Application Scenario (Powertrain & Chassis): Advantages of E3650 in Chassis Domain Applications
Automotive-Grade MCU Application Scenario (Intelligent Driving): Product Line for ADAS and Cockpit-Driving Integration
Automotive-Grade MCU Application Scenario (Embodied Artificial Intelligence): Product Line for ADAS and Cockpit-Driving Integration
MCU Application Case: Joint Development of New Energy Vehicle Electric Drive Solution with SAIC-GM-Wuling and Leadrive Technology
MCU Application Case: Launched Automotive MCU-based HSM Cybersecurity Solution Together with ETAS
MCU Application Case: Suspension Controller of Mingran Technology
5.2 BYD Semiconductor
Main Application Scenarios and Technology Implementation
Core Automotive-Grade Product Line
Automotive-Grade MCU Product Line
Automotive-Grade MCU (32-bit): BS9146AM64
Automotive-Grade MCU (8-bit): Indicators of BS9000AMXX
Automotive-Grade MCU (8-bit): Comparison between BS9000AMXX and Competitors
Automotive-Grade MCU (8-bit): Architecture of BF7006AMXX
Major Customers
5.3 AutoChips
Automotive-Grade MCU Product Line Layout (1)
Automotive-Grade MCU Product Line Layout (2)
Cumulative Shipments of Automotive-Grade MCUs
Automotive-Grade MCU Development: Software and Hardware Integrated Ecosystem Solution Based on Basic MCU
Automotive-Grade MCU (High-End): Official Release of AC7870
Automotive-Grade MCU (High-End): Core Performance of AC7870x
Automotive-Grade MCU (High-End): Advantages of AC7870x Compared with Previous Products and Competitors
Automotive-Grade MCU (Mid-Range): AC7840x
Automotive-Grade MCU (Entry-Level): First MCU+ AC7801L Chip
Automotive-Grade MCU (Entry-Level): Architecture of AC7801L
Automotive-Grade MCU (Entry-Level): AC7802x
Automotive-Grade MCU (Entry-Level): Architecture of AC7801x
Automotive-Grade MCU Application: Bluetooth Digital Key
Automotive-Grade MCU Application: UWB Digital Key
Automotive-Grade MCU Application: BMS
5.4 C*Core Technology
Automotive-Grade MCU Application covers Body Control, Cockpit, Powertrain System, etc.
Automotive-Grade MCU Product Line Layout (1)
Automotive-Grade MCU Product Line Layout (2)
Automotive-Grade MCU Product Line Layout (3)
Automotive-Grade MCU (High-End): CCRC4XXX
Automotive-Grade MCU (High-End): CCFC3012PT
Automotive-Grade MCU (High-End): Architecture of CCFC3008PT
Automotive-Grade MCU (High-End): Parameters and Block Diagram of CCFC3008PT
Automotive-Grade MCU (High-End): CCFC3007PT Is Benchmarked against NXP MPC5777M
Automotive-Grade MCU (Mid-to-Low-End): CCFC2012BC Is Benchmarked against NXP MPC5604/MPC5607
Automotive-Grade MCU (Mid-to-Low-End): CCFC2007PT Is Benchmarked against NXP MPC5674F
Automotive-Grade MCU (Mid-to-Low-End): CCFC2016BC Is Benchmarked against Infineon TC234L and CYT2B98
Technical Advantage of Automotive-Grade MCU: Self-Developed Core
Automotive-Grade MCU Application: "MCU+" Supporting Chips and Platform-Based Solutions
5.5 GigaDevice Semiconductor
Revenue in 2025
Automotive-Grade MCU Product Line Planning
Automotive-Grade MCU Product Line Layout
Automotive-Grade MCU (High-End): Next-Generation GD32A7 (1)
Automotive-Grade MCU (High-End): Next-Generation GD32A7 (2)
Automotive-Grade MCU (High-End): Next-Generation GD32A7 (3)
Automotive-Grade MCU (Mid-to-Low-End): Architecture of GD32A503
Automotive-Grade MCU (Mid-to-Low-End): Performance of GD32A503
Automotive-Grade MCU (Mid-to-Low-End): Performance of GD32A490
Automotive-Grade MCU Application: Enter Tesla's Supply Chain
5.6 ChipON
Electronic Automotive-Grade MCU Application Covers Body Control, Cockpit, Chassis, ADAS and Other Fields
Electronic Automotive-Grade MCU Planning
Electronic Automotive-Grade MCU Product Line (1)
Electronic Automotive-Grade MCU Product Line (2)
Electronic Automotive-Grade MCU (Mid-to-High-End): Architecture of KF32A158
Electronic Automotive-Grade MCU (Mid-to-High-End): KF32A156 Is Benchmarked against NXP, Renesas and AutoChips
Electronic Automotive-Grade MCU (Entry-Level): KF8A100 Is Benchmarked against NXP, STMicroelectronics, BYD Semiconductor, etc.
Advantage of electronic Automotive-Grade MCU: Self-Developed Core for Cost Control
5.7 Sine Microelectronics
Automotive-Grade MCU Is Mainly Used in the Field of Body Control
Automotive-Grade MCU Product Line
Automotive-Grade MCU (Integrated): 32-bit MCU for High-Performance Motor Control - ASM31AM830
Automotive-Grade MCU (Integrated): Fully Integrated Five-in-One Micromotor Driver IC - ASM81504
Automotive-Grade MCU Application: MCU+ Power
Automotive-Grade MCU Application: Nine-Way Valve for Thermal Management
5.8 Hangshun Chip
MCU Product Line Layout
Automotive-Grade SOC+MCU Strategic Planning
Automotive-Grade MCU Product Line Layout
Automotive-Grade MCU: Performance of HK32A040C8T3
Automotive-Grade MCU Application: Automotive Matrix Headlight Solution Based on HK32A040C8T3
Major Automotive-Grade MCU Customers
5.9 NOVOSENSE
Automotive-Grade MCU Layout
The Reason Why TI's C2000 is the First Alternative Target for the Company's MCU Production Line
Steps to Replace C2000: Cooperation with ChipSine in the Mid-Range NS800RT MCU for Real-Time Control
Advantages of Replacing C2000
Automotive-Grade MCU Product Line
New Automotive-Grade MCU: Cost-Effective NS800RT115x MCU
New Automotive-Grade MCU: NS800RT113x
New Automotive-Grade MCU: Parameters of NS800RT113x
5.10 Geehy
MCU Product Line
Automotive-Grade MCU Product Line (1)
Automotive-Grade MCU Product Line (2)
Automotive-Grade MCU: MCU for Real-Time Control - G32R501
Automotive-Grade MCU: MCU for Real-Time Control - Roadmap of G32R501
Automotive-Grade MCU: MCU for Real-Time Control - G32R501 with High-Energy-Efficiency Real-Time Control Core
Automotive-Grade MCU: MCU for Real-Time Control - G32R501 with Self-Developed Zidian Math Instruction Extension
Automotive-Grade MCU: MCU for Real-Time Control - G32R501 with Dual-Core Configuration for Efficiency Improvement
Automotive-Grade MCU: MCU for Real-Time Control - Ecosystem Support of G32R501
Automotive-Grade MCU: MCU for Real-Time Control - Some Indicators of G32R501 Have Reached the International Leading Level (1)
Automotive-Grade MCU: MCU for Real-Time Control - Some Indicators of G32R501 Have Reached the International Leading Level (2)
Automotive-Grade MCU: APM32F103
Automotive-Grade MCU Application: LED Lighting Solution Based on APM32F103RCT7
Automotive-Grade MCU Application: Solutions based on G32A1085/1065/1045 (1)
Automotive-Grade MCU Application: Solutions based on G32A1085/1065/1045 (2)
5.11 Chipsea
"ADC+MCU" as the Core Strategy
Automotive-Grade MCU Roadmap
Automotive-Grade Integrated MCU: CS1795X
Automotive-Grade MCU: CS32F036Q
Automotive-Grade MCU: Architecture of CS32F116Q
5.12 Fudan Microelectronics
Automotive-Grade MCU Product Line Layout
Automotive-Grade MCU (Advanced): Architecture of FM33FG0xxA
Automotive-Grade MCU Application: Touch Design Solution Based on FM33FT0xxA
5.13 YTMicro
MCU Covers Scenarios such as Autonomous Driving, Cockpit, Body, Powertrain and Chassis
Automotive-Grade MCU Product Line (1)
Automotive-Grade MCU Product Line (2)
Automotive-Grade MCU (High-End): Architecture of YTM32B1H
Automotive-Grade MCU (High-End): Features and Development Threshold of YTM32B1H
Automotive-Grade MCU (High-End): YTM32Z1L Integrates MCU with LDO and LIN Transceivers
Automotive-Grade MCU (Mainstream): Architecture of YTM32B1ME
Automotive-Grade MCU (Mainstream): YTM32B1ME Is Benchmarked against NXP S32K14x/11x
Automotive-Grade MCU (Entry-Level): Architecture of YTM32B1L
5.14 CVA Chip
Differentiated Automotive-Grade MCU Layout: TMCU Innovative Solution
Automotive-Grade MCU Product Line
Automotive-Grade MCU: Architecture of TMCU
Automotive-Grade MCU (Mid-Range): CVM014x Is Benchmarked against NXP S32K144
Automotive-Grade MCU (Mid-Range): Parameters of CVM014x
Automotive-Grade MCU (Mid-Range): Software Architecture of CVM014x
5.15 Flagchip
Automotive-Grade MCU Product Line Layout (1)
Automotive-Grade MCU Product Line Layout (2)
Automotive-Grade MCU: Parameters of FC4150
Automotive-Grade MCU: Architecture of FC4150
Automotive-Grade MCU: Architecture of FC7240
Automotive-Grade MCU (High-End): Parameters of FC7300
Automotive-Grade MCU (High-End): FC7300F8MDQ Is Benchmarked against Infineon TC387
Automotive-Grade MCU (High-End): Architecture of FC7300F8MDT
Automotive-Grade MCU Application Case: Localized T-BOX Solution
Automotive-Grade MCU Application Case: Automotive Electric Air Conditioning Compressor
5.16 Cmsemicon
Automotive-Grade MCU Product Line
Automotive-Grade MCU: BAT32A
Automotive-Grade MCU: Parameters of BAT32A337
Automotive-Grade MCU: Performance of BAT32A2
5.17 HPMicro Semiconductor
Automotive-Grade MCU Product Line Layout
Automotive-Grade MCU: Architecture of HPM6800
Automotive-Grade MCU: Parameters of HPM6800
Automotive-Grade MCU: Architecture of HPM5300
Automotive-Grade MCU Application: HPM6750-based Automotive Cluster
Automotive-Grade MCU Application: HPM6800-based Automotive Cluster
5.18 ChipEXT
Automotive-Grade MCU Roadmap
Automotive-Grade MCU Series
Automotive-Grade MCU: Architecture of CX3288
Automotive-Grade MCU: Information and Cybersecurity of CX3288
Automotive-Grade MCU: Architecture of AUTOSAR
5.19 Linko Semiconductor
Automotive-Grade MCU Product Line Layout
New Automotive-Grade MCU: LKS (AT075)
New Automotive-Grade MCU: LKS (AT037)
Automotive-Grade MCU: Parameters of LKS (AT08X)
Automotive-Grade MCU Application: Automotive Solution based on LKS32AT075
Automotive-Grade MCU Application: Electronic Expansion Valve Based on AT039
Automotive-Grade MCU Application: Automotive Air Conditioning Compressor Based on LKS32MCAT085C8Q9
Automotive-Grade MCU Application: Automotive Water Pump, Oil Pump and Ventilation Fan Based on LKS32MCAT086N8Q9
5.20 OmniVision Group
Automotive-Grade MCU Product Line
Automotive-Grade MCU: Next-Generation High-Performance OMX2xx MCU - OMX2x4B
Automotive-Grade MCU: Competitive Advantages of OMX2x4B
Automotive-Grade MCU: OMX14xN Product Line
Automotive-Grade MCU: Architecture of OMX14xN
Automotive-Grade MCU: Architecture of OMX14xB
Automotive-Grade MCU: Obvious Advantages Compared with Foreign Competitors
5.21 Silergy
Automotive-Grade MCU Product Line
Automotive-Grade MCU: SA32B
Automotive-Grade MCU: Architecture of SA32B
Automotive-Grade MCU Ecosystem: Automotive-Grade SDK
5.22 Megawin Technology
Automotive MCU Product Line
Automotive MCU (High Cost Performance): MG82F6D17
Automotive MCU (Advanced M0): MG32F02x
Automotive MCU (Automotive-Grade): MGEQ1C064
5.23 Tongxin Microelectronics
Automotive Chip Planning
Automotive-Grade MCU Product Line Planning
Automotive-Grade MCU Product Line
Automotive-Grade MCU: The Second-Generation MCU Fully Covers Powertrain Applications
Automotive-Grade MCU: Hardware Security Mechanism
5.24 STAR GATHER
Automotive-Grade Chip
Central + Domain Control Solution
5.25 Chipways
Automotive-Grade MCU Product Line
Automotive-Grade MCU: XL660
Automotive-Grade MCU: Software Architecture of XL660x
5.26 ESWIN
Automotive-Grade MCU Product Line
5.27 Thinktech
Automotive-Grade MCU Product Line
Alioth MCU Process Evolution
Alioth MCU with High Functional Safety: Chassis Control Chip - TTA8T8X

6 Foreign Automotive MCU Vendors

6.1 Renesas
Automotive-Grade MCU Application Covers Body, Powertrain, Chassis and Other Fields
Automotive-Grade MCU Product Line (1)
Automotive-Grade MCU Product Line (2)
Automotive-Grade MCU Product Line (3)
Latest Technological Breakthrough of Automotive-Grade MCU
Latest Technological Breakthrough of Automotive-Grade MCU: Higher Computing Power
Automotive-Grade Integrated MCU: Fifth-Generation R-Car
Automotive-Grade Integrated MCU: Fifth-generation R-Car X5H SoC Integrates MCU
Automotive-Grade Integrated MCU: Application Architecture of Fourth-Generation R-Car
Automotive-Grade MCU (High-End): Segmented Products of RH850
Automotive-Grade MCU (High-End): Product Selection of RH850
Automotive-Grade MCU (High-End): Technology Evolution Roadmap of RH850 F
Automotive-Grade MCU (High-End): Expanded Product Line of RH850 F
Automotive-Grade MCU (High-End): Software Support of RH850 - Hetion Software's ISDT Successfully Adapts to RH850
Automotive-Grade MCU (High-End): Software Support of RH850 - IAR's Cloud-Ready Platform Extends Support for RH850/U2x
Automotive-Grade MCU (High-End): Architecture of RH850/P
Automotive-Grade MCU (Entry-Level): RL78
Automotive-Grade MCU (Entry-Level): Architecture of RL78
Automotive-Grade MCU Application: Low-Cost Cockpit Cluster Based on RH850/D1x
Automotive-Grade MCU Application: Domain Control Based on RH850/U2x
Automotive-Grade MCU Application: Automotive Gateway
Automotive-Grade MCU Application: Digital Power Supply Solution Based on RL78/G24
6.2 NXP
Automotive-Grade MCU Product Line Layout
NeuSAR OS-based CoreRide Z248 ZCU System Solution in Cooperation with Neusoft Reach
Automotive-Grade MCU: S32N7 (HPC + Deep AI Integration)
Automotive-Grade MCU: Architecture of S32N7 (HPC + Deep AI Integration)
Automotive-Grade MCU: Launch of the First Automotive-Grade MCU for Bluetooth Channel Detection
Automotive-Grade MCU: S32G
Automotive-Grade MCU: S32G2
Automotive-Grade MCU: Architecture of S32G
Automotive-Grade MCU: S32Z/S32E Product Line
Automotive-Grade MCU: S32Z/S32E Application
Automotive-Grade MCU: Software Architecture of S32E2
Automotive-Grade MCU: Application Framework of S32E2
Automotive-Grade MCU: Evolution of S32K
Automotive-Grade MCU: Release of the First 16nm Automotive-grade MCU - S32K5
Launch of S32 CoreRide Platform for Software-Defined Vehicles
Launch of S32 CoreRide Platform
Automotive-Grade MCU Application: Thermal Management Domain Control Solution Based on FS32K146
Automotive-Grade MCU Application: Powertrain Domain Reference Design Solution Based on S32E (1)
Automotive-Grade MCU Application: Powertrain Domain Reference Design Solution Based on S32E (2)
Automotive-Grade MCU Application: Powertrain Domain Reference Design Solution Based on S32E (7)
Automotive-Grade MCU Application: Powertrain Domain Reference Design Solution Based on S32E (8)
Automotive-Grade MCU Application: Powertrain Domain Reference Design Solution Based on S32E (9)
Automotive-Grade MCU production base
6.3 STMicroelectronics (ST)
Automotive MCU Investment Plan
Automotive-Grade MCU Product Line (1)
Automotive-Grade MCU Product Line (2)
Automotive-Grade MCU: 18nm FD-SOI-based Automotive-Grade STM32 MCU in Cooperation with Samsung
Automotive-Grade MCU: STM32
Automotive-Grade MCU: Localized Supply Chain of STM32
Automotive-Grade MCU: STM32 Adopts PCM Technology
Automotive-Grade MCU: STM32 Is Upgraded to M85
Automotive-Grade MCU: Stellar Series Products
Automotive-Grade MCU: Architecture of Stellar G
Automotive-Grade MCU: Performance of Stellar P
Automotive-Grade MCU: Framework Diagram of Stellar P6
Automotive-Grade MCU: Framework Diagram of Stellar P7
Automotive-Grade MCU: Stellar E
Automotive-Grade MCU: SPC5 Series Products
Automotive-Grade MCU: Parameters of SPC5 (1)
Automotive-Grade MCU: Parameters of SPC5 (2)
Automotive-Grade MCU: Architecture of SPC56 A and M
Automotive-Grade MCU Ecosystem Partners
Automotive MCU Production Advantage: Integrated Device Manufacturers (IDMs)
Automotive MCU Industry Chain Layout: Launch of Cost-Effective PMIC for Automotive MCU
Automotive MCU Layout in Chinese Market
Automotive MCU Layout in Chinese Market: Localized Products
6.4 Infineon
Automotive-Grade MCU Application Fields by Product Line
Automotive-Grade MCU Product Line (1)
Automotive-Grade MCU Product Line (2)
Automotive-Grade MCU: Core Technology Evolution of AURIX
Automotive-Grade MCU: Performance of AURIX TC4x
Automotive-Grade MCU: Architecture of AURIX TC4x
Automotive-Grade MCU: AURIX TC4x Introduces PPU (1)
Automotive-Grade MCU: AURIX TC4x Introduces PPU (2)
Automotive-Grade MCU: AI Performance of AURIX TC4x
Automotive-Grade MCU: Security of AURIX TC4x
Automotive-Grade MCU: Virtualization of AURIX TC4x
Automotive-Grade MCU: Ecosystem of AURIX TC4x
Automotive-Grade MCU: AURIX TC4x Supports AUTOSAR
Automotive-Grade MCU: AURIX TC3 Is Primarily Used as Safety Backup
Automotive-Grade MCU: Architecture of AURIX TC397
Automotive-Grade MCU: Traveo II
Automotive-Grade MCU: Key Parameters of Traveo T2G
Automotive-Grade MCU: Traveo T2G Seamlessly Integrates with Kanzi Micro
Automotive-Grade MCU Integrated into SOC: MOTIX MCU Motor Control SoCs and SiPs
Automotive-Grade MCU: CYT3DL
Automotive-Grade MCU: PSOC Control C3
Automotive-Grade MCU: PSoC 4
Automotive-Grade MCU Application: Traveo CYT3DL’s 10,000-pixel Intelligent Lighting Help Revolutionize Automotive Lighting
Automotive-Grade MCU Application: EPS Based on Aurix MCU
Technical Advantage of Automotive-Grade MCU: Self-Developed TriCore Architecture
Automotive-Grade MCU Technology Strategy: From TriCore to RISC-V
Automotive-Grade MCU Technology Strategy: Launch of RISC-V Hypervisor Prototype
Automotive-Grade MCU Technology Strategy: RISC-V Ecosystem Evolution Plan
6.5 TI
Automotive-Grade MCU Product Line Layout (1)
Automotive-Grade MCU Product Line Layout (2)
Automotive-Grade MCU: Automotive-Grade MCU Certified by Bluetooth Core 6.0 Channel Sounding
Automotive-Grade MCU: Evolution of C2000
Automotive-Grade MCU: C2000 Is Upgraded to 64-bit
Automotive-Grade MCU: C2000 Has a Complete Ecosystem
Automotive-Grade MCU: TMS320F28P55x (New Product of C2000) Realizes Edge AI and Real-Time Control for the First Time
Automotive-Grade MCU: C2000 Becomes the Reference Standard for Other Companies to Build MCUs for Real-Time Control
Automotive-Grade MCU: TMS320F28P55x Effectively Reduces Cost
Automotive-Grade MCU: F29H85x Adopts Innovative VLIW Core Architecture
Automotive-Grade MCU: Application Scenarios of F29H85x
Automotive-Grade MCU: Sitara AM2x
Automotive-Grade MCU: Sitara AM2x Integrates the Features of MPU and MCU
Automotive-Grade MCU Applications: Jacinto SOC Integrates MCU
Automotive-Grade MCU Application: Difference between Jacinto Integrated with MCU and Traditional Plug-in MCU
Automotive-Grade MCU Application Case: BYD's All-in-One Controller
Production Base: Seeking Wafer Foundries in Chinese Mainland
6.6 Microchip
Automotive-Grade MCU Product Line Layout
Automotive-Grade MCU (16-bit): Product Family
Automotive-Grade MCU (32-bit): Product Family
Automotive-Grade MCU (32-bit): PIC32-BZ6 Supports Bluetooth 6.0
Automotive-Grade MCU (32-bit): Latest PIC33A DSC
Automotive-Grade MCU (32-bit): Architecture of SAMDA1
Automotive-Grade MCU (32-bit): Architecture of SAMV70
Automotive-Grade MCU Ecosystem Toolchain